Electronic module housing

- Aptiv Technologies AG
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Description

FIG. 1 is a left side perspective view of an electronic module housing showing the design; and,

FIG. 2 is a top plan view of the electronic module housing of FIG. 1.

The broken lines shown represent unclaimed subject matter and form no part of the claimed design.

The relatively light and thin shade lines show contour and not surface decoration.

The portion of the article that is not illustrated in the Figures is not claimed.

Claims

We claim the ornamental design for an electronic module housing, as shown and described.

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Patent History
Patent number: D1042447
Type: Grant
Filed: Jun 29, 2021
Date of Patent: Sep 17, 2024
Assignee: Aptiv Technologies AG (Schaffhausen)
Inventors: Timothy Alan Suda (Avon, IN), Tobias Richter-Brockmann (Düsseldorf)
Primary Examiner: Marie D. Fast Horse
Application Number: 29/797,215