Abstract: A laser machining system is used to precision laser drill holes in an elastomeric material, preferably silicone rubber, to form holes to support miniature electronic components temporarily while they are being processed or tested. The holes are formed by directing laser pulses from a laser to a top surface of the elastomeric material in a plurality of passes in a direction proceeding from a non-zero inner diameter to the desired diameter or from the desired diameter to the inner diameter. The plurality of passes forms a first pattern such that a successive pass of the plurality of passes overlaps a previous pass of the plurality of passes. The first pattern is repeated without changing direction or the first pattern is repeated while reversing the direction until the hole is formed through a bottom surface of the elastomeric material.

Abstract: A laser machining system is used to precision laser drill holes in an elastomeric material, preferably silicone rubber, to form holes to support miniature electronic components temporarily while they are being processed or tested. The holes are formed by directing laser pulses from a laser to a top surface of the elastomeric material in a plurality of passes in a direction proceeding from a non-zero inner diameter to the desired diameter or from the desired diameter to the inner diameter. The plurality of passes forms a first pattern such that a successive pass of the plurality of passes overlaps a previous pass of the plurality of passes. The first pattern is repeated without changing direction or the first pattern is repeated while reversing the direction until the hole is formed through a bottom surface of the elastomeric material.

Abstract: A carrier plate for supporting electronic components during processing includes hexagonally-arranged holes for supporting the components. Walls of the holes comprise a gripping resilient material. The hexagonal arrangement provides a strong carrier that improves production yield through an increase in per batch processing and improved locational accuracy over conventional carriers.

Abstract: A carrier plate for supporting electronic components during processing includes hexagonally-arranged holes for supporting the components. Walls of the holes comprise a gripping resilient material. The hexagonal arrangement provides a strong carrier that improves production yield through an increase in per batch processing and improved locational accuracy over conventional carriers.

Abstract: A carrier plate for supporting electronic components during processing includes hexagonally-arranged holes for supporting the components. Walls of the holes comprise a gripping resilient material. The hexagonal arrangement provides a strong carrier that improves production yield through an increase in per batch processing and improved locational accuracy over conventional carriers.

Abstract: An acoustic emission waveguide (10) for holding a test sample (29) in a hostile environment and guiding ultrasonic waves to a transducer (34) disposed in a non-hostile environment. The waveguide (10) includes a flattened test sample attachment end (15) having a flat bar clamp (22) to hold test specimens (29) thereto. The transducer attachment end (17) includes a clamp (32) which holds the transducer (34) firmly against the waveguide end (17) and against a threaded nut (30) which increases the surface area of the end (17) of the waveguide, such that enhanced acoustic transmission to the transducer (34) is achieved. A couplant grease is utilized in the test sample clamp (20) and in the transducer attachment clamp (32) to enhance the transmission of acoustic energy from the test sample (29) to the waveguide rod (12) and from the rod (12) to the transducer (34).