Abstract: A shield can assembly is described. In one or more implementations, a frame is installed on a printed circuit board (PCB) by using a cross-bar connected to opposing sides of the frame to place the frame on the PCB. Subsequent to installation of the frame on the PCB, the cross-bar is removed from the frame. Once the cross-bar is removed, one or more flexible printed circuits (FPCs) are installed on the PCB. Then, a lid is connected to the frame to from a shield can over the FPCs.

Abstract: The description relates to devices, such as computing devices that can include dimensionally-constrained shielded circuit board assemblies. One example can include a circuit board that includes an upwardly extending fence. The example can also include a heat generating component positioned within the fence and a thermal module defining a major planar surface positioned over the heat generating component. The thermal module can include a downwardly extending frame that overlaps with the fence. The gasket can be compressed between the fence and the frame in a direction parallel to the major planar surface.

Abstract: The description relates to devices, such as computing devices that can include dimensionally-constrained shielded circuit board assemblies. One example can include a circuit board that includes an upwardly extending fence. The example can also include a heat generating component positioned within the fence and a thermal module defining a major planar surface positioned over the heat generating component. The thermal module can include a downwardly extending frame that overlaps with the fence. The gasket can be compressed between the fence and the frame in a direction parallel to the major planar surface.

Abstract: Examples are disclosed that relate to PCB-based connectors and connector frames for a PCB. In one example, a connector frame comprises a cavity configured to house the PCB, the cavity defined at least partially by a first sidewall, a second sidewall opposite to the first sidewall, and an end wall extending between the first sidewall and the second sidewall. A support surface is adjacent to the cavity on a top side of the connector frame and extends between the first sidewall and the second sidewall. An aperture on the top side of the connector frame is formed at least partially by an edge of the support surface, with the aperture exposing a portion of the cavity through the top side.

Abstract: Examples are disclosed that relate to PCB-based connectors and connector frames for a PCB. In one example, a connector frame comprises a cavity configured to house the PCB, the cavity defined at least partially by a first sidewall, a second sidewall opposite to the first sidewall, and an end wall extending between the first sidewall and the second sidewall. A support surface is adjacent to the cavity on a top side of the connector frame and extends between the first sidewall and the second sidewall. An aperture on the top side of the connector frame is formed at least partially by an edge of the support surface, with the aperture exposing a portion of the cavity through the top side.

Abstract: A shield can assembly is described. In one or more implementations, a frame is installed on a printed circuit board (PCB) by using a cross-bar connected to opposing sides of the frame to place the frame on the PCB. Subsequent to installation of the frame on the PCB, the cross-bar is removed from the frame. Once the cross-bar is removed, one or more flexible printed circuits (FPCs) are installed on the PCB. Then, a lid is connected to the frame to from a shield can over the FPCs.

Abstract: A shield can assembly is described. In one or more implementations, a frame is installed on a printed circuit board (PCB) by using a cross-bar connected to opposing sides of the frame to place the frame on the PCB. Subsequent to installation of the frame on the PCB, the cross-bar is removed from the frame. Once the cross-bar is removed, one or more flexible printed circuits (FPCs) are installed on the PCB. Then, a lid is connected to the frame to from a shield can over the FPCs.

Abstract: The trackpad assemblies described herein maintain minimum overall stiffness, weight, and cost requirements of a trackpad assembly, while permitting a decrease in trackpad assembly thickness as compared to conventional trackpad assemblies. The trackpad assemblies may include one or more of a four-layer PCB, structural adhesives, a structural PCB stiffener, and a structural shield assembly. These stiffening features permit increasingly thinner trackpad assemblies and associated computing devices.

Abstract: A floating connector assembly device is provided. An electronic component is mounted directly or indirectly to a chassis of an electronic device. At least one conductive contact spring is mounted to the electronic component and configured to electrically couple to the electronic component. A printed circuit board having a fixed end and a free end with an electrical contact positioned between the two ends is positioned against the conductive contact spring, the contact spring being biased so that a contacting portion of the contact spring contacts the electrical contact to form an electrical connection. The electrical connection is maintained during relative movement of the conductive contact spring and the electrical contact of the printed circuit board by a bias force of the conductive contact spring.

Abstract: The trackpad assemblies described herein maintain minimum overall stiffness, weight, and cost requirements of a trackpad assembly, while permitting a decrease in trackpad assembly thickness as compared to conventional trackpad assemblies. The trackpad assemblies may include one or more of a four-layer PCB, structural adhesives, a structural PCB stiffener, and a structural shield assembly. These stiffening features permit increasingly thinner trackpad assemblies and associated computing devices.

Abstract: A floating connector assembly device is provided. An electronic component is mounted directly or indirectly to a chassis of an electronic device. At least one conductive contact spring is mounted to the electronic component and configured to electrically couple to the electronic component. A printed circuit board having a fixed end and a free end with an electrical contact positioned between the two ends is positioned against the conductive contact spring, the contact spring being biased so that a contacting portion of the contact spring contacts the electrical contact to form an electrical connection. The electrical connection is maintained during relative movement of the conductive contact spring and the electrical contact of the printed circuit board by a bias force of the conductive contact spring.

Abstract: Flexible hinge spine techniques are described. In one or more implementations, a flexible hinge is configured to communicatively and physically couple an input device to a computing device and may implement functionality such as a support layer and minimum bend radius. The input device may also include functionality to promote a secure physical connection between the input device and the computing device. One example of this includes use of one or more protrusions that are configured to be removed from respective cavities of the computing device along a particular axis but mechanically bind along other axes. Other techniques include use of a laminate structure to form a connection portion of the input device.

Abstract: Flexible hinge and removable attachment techniques are described. In one or more implementations, a flexible hinge is configured to communicatively and physically couple an input device to a computing device and may implement functionality such as a support layer and minimum bend radius. The input device may also include functionality to promote a secure physical connection between the input device and the computing device. One example of this includes use of one or more protrusions that are configured to be removed from respective cavities of the computing device along a particular axis but mechanically bind along other axes. Other techniques include use of a laminate structure to form a connection portion of the input device.

Abstract: Flexible hinge spine techniques are described. In one or more implementations, a flexible hinge is configured to communicatively and physically couple an input device to a computing device and may implement functionality such as a support layer and minimum bend radius. The input device may also include functionality to promote a secure physical connection between the input device and the computing device. One example of this includes use of one or more protrusions that are configured to be removed from respective cavities of the computing device along a particular axis but mechanically bind along other axes. Other techniques include use of a laminate structure to form a connection portion of the input device.

Abstract: Flexible hinge spine techniques are described. In one or more implementations, a flexible hinge is configured to communicatively and physically couple an input device to a computing device and may implement functionality such as a support layer and minimum bend radius. The input device may also include functionality to promote a secure physical connection between the input device and the computing device. One example of this includes use of one or more protrusions that are configured to be removed from respective cavities of the computing device along a particular axis but mechanically bind along other axes. Other techniques include use of a laminate structure to form a connection portion of the input device.

Abstract: Input device adhesive techniques are described. A pressure sensitive key includes a sensor substrate having one or more conductors, a spacer layer, and a flexible contact layer. The spacer layer is disposed proximal to the sensor substrate and has at least one opening. The flexible contact layer is spaced apart from the sensor substrate by the spacer layer and configured to flex through the opening in response to an applied pressure to initiate an input. The flexible contact layer is secured to the spacer layer such that at first edge, the flexible contact layer is secured to the spacer layer at an approximate midpoint of the first edge and is not secured to the spacer along another portion of the first edge and at a second edge, the flexible contact layer is not secured to the spacer layer along an approximate midpoint of the second edge.

Abstract: Input device adhesive techniques are described. A pressure sensitive key includes a sensor substrate having one or more conductors, a spacer layer, and a flexible contact layer. The spacer layer is disposed proximal to the sensor substrate and has at least one opening. The flexible contact layer is spaced apart from the sensor substrate by the spacer layer and configured to flex through the opening in response to an applied pressure to initiate an input. The flexible contact layer is secured to the spacer layer such that at first edge, the flexible contact layer is secured to the spacer layer at an approximate midpoint of the first edge and is not secured to the spacer along another portion of the first edge and at a second edge, the flexible contact layer is not secured to the spacer layer along an approximate midpoint of the second edge.

Abstract: A shield can assembly is described. In one or more implementations, a frame is installed on a printed circuit board (PCB) by using a cross-bar connected to opposing sides of the frame to place the frame on the PCB. Subsequent to installation of the frame on the PCB, the cross-bar is removed from the frame. Once the cross-bar is removed, one or more flexible printed circuits (FPCs) are installed on the PCB. Then, a lid is connected to the frame to from a shield can over the FPCs.

Abstract: Flexible hinge and removable attachment techniques are described. In one or more implementations, a flexible hinge is configured to communicatively and physically couple an input device to a computing device and may implement functionality such as a support layer and minimum bend radius. The input device may also include functionality to promote a secure physical connection between the input device and the computing device. One example of this includes use of one or more protrusions that are configured to be removed from respective cavities of the computing device along a particular axis but mechanically bind along other axes. Other techniques include use of a laminate structure to form a connection portion of the input device.

Abstract: Flexible hinge and removable attachment techniques are described. In one or more implementations, a flexible hinge is configured to communicatively and physically couple an input device to a computing device and may implement functionality such as a support layer and minimum bend radius. The input device may also include functionality to promote a secure physical connection between the input device and the computing device. One example of this includes use of one or more protrusions that are configured to be removed from respective cavities of the computing device along a particular axis but mechanically bind along other axes. Other techniques include use of a laminate structure to form a connection portion of the input device.