Patents by Inventor Todd M Dunford
Todd M Dunford has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11959880Abstract: System and method for characterizing material condition. The system includes a sensor, impedance instrument and processing unit to collect measurements and assess material properties. A model of the system may be used to enable accurate measurements of multiple material properties. A cylindrical model for an electromagnetic field sensor is disclosed for modeling substantially cylindrically symmetric material systems. Sensor designs and data processing approaches are provided to focus the sensitivity of the sensor to localize material conditions. Improved calibration methods are shown. Sizing algorithms are provided to estimate the size of defects such as cracks and corrosion. Corrective measures are provided where the actual material configuration differs from the data processing assumptions. Methods are provided for use of the system to characterize material condition, and detailed illustration is given for corrosion, stress, weld, heat treat, and mechanical damage assessment.Type: GrantFiled: August 16, 2021Date of Patent: April 16, 2024Assignee: JENTEK Sensors, Inc.Inventors: Scott A Denenberg, Yanko K Sheiretov, Neil J Goldfine, Todd M Dunford, Andrew P Washabaugh, Don Straney, Brian L Manning
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Publication number: 20230408449Abstract: Disclose is a system and method for real-time measurement and feedback of metrology and metallurgical data during additive manufacturing (AM) part fabrication. This solution promises to provide higher performance, lower cost AM parts. A sensor is placed either in the rake/roller or following the rake/roller so that it has no impact on the process efficiency and can be used to provide real-time feedback and an archived digital map of the entire part volume. The solution provides non-contact sensing of AM layer's electrical conductivity in a high-temperature environment, metallurgical property verification, porosity imaging, local defect detection and sizing, local material temperature monitoring, and grain anisotropy imaging. Part geometry, the AM powder, and the laser/material interface are monitored in real-time. Dual mode sensing using magnetoquasistatic and optical sensors enhance results. Real-time nonlinear control of the AM fabrication process is performed based on the sensor data.Type: ApplicationFiled: September 1, 2023Publication date: December 21, 2023Applicant: JENTEK Sensors, Inc.Inventors: Neil J Goldfine, Todd M Dunford
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Patent number: 11841245Abstract: A measurement system, its assembly and use are disclose. The system may include an instrument for making sensor measurements. The instrument has a substantially cylindrical housing. The shape and size allow the instrument to easily fit in an average hand enabling handheld operation. The housing houses a board stack of electronic boards. These electronics drive an electrical signal in at least one drive channel and measure responses from at least two sensing channels. These responses are provided to a processor for analysis. The instrument has a sensor connector that enables simultaneous electrical and mechanical attachment of an end effector.Type: GrantFiled: January 6, 2023Date of Patent: December 12, 2023Assignee: JENTEK Sensors, Inc.Inventors: Neil J Goldfine, Todd M Dunford, Scott A Denenberg, Kevin P Dixon, Yanko K Sheiretov, Saber Bahranifard, Stuart D Chaplan, Mark Windoloski
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Patent number: 11802851Abstract: Disclosed are method and apparatus for measuring material properties. Segmented field sensors have multiple sensing elements at different spatial geometries to capture field components having substantially different depths of penetration. These sensors are excited and measured on these different sensing elements to facilitate characterization of unknown material properties. This is illustrated in some embodiments using eddy current sensors to characterize materials that are frequency dispersive and/or do not produce a measurable phase shifts. Only a single scalar quantity may provide independent information from one or more of the sensing elements. Property estimation techniques, such as those using precomputed databases of sensor responses are used to estimate the unknown material properties.Type: GrantFiled: March 1, 2022Date of Patent: October 31, 2023Assignee: JENTEK Sensors, Inc.Inventors: Neil J. Goldfine, Andrew P. Washabaugh, Todd M. Dunford, Zachary M. Thomas
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Patent number: 11747304Abstract: Disclose is a system and method for real-time measurement and feedback of metrology and metallurgical data during additive manufacturing (AM) part fabrication. This solution promises to provide higher performance, lower cost AM parts. A sensor is placed either in the rake/roller or following the rake/roller so that it has no impact on the process efficiency and can be used to provide real-time feedback and an archived digital map of the entire part volume. The solution provides non-contact sensing of AM layer's electrical conductivity in a high-temperature environment, metallurgical property verification, porosity imaging, local defect detection and sizing, local material temperature monitoring, and grain anisotropy imaging. Part geometry, the AM powder, and the laser/material interface are monitored in real-time. Dual mode sensing using magnetoquasistatic and optical sensors enhance results. Real-time nonlinear control of the AM fabrication process is performed based on the sensor data.Type: GrantFiled: January 2, 2023Date of Patent: September 5, 2023Assignee: JENTEK Sensors, Inc.Inventors: Neil J Goldfine, Todd M Dunford
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Publication number: 20230160728Abstract: A measurement system, its assembly and use are disclose. The system may include an instrument for making sensor measurements. The instrument has a substantially cylindrical housing. The shape and size allow the instrument to easily fit in an average hand enabling handheld operation. The housing houses a board stack of electronic boards. These electronics drive an electrical signal in at least one drive channel and measure responses from at least two sensing channels. These responses are provided to a processor for analysis. The instrument has a sensor connector that enables simultaneous electrical and mechanical attachment of an end effector.Type: ApplicationFiled: January 6, 2023Publication date: May 25, 2023Applicant: JENTEK Sensors, Inc.Inventors: Neil J Goldfine, Todd M Dunford, Scott A Denenberg, Kevin P Dixon, Yanko K Sheiretov, Saber Bahranifard, Stuart D Chaplan, Mark Windoloski
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Publication number: 20230152278Abstract: Disclose is a system and method for real-time measurement and feedback of metrology and metallurgical data during additive manufacturing (AM) part fabrication. This solution promises to provide higher performance, lower cost AM parts. A sensor is placed either in the rake/roller or following the rake/roller so that it has no impact on the process efficiency and can be used to provide real-time feedback and an archived digital map of the entire part volume. The solution provides non-contact sensing of AM layer's electrical conductivity in a high-temperature environment, metallurgical property verification, porosity imaging, local defect detection and sizing, local material temperature monitoring, and grain anisotropy imaging. Part geometry, the AM powder, and the laser/material interface are monitored in real-time. Dual mode sensing using magnetoquasistatic and optical sensors enhance results. Real-time nonlinear control of the AM fabrication process is performed based on the sensor data.Type: ApplicationFiled: January 2, 2023Publication date: May 18, 2023Applicant: JENTEK Sensors, Inc.Inventors: Neil J. Goldfine, Todd M. Dunford
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Publication number: 20230095662Abstract: Disclosed are method and apparatus for measuring material properties. Segmented field sensors have multiple sensing elements at different spatial geometries to capture field components having substantially different depths of penetration. These sensors are excited and measured on these different sensing elements to facilitate characterization of unknown material properties. This is illustrated in some embodiments using eddy current sensors to characterize materials that are frequency dispersive and/or do not produce a measurable phase shifts. Only a single scalar quantity may provide independent information from one or more of the sensing elements. Property estimation techniques, such as those using precomputed databases of sensor responses are used to estimate the unknown material properties.Type: ApplicationFiled: March 1, 2022Publication date: March 30, 2023Applicant: JENTEK Sensors, Inc.Inventors: Neil J. Goldfine, Andrew P. Washabaugh, Todd M. Dunford, Zachary M. Thomas
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Patent number: 11549831Abstract: A measurement system, its assembly and use are disclose. The system may include an instrument for making sensor measurements. The instrument has a substantially cylindrical housing. The shape and size allow the instrument to easily fit in an average hand enabling handheld operation. The housing houses a board stack of electronic boards. These electronics drive an electrical signal in at least one drive channel and measure responses from at least two sensing channels. These responses are provided to a processor for analysis. The instrument has a sensor connector that enables simultaneous electrical and mechanical attachment of an end effector.Type: GrantFiled: September 16, 2019Date of Patent: January 10, 2023Assignee: JENTEK Sensors, Inc.Inventors: Neil J Goldfine, Todd M Dunford, Scott A Denenberg, Kevin P Dixon, Yanko K Sheiretov, Saber Bahranifard, Stuart D Chaplan, Mark Windoloski
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Patent number: 11543388Abstract: Disclose is a system and method for real-time measurement and feedback of metrology and metallurgical data during additive manufacturing (AM) part fabrication. This solution promises to provide higher performance, lower cost AM parts. A sensor is placed either in the rake/roller or following the rake/roller so that it has no impact on the process efficiency and can be used to provide real-time feedback and an archived digital map of the entire part volume. The solution provides non-contact sensing of AM layer's electrical conductivity in a high-temperature environment, metallurgical property verification, porosity imaging, local defect detection and sizing, local material temperature monitoring, and grain anisotropy imaging. Part geometry, the AM powder, and the laser/material interface are monitored in real-time. Dual mode sensing using magnetoquasistatic and optical sensors enhance results. Real-time nonlinear control of the AM fabrication process is performed based on the sensor data.Type: GrantFiled: March 1, 2022Date of Patent: January 3, 2023Assignee: JENTEK Sensors, Inc.Inventors: Neil J Goldfine, Todd M Dunford
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Publication number: 20220412918Abstract: Eddy current sensing is governed by the diffusion equation of magnetoquasistatic fields. As such the eddy current sensor's proximity to the object to be inspected (i.e., “liftoff”) significantly affects the sensor's response signal. Methods and apparatus are disclosed for improving performance for an eddy current sensor, though they may also be used for other sensor types. These solutions are beneficial for both single channel eddy current sensors and arrays, and are particularly beneficial for measuring parts with complex surfaces. In some aspects improved performance is achieved by varying the stiffness of the mechanical support for the sensor. Some mechanical supports may exhibit anisotropic stiffness. After performing a scan with an eddy current array, a multi-channel shape filtering module is applied to improve defect detection. The module reduces the variability of defect response measured due to the unpredictability of the defect location transverse to the scan direction.Type: ApplicationFiled: September 5, 2022Publication date: December 29, 2022Applicant: JENTEK Sensors, Inc.Inventors: Neil J Goldfine, Mark Windoloski, Todd M Dunford
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Publication number: 20220373367Abstract: A measurement system, its assembly and use are disclose. The system may include an instrument for making sensor measurements. The instrument has a substantially cylindrical housing. The shape and size allow the instrument to easily fit in an average hand enabling handheld operation. The housing houses a board stack of electronic boards. These electronics drive an electrical signal in at least one drive channel and measure responses from at least two sensing channels. These responses are provided to a processor for analysis. The instrument has a sensor connector that enables simultaneous electrical and mechanical attachment of an end effector.Type: ApplicationFiled: September 16, 2019Publication date: November 24, 2022Applicant: JENTEK Sensors, Inc.Inventors: Neil J Goldfine, Todd M Dunford, Scott A Denenberg, Kevin P Dixon, Yanko K Sheiretov, Saber Bahranifard, Stuart D Chaplan, Mark Windoloski
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Patent number: 11435317Abstract: Eddy current sensing is governed by the diffusion equation of magnetoquasistatic fields. As such the eddy current sensor's proximity to the object to be inspected (i.e., “liftoff”) significantly affects the sensor's response signal. Methods and apparatus are disclosed for improving performance for an eddy current sensor, though they may also be used for other sensor types. These solutions are beneficial for both single channel eddy current sensors and arrays, and are particularly beneficial for measuring parts with complex surfaces. In some aspects improved performance is achieved by varying the stiffness of the mechanical support for the sensor. Some mechanical supports may exhibit anisotropic stiffness. After performing a scan with an eddy current array, a multi-channel shape filtering module is applied to improve defect detection. The module reduces the variability of defect response measured due to the unpredictability of the defect location transverse to the scan direction.Type: GrantFiled: April 9, 2019Date of Patent: September 6, 2022Assignee: JENTEK Sensors, Inc.Inventors: Neil J Goldfine, Todd M Dunford
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Publication number: 20220178877Abstract: Disclose is a system and method for real-time measurement and feedback of metrology and metallurgical data during additive manufacturing (AM) part fabrication. This solution promises to provide higher performance, lower cost AM parts. A sensor is placed either in the rake/roller or following the rake/roller so that it has no impact on the process efficiency and can be used to provide real-time feedback and an archived digital map of the entire part volume. The solution provides non-contact sensing of AM layer's electrical conductivity in a high-temperature environment, metallurgical property verification, porosity imaging, local defect detection and sizing, local material temperature monitoring, and grain anisotropy imaging. Part geometry, the AM powder, and the laser/material interface are monitored in real-time. Dual mode sensing using magnetoquasistatic and optical sensors enhance results. Real-time nonlinear control of the AM fabrication process is performed based on the sensor data.Type: ApplicationFiled: March 1, 2022Publication date: June 9, 2022Applicant: JENTEK Sensors, Inc.Inventors: Neil J Goldfine, Todd M Dunford
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Patent number: 11268931Abstract: Disclosed are method and apparatus for measuring material properties. Segmented field sensors have multiple sensing elements at different spatial geometries to capture field components having substantially different depths of penetration. These sensors are excited and measured on these different sensing elements to facilitate characterization of unknown material properties. This is illustrated in some embodiments using eddy current sensors to characterize materials that are frequency dispersive and/or do not produce a measurable phase shifts. Only a single scalar quantity may provide independent information from one or more of the sensing elements. Property estimation techniques, such as those using precomputed databases of sensor responses are used to estimate the unknown material properties.Type: GrantFiled: June 18, 2019Date of Patent: March 8, 2022Assignee: JENTEK Sensors, Inc.Inventors: Neil J Goldfine, Andrew P Washabaugh, Todd M Dunford, Zachary M Thomas
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Patent number: 11268933Abstract: Disclose is a system and method for real-time measurement and feedback of metrology and metallurgical data during additive manufacturing (AM) part fabrication. This solution promises to provide higher performance, lower cost AM parts. A sensor is placed either in the rake/roller or following the rake/roller so that it has no impact on the process efficiency and can be used to provide real-time feedback and an archived digital map of the entire part volume. The solution provides non-contact sensing of AM layer's electrical conductivity in a high-temperature environment, metallurgical property verification, porosity imaging, local defect detection and sizing, local material temperature monitoring, and grain anisotropy imaging. Part geometry, the AM powder, and the laser/material interface are monitored in real-time. Dual mode sensing using magnetoquasistatic and optical sensors enhance results. Real-time nonlinear control of the AM fabrication process is performed based on the sensor data.Type: GrantFiled: October 27, 2017Date of Patent: March 8, 2022Assignee: JENTEK SENSORS, INC.Inventors: Neil J. Goldfine, Todd M. Dunford
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Publication number: 20210372968Abstract: System and method for characterizing material condition. The system includes a sensor, impedance instrument and processing unit to collect measurements and assess material properties. A model of the system may be used to enable accurate measurements of multiple material properties. A cylindrical model for an electromagnetic field sensor is disclosed for modeling substantially cylindrically symmetric material systems. Sensor designs and data processing approaches are provided to focus the sensitivity of the sensor to localize material conditions. Improved calibration methods are shown. Sizing algorithms are provided to estimate the size of defects such as cracks and corrosion. Corrective measures are provided where the actual material configuration differs from the data processing assumptions. Methods are provided for use of the system to characterize material condition, and detailed illustration is given for corrosion, stress, weld, heat treat, and mechanical damage assessment.Type: ApplicationFiled: August 16, 2021Publication date: December 2, 2021Applicant: JENTEK Sensors, Inc.Inventors: Scott A. Denenberg, Yanko K. Sheiretov, Neil J. Goldfine, Todd M. Dunford, Andrew P. Washabaugh, Don Straney, Brian L. Manning
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Publication number: 20210080297Abstract: A measurement system, its assembly and use are disclose. The system may include an instrument for making sensor measurements. The instrument has a substantially cylindrical housing. The shape and size allow the instrument to easily fit in an average hand enabling handheld operation. The housing houses a board stack of electronic boards. These electronics drive an electrical signal in at least one drive channel and measure responses from at least two sensing channels. These responses are provided to a processor for analysis. The instrument has a sensor connector that enables simultaneous electrical and mechanical attachment of an end effector.Type: ApplicationFiled: September 16, 2019Publication date: March 18, 2021Applicant: JENTEK Sensors, Inc.Inventors: Neil J Goldfine, Todd M Dunford, Scott A Denenberg, Kevin P Dixon, Yanko K Sheiretov, Saber Bahranifard, Stuart D Chaplan, Mark Windoloski
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Publication number: 20210055262Abstract: Eddy current sensing is governed by the diffusion equation of magnetoquasistatic fields. As such the eddy current sensor's proximity to the object to be inspected (i.e., “liftoff”) significantly affects the sensor's response signal. Methods and apparatus are disclosed for improving performance for an eddy current sensor, though they may also be used for other sensor types. These solutions are beneficial for both single channel eddy current sensors and arrays, and are particularly beneficial for measuring parts with complex surfaces. In some aspects improved performance is achieved by varying the stiffness of the mechanical support for the sensor. Some mechanical supports may exhibit anisotropic stiffness. After performing a scan with an eddy current array, a multi-channel shape filtering module is applied to improve defect detection. The module reduces the variability of defect response measured due to the unpredictability of the defect location transverse to the scan direction.Type: ApplicationFiled: April 9, 2019Publication date: February 25, 2021Applicant: JENTEK Sensors, Inc.Inventors: Neil J Goldfine, Todd M Dunford
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Patent number: 10732096Abstract: Detection of corrosion and other defects in piping is needed to prevent catastrophic pipeline failure. Sensors, systems and methods are provided to enable detection of such defects. These apparatus and methods are configured to characterize pipe protected by insulation and conductive weather protection. The sensors may utilize inductive and/or solid state sensing element arrays operated in a magnetic field generated in part by a drive winding of the sensor. Multiple excitation frequencies are used to generate the magnetic field and record corresponding sensing element responses. Relatively high excitation frequencies may be used to estimate the properties of the weather protection and sensor lift-off while lower frequencies may be used to detect internal and external pipe damage. Linear arrays may be moved to generate damage images of the pipe providing size and location information for defects. Two dimensional sensor arrays may be used to provide imaging without moving the sensor.Type: GrantFiled: November 16, 2017Date of Patent: August 4, 2020Assignee: JENTEK Sensors, Inc.Inventors: Scott A. Denenberg, Todd M. Dunford, Neil J. Goldfine, Yanko K. Sheiretov