Patents by Inventor Todd M Dunford

Todd M Dunford has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10677756
    Abstract: A sensor system has an integrated sensor cartridge, and instrument, and an instrument side connector. The integrated sensor cartridge has a mechanical support, a flexible sensor array, and a rigid connector. The mechanical support is shaped to facilitate sensor measurements on a test object. The rigid connector has a mechanical connection and an electrical connection for simultaneous electrical and mechanical mating of the sensor cartridge to the instrument side connector. The flexible array has a connecting portion, a lead portion, and a sensing portion. The sensing portion is attached to the mechanical support, and the connecting portion interfaces with the rigid connector. The connecting portion may form the electrical connection of the rigid connector or may simply mate internally with the electrical connection. The instrument side connector is connected to the instrument which measures the response of the flexible sensor array.
    Type: Grant
    Filed: May 31, 2016
    Date of Patent: June 9, 2020
    Assignee: JENTEK SENSORS, INC.
    Inventors: Neil J Goldfine, Yanko K Sheiretov, Scott A Denenberg, Karen Walrath, Todd M Dunford, Kevin P Dixon, Christopher T Martin
  • Publication number: 20190383771
    Abstract: Disclosed are method and apparatus for measuring material properties. Segmented field sensors have multiple sensing elements at different spatial geometries to capture field components having substantially different depths of penetration. These sensors are excited and measured on these different sensing elements to facilitate characterization of unknown material properties. This is illustrated in some embodiments using eddy current sensors to characterize materials that are frequency dispersive and/or do not produce a measurable phase shifts. Only a single scalar quantity may provide independent information from one or more of the sensing elements. Property estimation techniques, such as those using precomputed databases of sensor responses are used to estimate the unknown material properties.
    Type: Application
    Filed: June 18, 2019
    Publication date: December 19, 2019
    Applicant: JENTEK Sensors, Inc.
    Inventors: Neil J. Goldfine, Andrew P. Washabaugh, Todd M. Dunford, Zachary M. Thomas
  • Patent number: 10416118
    Abstract: A measurement system, its assembly and use are disclose. The system may include an instrument for making sensor measurements. The instrument has a substantially cylindrical housing. The shape and size allow the instrument to easily fit in an average hand enabling handheld operation. The housing houses a board stack of electronic boards. These electronics drive an electrical signal in at least one drive channel and measure responses from at least two sensing channels. These responses are provided to a processor for analysis. The instrument has a sensor connector that enables simultaneous electrical and mechanical attachment of an end effector.
    Type: Grant
    Filed: May 12, 2017
    Date of Patent: September 17, 2019
    Assignee: JENTEK Sensors, Inc.
    Inventors: Neil J Goldfine, Todd M Dunford, Scott A Denenberg, Kevin P Dixon, Yanko K Sheiretov, Saber Bahranifard, Stuart D Chaplan, Mark D Windoloski
  • Publication number: 20180264590
    Abstract: A sensor is provided near an additive manufacturing (AM) part during fabrication to provide information about the condition of the additive material during fabrication. Sensor measurements are used for in situ monitoring and control of the AM system. By placing a sensor at this location, information at or near this location may be collected and then analyzed to determine if the AM process is proceeding acceptably, or if real-time modifications to the process should be made to improve the performance of the process. Conditions monitored by the sensor may include the melt pool dimensions, the temperature ahead of and at the melt pool, properties of the powder bed such as temperature and particle size distribution, local powder conditions, prior layer condition, and applied layer condition behind the laser. A control system uses these monitored conditions to adjust and control the ongoing AM fabrication process.
    Type: Application
    Filed: March 15, 2018
    Publication date: September 20, 2018
    Applicant: JENTEK Sensors, Inc.
    Inventors: Neil J. Goldfine, Zachary M. Thomas, Todd M. Dunford
  • Publication number: 20180209894
    Abstract: Detection of corrosion and other defects in piping is needed to prevent catastrophic pipeline failure. Sensors, systems and methods are provided to enable detection of such defects. These apparatus and methods are configured to characterize pipe protected by insulation and conductive weather protection. The sensors may utilize inductive and/or solid state sensing element arrays operated in a magnetic field generated in part by a drive winding of the sensor. Multiple excitation frequencies are used to generate the magnetic field and record corresponding sensing element responses. Relatively high excitation frequencies may be used to estimate the properties of the weather protection and sensor lift-off while lower frequencies may be used to detect internal and external pipe damage. Linear arrays may be moved to generate damage images of the pipe providing size and location information for defects. Two dimensional sensor arrays may be used to provide imaging without moving the sensor.
    Type: Application
    Filed: November 16, 2017
    Publication date: July 26, 2018
    Inventors: Scott A. Denenberg, Todd M. Dunford, Neil J. Goldfine, Yanko K. Sheiretov
  • Publication number: 20180120260
    Abstract: Disclose is a system and method for real-time measurement and feedback of metrology and metallurgical data during additive manufacturing (AM) part fabrication. This solution promises to provide higher performance, lower cost AM parts. A sensor is placed either in the rake/roller or following the rake/roller so that it has no impact on the process efficiency and can be used to provide real-time feedback and an archived digital map of the entire part volume. The solution provides non-contact sensing of AM layer's electrical conductivity in a high-temperature environment, metallurgical property verification, porosity imaging, local defect detection and sizing, local material temperature monitoring, and grain anisotropy imaging. Part geometry, the AM powder, and the laser/material interface are monitored in real-time. Dual mode sensing using magnetoquasistatic and optical sensors enhance results. Real-time nonlinear control of the AM fabrication process is performed based on the sensor data.
    Type: Application
    Filed: October 27, 2017
    Publication date: May 3, 2018
    Inventors: Neil J. Goldfine, Todd M. Dunford
  • Patent number: 9823179
    Abstract: Detection of corrosion and other defects in piping is needed to prevent catastrophic pipeline failure. Sensors, systems and methods are provided to enable detection of such defects. These apparatus and methods are configured to characterize pipe protected by insulation and conductive weather protection. The sensors may utilize inductive and/or solid state sensing element arrays operated in a magnetic field generated in part by a drive winding of the sensor. Multiple excitation frequencies are used to generate the magnetic field and record corresponding sensing element responses. Relatively high excitation frequencies may be used to estimate the properties of the weather protection and sensor lift-off while lower frequencies may be used to detect internal and external pipe damage. Linear arrays may be moved to generate damage images of the pipe providing size and location information for defects. Two dimensional sensor arrays may be used to provide imaging without moving the sensor.
    Type: Grant
    Filed: January 21, 2016
    Date of Patent: November 21, 2017
    Assignee: Jentek Sensors, Inc.
    Inventors: Scott A. Denenberg, Todd M. Dunford, Neil J. Goldfine, Yanko K. Sheiretov
  • Publication number: 20160349214
    Abstract: A sensor system has an integrated sensor cartridge, and instrument, and an instrument side connector. The integrated sensor cartridge has a mechanical support, a flexible sensor array, and a rigid connector. The mechanical support is shaped to facilitate sensor measurements on a test object. The rigid connector has a mechanical connection and an electrical connection for simultaneous electrical and mechanical mating of the sensor cartridge to the instrument side connector. The flexible array has a connecting portion, a lead portion, and a sensing portion. The sensing portion is attached to the mechanical support, and the connecting portion interfaces with the rigid connector. The connecting portion may form the electrical connection of the rigid connector or may simply mate internally with the electrical connection. The instrument side connector is connected to the instrument which measures the response of the flexible sensor array.
    Type: Application
    Filed: May 31, 2016
    Publication date: December 1, 2016
    Inventors: Neil J. Goldfine, Yanko K. Sheiretov, Scott A. Denenberg, Karen Walrath, Todd M. Dunford, Kevin P. Dixon, Christopher T. Martin
  • Publication number: 20160274060
    Abstract: System and method for characterizing material condition. The system includes a sensor, impedance instrument and processing unit to collect measurements and assess material properties. A model of the system may be used to enable accurate measurements of multiple material properties. A cylindrical model for an electromagnetic field sensor is disclosed for modeling substantially cylindrically symmetric material systems. Sensor designs and data processing approaches are provided to focus the sensitivity of the sensor to localize material conditions. Improved calibration methods are shown. Sizing algorithms are provided to estimate the size of defects such as cracks and corrosion. Corrective measures are provided where the actual material configuration differs from the data processing assumptions. Methods are provided for use of the system to characterize material condition, and detailed illustration is given for corrosion, stress, weld, heat treat, and mechanical damage assessment.
    Type: Application
    Filed: October 22, 2014
    Publication date: September 22, 2016
    Applicant: JENTEK Sensors, Inc.
    Inventors: Scott A Denenberg, Yanko K Sheiretov, Neil J Goldfine, Todd M Dunford, Andrew P Washabaugh, Don Straney, Brian L Manning
  • Publication number: 20160238514
    Abstract: Detection of corrosion and other defects in piping is needed to prevent catastrophic pipeline failure. Sensors, systems and methods are provided to enable detection of such defects. These apparatus and methods are configured to characterize pipe protected by insulation and conductive weather protection. The sensors may utilize inductive and/or solid state sensing element arrays operated in a magnetic field generated in part by a drive winding of the sensor. Multiple excitation frequencies are used to generate the magnetic field and record corresponding sensing element responses. Relatively high excitation frequencies may be used to estimate the properties of the weather protection and sensor lift-off while lower frequencies may be used to detect internal and external pipe damage. Linear arrays may be moved to generate damage images of the pipe providing size and location information for defects. Two dimensional sensor arrays may be used to provide imaging without moving the sensor.
    Type: Application
    Filed: January 21, 2016
    Publication date: August 18, 2016
    Inventors: Scott A. Denenberg, Todd M. Dunford, Neil J. Goldfine, Yanko K. Sheiretov
  • Patent number: 8960012
    Abstract: Yield stress is an important indicator of the strength of a component such as a pipe section. A method and apparatus for measuring yield stress of components made from magnetic materials is provided. The magnetic permeability of the material is recorded at multiple stress levels below yield establishing a permeability-stress relationship. The yield stress is then estimated as a function of the recorded permeability-stress relationship. The permeability stress relationship may be non-linear for a range of stress levels, achieving a peak permeability response for a stress below yield. The yield stress may be estimated as a multiple of the stress at which the peak permeability response is recorded.
    Type: Grant
    Filed: October 30, 2013
    Date of Patent: February 24, 2015
    Assignee: JENTEK Sensors, Inc.
    Inventors: Todd M. Dunford, Neil J. Goldfine, Shayan Haque
  • Publication number: 20140182389
    Abstract: Yield stress is an important indicator of the strength of a component such as a pipe section. A method and apparatus for measuring yield stress of components made from magnetic materials is provided. The magnetic permeability of the material is recorded at multiple stress levels below yield establishing a permeability-stress relationship. The yield stress is then estimated as a function of the recorded permeability-stress relationship. The permeability stress relationship may be non-linear for a range of stress levels, achieving a peak permeability response for a stress below yield. The yield stress may be estimated as a multiple of the stress at which the peak permeability response is recorded.
    Type: Application
    Filed: October 30, 2013
    Publication date: July 3, 2014
    Applicant: Jentek Sensors, Inc.
    Inventors: Todd M. Dunford, Neil J. Goldfine, Shayan Haque
  • Patent number: 8415947
    Abstract: An apparatus for the nondestructive measurement of materials that includes at least two layers of electrical conductors. Within each layer, a meandering primary winding is used to create a magnetic field for interrogating a test material while sense elements or conducting loops within each meander provide a directional measurement of the test material condition. In successive layers extended portions of the meanders are rotated so that the sense elements provide material condition in different orientations without requiring movement of the test circuit or apparatus. Multidirectional permeability measurements are used to assess the stress or torque on a component. These measurements are combined in a manner that removes temperature effects and hysteresis on the property measurements. This can be accomplished through a correction factor that accounts for the temperature dependence.
    Type: Grant
    Filed: July 16, 2012
    Date of Patent: April 9, 2013
    Assignee: Jentek Sensors, Inc.
    Inventors: Yanko K. Sheiretov, Neil J. Goldfine, Todd M. Dunford, Scott A. Denenberg, David C. Grundy, Darrell E. Schlicker, Andrew P. Washabaugh, Karen E. Walrath
  • Publication number: 20130014589
    Abstract: An apparatus for the nondestructive measurement of materials that includes at least two layers of electrical conductors. Within each layer, a meandering primary winding is used to create a magnetic field for interrogating a test material while sense elements or conducting loops within each meander provide a directional measurement of the test material condition. In successive layers extended portions of the meanders are rotated so that the sense elements provide material condition in different orientations without requiring movement of the test circuit or apparatus. Multidirectional permeability measurements are used to assess the stress or torque on a component. These measurements are combined in a manner that removes temperature effects and hysteresis on the property measurements. This can be accomplished through a correction factor that accounts for the temperature dependence.
    Type: Application
    Filed: July 16, 2012
    Publication date: January 17, 2013
    Inventors: Yanko K. Sheiretov, Neil J. Goldfine, Todd M. Dunford, Scott A. Denenberg, David C. Grundy, Darrel E. Schlicker, Andrew P. Washabaugh, Karen E. Walrath
  • Patent number: 8222897
    Abstract: An apparatus for the nondestructive measurement of materials that includes at least two layers of electrical conductors. Within each layer, a meandering primary winding is used to create a magnetic field for interrogating a test material while sense elements or conducting loops within each meander provide a directional measurement of the test material condition in different orientations without requiring movement of the test circuit or apparatus. In a bidirectional implementation the meanders are oriented 90° apart while in a quadridirectional implementation the meanders are orientated at ?45, 0, 45, and 90°. Multidirectional permeability measurements are used to assess the stress or torque on a component. These measurements are combined in a manner that removes temperature effects and hysteresis on the property measurements. This can be accomplished through a correction factor that accounts for the temperature dependence.
    Type: Grant
    Filed: June 12, 2008
    Date of Patent: July 17, 2012
    Assignee: JENTEK Sensors, Inc.
    Inventors: Yanko K. Sheiretov, Neil J. Goldfine, Todd M. Dunford, Scott A. Denenberg, David C. Grundy, Darrell E. Schlicker, Andrew P. Washabaugh, Karen E. Walrath
  • Publication number: 20090001974
    Abstract: An apparatus for the nondestructive measurement of materials that includes at least two layers of electrical conductors. Within each layer, a meandering primary winding is used to create a magnetic field for interrogating a test material while sense elements or conducting loops within each meander provide a directional measurement of the test material condition. In successive layers extended portions of the meanders are rotated so that the sense elements provide material condition in different orientations without requiring movement of the test circuit or apparatus. In a bidirectional implementation the angle is 90° while in a quadridirectional implementation the relative angles are ?45, 0, 45, and 90°. Multidirectional permeability measurements are used to assess the stress or torque on a component. These measurements are combined in a manner that removes temperature effects and hysteresis on the property measurements.
    Type: Application
    Filed: June 12, 2008
    Publication date: January 1, 2009
    Applicant: JENTEK Sensors, Inc.
    Inventors: Yanko K. Sheiretov, Neil J. Goldfine, Todd M. Dunford, Scott A. Denenberg, David C. Grundy, Darrell E. Schlicker, Andrew P. Washabaugh, Karen E. Walrath
  • Patent number: 7451639
    Abstract: A set of curved components, such as the dovetail region of engine blades, are inspected by mounting each component into a circular carousel in a vertical orientation and rotating the carousel to move each component toward and away from an inspection site. The inspection site clamps a flexible eddy current sensor array to the curved material surface, scans the array over the surface, records the sensor position. A rigid element having a surface geometry similar to the surface shape of the component can be attached to the component to facilitate scanning of the sensor array over a component edge. The response of each sense element in the array may be converted into an effective material property and sense element proximity to the component material surface to verify the quality of the inspection scan and the presence of a defect such as a crack.
    Type: Grant
    Filed: March 7, 2007
    Date of Patent: November 18, 2008
    Assignee: JENTEK Sensors, Inc.
    Inventors: Neil J Goldfine, Mark D Windoloski, Vladimir B Tsukernik, Darrell E Schlicker, Todd M Dunford, Andrew P. Washabaugh
  • Patent number: D830863
    Type: Grant
    Filed: May 11, 2017
    Date of Patent: October 16, 2018
    Inventors: Todd M Dunford, Neil J Goldfine, Stuart D Chaplan, Yanko K Sheiretov, Scott A Denenberg
  • Patent number: D842725
    Type: Grant
    Filed: May 12, 2017
    Date of Patent: March 12, 2019
    Inventors: Todd M Dunford, Neil J Goldfine
  • Patent number: D857534
    Type: Grant
    Filed: October 15, 2018
    Date of Patent: August 27, 2019
    Assignee: JENTEK Sensors, Inc.
    Inventors: Todd M Dunford, Neil J Goldfine, Stuart D Chaplan, Yanko K Sheiretov, Scott A Denenberg