Patents by Inventor Tomio Inoue
Tomio Inoue has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240071688Abstract: A multilayer ceramic electronic device includes a multilayer chip having a plurality of dielectric layers and a plurality of internal electrode layers facing each other through each of the plurality of dielectric layers, an external electrode that is provided on an end face of the multilayer chip in a second direction orthogonal to a first direction in which the plurality of internal electrode layers face each other, and has a plurality of glass portions that are spaced from each other on a surface of the external electrode, and a plated layer that is provided on the external electrode and has discontinuous portions on the plurality of glass portions.Type: ApplicationFiled: July 31, 2023Publication date: February 29, 2024Applicant: TAIYO YUDEN CO., LTD.Inventors: Tomoaki NAKAMURA, Mikio TAHARA, Hiroki SHIMIZU, Masaru SAITO, Tomio INOUE
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Patent number: 11021590Abstract: A silicone-coated filler comprises: a particulate material mainly composed of an inorganic oxide formed by oxidizing a predetermined element; a first silicone structure bonded to a surface of the particulate material by way of a “-‘the predetermined element’-OSi—” structure; and a second silicone structure including a cross-linking structure with a carbon-carbon structure directly bonded to a silicon atom of the first silicone structure, and a polysiloxane structure bonded to the cross-linking structure.Type: GrantFiled: April 6, 2020Date of Patent: June 1, 2021Assignee: ADMATECHS CO., LTD.Inventors: Shingi Noguchi, Masaru Kuraki, Tempo Nakamura, Tomio Inoue
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Publication number: 20200239668Abstract: A silicone-coated filler comprises: a particulate material mainly composed of an inorganic oxide formed by oxidizing a predetermined element; a first silicone structure bonded to a surface of the particulate material by way of a “-‘the predetermined element’-OSi—” structure; and a second silicone structure including a cross-linking structure with a carbon-carbon structure directly bonded to a silicon atom of the first silicone structure, and a polysiloxane structure bonded to the cross-linking structure.Type: ApplicationFiled: April 6, 2020Publication date: July 30, 2020Applicant: ADMATECH CO., LTD.Inventors: Shingi NOGUCHI, Masaru KURAKI, Tempo NAKAMURA, Tomio INOUE
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Publication number: 20150243854Abstract: Provided are: a lower-cost light-emitting apparatus with improved properties, as an LED device for illumination or an LED illumination apparatus such as an LED bulb, by eliminating interaction between phosphors and using a structure and mechanism design with optimized conditions; and a method for manufacturing the same.Type: ApplicationFiled: May 7, 2015Publication date: August 27, 2015Inventors: Tomio INOUE, Takakazu MIYAHARA
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Publication number: 20140198528Abstract: There is provided a method of manufacturing a wavelength converted LED chip, including attaching a plurality of LED chips to a chip alignment region of an upper surface of a temporary support plate, forming a conductive bump on the electrode of the respective LED chips, forming a phosphor-containing resin encapsulation part in the chip alignment region to cover the conductive bump, polishing the phosphor containing resin encapsulation part, forming the wavelength converted LED chips by cutting the provided phosphor containing resin encapsulation part between the LED chips, the wavelength converted LED chip including a wavelength conversion layer obtained from the phosphor containing resin encapsulation part and formed on lateral surfaces and an upper surface of the wavelength converted LED chip, and removing the temporary support plate from the wavelength converted LED chip.Type: ApplicationFiled: August 17, 2011Publication date: July 17, 2014Applicant: Samsung Electronics Co., Ltd.Inventors: Yong Tae KIim, Tomio Inoue, Je Won Kim, Tsuyoshi Tsutsui, Jong Ho Lee, Seung Wan Chae
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Patent number: 8735935Abstract: There is provided a light emitting device including: a package body having first and second circumferential surfaces and a plurality of side surfaces formed therebetween, the package body defined into first and second level areas including the first and second circumferential surfaces, respectively; first and second external terminal blocks each having an electrical contact part; an LED chip disposed between the first and second external terminal blocks in the first level area and having an electrode surface where first and second electrodes are formed; and wires electrically connected to first and second electrodes of the LED chip to the electrical contact parts of the first and second external terminal blocks, respectively.Type: GrantFiled: March 23, 2011Date of Patent: May 27, 2014Assignee: Samsung Electronics Co., LtdInventors: Tomio Inoue, Tsuyoshi Tsutsui, Jae Joon Yoon, Ok Hee Shin
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Publication number: 20140042481Abstract: A light emitting device which is inexpensive and has excellent characteristics and a method for manufacturing the same are provided. In the present invention, a chip-size package including a reflection wall is formed by forming a double structure in which a fluorescent material-containing film piece 2 is bonded on a light extraction surface of a semiconductor light emitting element 6 having bumps 4 and 5 on an electrode-formed surface, and covering an exposed surface of the double structure other than a bump mounting surface 7 and a light exit surface 8 with the reflection wall 3, whereby it is possible to provide a light emitting device which does not need a package substrate, is inexpensive, and has excellent brightness characteristics and heat radiation characteristics, and a manufacturing method having excellent chromaticity yield.Type: ApplicationFiled: October 17, 2013Publication date: February 13, 2014Applicant: ELM Inc.Inventors: Tomio INOUE, Takakazu MIYAHARA
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Publication number: 20110169035Abstract: There is provided a light emitting device including: a package body having first and second circumferential surfaces and a plurality of side surfaces formed therebetween, the package body defined into first and second level areas including the first and second circumferential surfaces, respectively; first and second external terminal blocks each having an electrical contact part; an LED chip disposed between the first and second external terminal blocks in the first level area and having an electrode surface where first and second electrodes are formed; and wires electrically connected to first and second electrodes of the LED chip to the electrical contact parts of the first and second external terminal blocks, respectively.Type: ApplicationFiled: March 23, 2011Publication date: July 14, 2011Applicant: SAMSUNG LEG CO., LTD.Inventors: Tomio Inoue, Tsuyoshi Tsutsui, Jae Joon Yoon, Ok Hee Shin
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Patent number: 7942550Abstract: There are provided a light emitting device and a backlight unit including the same. The light emitting device includes a package body having opposing first and second main surfaces and side surfaces, and formed of a curable resin; first and second external terminal blocks opposing each other and each having first and second surfaces formed on the first and second main surfaces and side surfaces, the first and second external terminal blocks each including a connecting part having a bonding portion located inside the package body and a terminal portion connected to the bonding portion and exposed outward; and an LED chip including an electrode forming surface where first and second electrodes are formed and a light emitting surface located opposite to the electrode forming surface, the LED chip having the first and second electrodes electrically connected to the bonding portions of the first and second external terminal blocks, respectively.Type: GrantFiled: November 21, 2008Date of Patent: May 17, 2011Assignee: Samsung LED Co., Ltd.Inventors: Tomio Inoue, Yu Dong Kim, Jae Woo Cho, Ok Hee Shin
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Patent number: 7772597Abstract: The present invention relates to an LED lamp including a pair of lead terminals 2 and 3, a cup portion 8 formed at an end of one of the lead terminals by denting the end and having a conical inner peripheral surface serving as a light-reflective surface 9, an LED chip 4, a transparent synthetic resin member 6 covering the ends of the paired lead terminals 2 and 3. The LED chip 4 includes an upper surface provided with an n-electrode 4d or a p-electrode 4e and a lower surface provided with a p-electrode 4e or an n-electrode 4d. An n-type semiconductor layer 4a and a p-type semiconductor layer 4b are provided between the n-electrode 4d and the p-electrode 4e and laminated to each other via a light emitting layer 4c interposed therebetween. The side surface of the LED chip 4 except for the n-electrode 4d and the p-electrode 4e is coated with light-transmitting synthetic resin 10 containing powder of a fluorescent material.Type: GrantFiled: April 20, 2005Date of Patent: August 10, 2010Assignee: Rohm Co., Ltd.Inventor: Tomio Inoue
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Publication number: 20100014279Abstract: There are provided a light emitting device and a backlight unit including the same. The light emitting device includes a package body having opposing first and second main surfaces and side surfaces, and formed of a curable resin; first and second external terminal blocks opposing each other and each having first and second surfaces formed on the first and second main surfaces and side surfaces, the first and second external terminal blocks each including a connecting part having a bonding portion located inside the package body and a terminal portion connected to the bonding portion and exposed outward; and an LED chip including an electrode forming surface where first and second electrodes are formed and a light emitting surface located opposite to the electrode forming surface, the LED chip having the first and second electrodes electrically connected to the bonding portions of the first and second external terminal blocks, respectively.Type: ApplicationFiled: November 21, 2008Publication date: January 21, 2010Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Tomio Inoue, Yu Dong Kim, Jae Woo Cho, Ok Hee Shin
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Publication number: 20090072250Abstract: There is provided a reflective chip type semiconductor light emitting device, which has improved efficiency of taking out light and further improved luminance with the same input, and which emits high luminance light by emitting light uniformly from an area as large as possible and is suitable for lighting apparatuses. A pair of terminal electrodes (11, 12) is provided at the both end portions of one surface (front surface) of a substrate (1) so as to be electrically separated, and a plurality of LED chips (2) are separately provided on the one surface (front surface) of the substrate (1). Each of the LED chips (2) is electrically connected to a first terminal electrode (11) through a first bonding section (11a), and to a second terminal electrode (12) through a wire (7) and a second bonding section (12a), respectively. A reflecting wall (3) is provided so as to surround a circumference of each of the plurality of LED chips (2) on the one surface (front surface) of the substrate (1).Type: ApplicationFiled: March 7, 2007Publication date: March 19, 2009Applicant: ROHM CO., LTD.Inventor: Tomio Inoue
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Publication number: 20080290359Abstract: There is provided a light emitting device including: a package body having first and second circumferential surfaces and a plurality of side surfaces formed therebetween, the package body defined into first and second level areas including the first and second circumferential surfaces, respectively; first and second external terminal blocks each having an electrical contact part; an LED chip disposed between the first and second external terminal blocks in the first level area and having an electrode surface where first and second electrodes are formed; and wires electrically connected to first and second electrodes of the LED chip to the electrical contact parts of the first and second external terminal blocks, respectively.Type: ApplicationFiled: April 23, 2008Publication date: November 27, 2008Inventors: Tomio Inoue, Tsuyoshi Tsutsui, Jae Joon Yoon, Ok Hee Shin
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Publication number: 20070221934Abstract: The present invention relates to an LED lamp including a pair of lead terminals 2 and 3, a cup portion 8 formed at an end of one of the lead terminals by denting the end and having a conical inner peripheral surface serving as a light-reflective surface 9, an LED chip 4, a transparent synthetic resin member 6 covering the ends of the paired lead terminals 2 and 3. The LED chip 4 includes an upper surface provided with an n-electrode 4d or a p-electrode 4e and a lower surface provided with a p-electrode 4e or an n-electrode 4d. An n-type semiconductor layer 4a and a p-type semiconductor layer 4b are provided between the n-electrode 4d and the p-electrode 4e and laminated to each other via a light emitting layer 4c interposed therebetween. The side surface of the LED chip 4 except for the n-electrode 4d and the p-electrode 4e is coated with light-transmitting synthetic resin 10 containing powder of a fluorescent material.Type: ApplicationFiled: April 20, 2005Publication date: September 27, 2007Applicant: Rohm Co., Ltd.Inventor: Tomio Inoue
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Patent number: D536308Type: GrantFiled: April 19, 2005Date of Patent: February 6, 2007Assignee: Rohm Co., Ltd.Inventor: Tomio Inoue
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Patent number: D538240Type: GrantFiled: April 6, 2005Date of Patent: March 13, 2007Assignee: Rohm Co., Ltd.Inventor: Tomio Inoue
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Patent number: D539240Type: GrantFiled: July 24, 2006Date of Patent: March 27, 2007Assignee: Rohm Co., Ltd.Inventor: Tomio Inoue
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Patent number: D540269Type: GrantFiled: April 6, 2005Date of Patent: April 10, 2007Assignee: Rohm Co., Ltd.Inventor: Tomio Inoue
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Patent number: D540270Type: GrantFiled: July 24, 2006Date of Patent: April 10, 2007Assignee: Rohm Co., Ltd.Inventor: Tomio Inoue
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Patent number: D544847Type: GrantFiled: April 19, 2005Date of Patent: June 19, 2007Assignee: Rohm Co., Ltd.Inventor: Tomio Inoue