Abstract: A semiconductor device manufacturing method includes a preparation step and a sinter bonding step. In the preparation step, a sinter-bonding work having a multilayer structure including a substrate, semiconductor chips, and sinter-bonding material layers is prepared. The semiconductor chips are disposed on, and will bond to, one side of the substrate. Each sinter-bonding material layer contains sinterable particles and is disposed between each semiconductor chip and the substrate. In the sinter bonding step, a cushioning sheet having a thickness of 5 to 5000 ?m and a tensile elastic modulus of 2 to 150 MPa is placed on the sinter-bonding work, the resulting stack is held between a pair of pressing faces, and, in this state, the sinter-bonding work between the pressing faces undergoes a heating process while being pressurized in its lamination direction, to form a sintered layer from each sinter-bonding material layer.

Abstract: A manufacturing method includes the step of laminating a sheet assembly onto chips arranged on a processing tape, where the sheet assembly has a multilayer structure including a base and a sinter-bonding sheet and is laminated so that the sinter-bonding sheet faces the chips, and subsequently removing the base B from the sinter-bonding sheet. The chips on the processing tape are picked up each with a portion of the sinter-bonding sheet adhering to the chip, to give sinter-bonding material layer-associated chips. The sinter-bonding material layer-associated chips are temporarily secured through the sinter-bonding material layer to a substrate. The sinter-bonding material layers lying between the temporarily secured chips and the substrate are converted through a heating process into sintered layers, to bond the chips to the substrate.

Abstract: The sinter-bonding composition contains sinterable particles containing an electroconductive metal. The average particle diameter of the sinterable particles is 2 ?m or less and the proportion of the particles having a particle diameter of 100 nm or less in the sinterable particles is not less than 40% by mass and less than 80% by mass. The sinter-bonding sheet (10) has an adhesive layer made from such a sinter-bonding composition. The dicing tape with a sinter-bonding sheet (X) has such a sinter-bonding sheet (10) and a dicing tape (20). The dicing tape (20) has a lamination structure containing a base material (21) and an adhesive layer (22), and the sinter-bonding sheet (10) is positioned on the adhesive layer (22) of the dicing tape (20).

Abstract: A thermosetting sheet according to the present invention includes: a thermosetting resin; a volatile component; and conductive particles, in which a weight reduction ratio W1 obtained when the thermosetting sheet under a nitrogen gas flow of 200 mL/min is heated from room temperature to 100° C. at a temperature rising rate of 10° C./min and then maintained at 100° C. for 30 minutes is 0.5 mass % or less, and a weight reduction ratio W2 obtained when the thermosetting sheet under a nitrogen gas flow of 200 mL/min is heated from 100° C. to 200° C. at a temperature rising rate of 10° C./min and then maintained at 200° C. for 30 minutes is 2 mass % or more.

Abstract: A thermosetting sheet according to the present invention includes, as essential components, a thermosetting resin and inorganic particles, and, as an optional component, a volatile component, in which a ratio of a packing ratio P2 of the inorganic particles in the thermosetting sheet after being cured to a packing ratio Pi of the inorganic particles in the thermosetting sheet before being cured is P2/P1?1.3.

Abstract: A manufacturing method includes the step of forming a diced semiconductor wafer (10) including semiconductor chips (11) from a semiconductor wafer (W) typically on a dicing tape (T1). The diced semiconductor wafer (10) on the dicing tape (T1) is laminated with a sinter-bonding sheet (20). The semiconductor chips (11) each with a sinter-bonding material layer (21) derived from the sinter-bonding sheet (20) are picked up typically from the dicing tape (T1). The semiconductor chips (11) each with the sinter-bonding material layer are temporarily secured through the sinter-bonding material layer (21) to a substrate. Through a heating process, sintered layers are formed from the sinter-bonding material layers (21) lying between the temporarily secured semiconductor chips (11) and the substrate, to bond the semiconductor chips (11) to the substrate.

Abstract: Provided is a mounting member that is excellent in low dusting property and hardly contaminates an object to be mounted while being excellent in gripping force and heat resistance. The mounting member of the present invention includes an aggregate of carbon nanotubes for forming a mounting surface, wherein a ratio of a plan view area of recessed portions occurring in a carbon nanotube aggregate-side surface of the mounting member to a total area of the carbon nanotube aggregate-side surface is 5% or less.

Abstract: A chair according to the present invention is a chair comprising a leg 1 arranged on a floor surface, a leg support pole 13 erected from the leg 1, a support base 4 fixed at an upper end of the leg support pole 13, a seat 2 arranged above the support base 4 and a support mechanism 5 interposed between the support base 4 and the seat 2 and configured to support the seat 2 movably in a front-rear direction and a left-right direction. Additionally, in the support mechanism 5, a left-right support part 51 is attached to the support base 4 movably in a left-right direction, a front-rear part 52 is attached to the left-right support part 51 movably in a front-rear direction, the seat 2 is attached to the front-rear support part 51, and the support base 4 has an arm attachment part 6.

Abstract: Provided is a mounting member that is excellent in low dusting property and hardly contaminates an object to be mounted while being excellent in gripping force and heat resistance. In one embodiment of the present invention, the mounting member includes an aggregate of carbon nanotubes for forming amounting surface, wherein a standard deviation of diameters of the carbon nanotubes is 3 nm or less. In one embodiment of the present invention, the mounting member includes an aggregate of carbon nanotubes for forming a mounting surface, wherein the aggregate of the carbon nanotubes includes carbon nanotubes each having a multi-walled structure, and wherein a standard deviation of wall numbers of the carbon nanotubes is 3 or less.

Abstract: The sinter-bonding composition contains sinterable particles containing an electroconductive metal. The average particle diameter of the sinterable particles is 2 ?m or less and the proportion of the particles having a particle diameter of 100 nm or less in the sinterable particles is not less than 80% by mass. The sinter-bonding sheet (10) has an adhesive layer made from such a sinter-bonding composition. The dicing tape with a sinter-bonding sheet (X) has such a sinter-bonding sheet (10) and a dicing tape (20). The dicing tape (20) has a lamination structure containing a base material (21) and an adhesive layer (22), and the sinter-bonding sheet (10) is positioned on the adhesive layer (22) of the dicing tape (20).

Abstract: A sheet for sintering bonding 10 of the present invention comprises an electrically conductive metal containing sinterable particle and a binder component, and upon subjecting the sheet to a pressurization treatment onto a silver plane of a 5 mm square Si chip under predetermined conditions, the ratio of the area of a layer of a material for sintering bonding transferred onto the silver plane to the silver plane area is 0.75 to 1. A sheet body X of the present invention has a laminated structure comprising a base material B and the sheet 10. A semiconductor chip with a layer of a material for sintering bonding of the present invention comprises a semiconductor chip and a material layer derived from the sheet 10 on one face of the chip, and the ratio of the area of the material layer to the area of that face is 0.75 to 1.

Abstract: To provide a sheet for sintering bonding and the same with a base material suited for lamination and integration and also suited for realizing satisfactory operational efficiency in a sintering process in a process of producing semiconductor devices that go through sintering bonding of semiconductor chips. A sheet for sintering bonding 10 of the present invention comprises an electrically conductive metal containing sinterable particle and a binder component. In this sheet, the minimum load, reached during an unloading process in load-displacement measurement according to a nanoindentation method, is ?100 to ?30 ?N. Alternatively, the ratio of the minimum load to a maximum load, reached during a load applying process in the above measurement, is ?0.2 to ?0.06. A sheet body X, a sheet for sintering bonding with a base material of the present invention, has a laminated structure comprising a base material B and the sheet 10.

Abstract: To provide a sheet for sintering bonding and a sheet for sintering bonding with a base material that are suited for being made with a good operational efficiency and that are also suited for realizing a satisfactory operational efficiency in a sintering process in a process of producing a semiconductor device that goes through sintering bonding of semiconductor chips. A sheet for sintering bonding 10 of the present invention comprises an electrically conductive metal containing sinterable particle and a binder component, and has a shear strength at 23° C. of 2 to 40 MPa measured in accordance with a SAICAS method. A sheet body X, which is a sheet for sintering bonding with a base material according to the present invention, has a laminated structure comprising a base material B and the sheet for sintering bonding 10.

Abstract: To provide a wound body of a sheet for sintering bonding with a base material that realizes a satisfactory operational efficiency in a process of producing a semiconductor device comprising sintering bonding portions of semiconductor chips and that also has both a satisfactory storage stability and a high storage efficiency. A wound body 1 according to the present invention has a form in which a sheet for sintering bonding with a base material X is wound around a winding core 2 into a roll shape, the sheet for sintering bonding with a base material X having a laminated structure comprising: a base material 11; and a sheet for sintering bonding 10, comprising an electrically conductive metal containing sinterable particle and a binder component.

Abstract: To provide a sheet for sintering bonding and a sheet for sintering bonding with a base material that are suited for properly supplying a material for sintering bonding to a face planned to be bonded of a bonding object. A sheet for sintering bonding 10 according to the present invention comprises an electrically conductive metal containing sinterable particle and a binder component. In the sheet for sintering bonding 10, the shear strength at 23° C., F (MPa), measured in accordance with a SAICAS method and the minimum load, f (?N), which is reached during an unloading process in load-displacement measurement in accordance with a nanoindentation method, satisfy 0.1?F/f?1. A sheet body X, which is a sheet for sintering bonding with a base material according to the present invention, has a laminated structure comprising a base material B and the sheet for sintering bonding 10.

Abstract: Provided is a mounting member that is excellent in low dusting property and hardly contaminates an object to be mounted while being excellent in gripping force and heat resistance. The mounting member of the present invention includes an aggregate of carbon nanotubes for forming a mounting surface, wherein when the mounting member is placed on a silicon wafer so that a carbon nanotube aggregate-side surface thereof is brought into contact with the silicon wafer, and the resultant is left to stand for 30 seconds while a load of 100 g is applied from above the mounting member, a number of particles each having a diameter of 0.2 ?m or more transferred onto the silicon wafer is 100 particles/cm2 or less.

Abstract: A chair is realized which takes specific measures to suppress movement of a seat in a front-rear direction when the seat swings in the front-rear and the left-right directions with respect to a support base. For the purpose, the chair wherein a seat 5 swings in the front-rear and left-right directions with respect to a support base 2, the chair is configured such that swinging of the seat 5 in front-rear direction with respect to the support base 2 is capable of being suppressed at one or a plurality of predetermined positions, or arbitrary position via operation of operation member 152.

Abstract: [Problem] Provided is a chair capable of changing an operation of a movable part between allowed and suppressed states, without causing an up-down movement of a seat or without requiring a complicated structure relying on a back. [Solution] For that purpose, a weight-receiving part 50, the height position of which changes due to a person sitting on a seat surface, is provided on a seat 5, the change of the height position is mechanically transmitted to a control mechanism 8X configured to control an operation of a front-rear swing part 3 being the movable part, and the control mechanism 8X changes an operation of the front-rear swing part-3 being the movable part between allowed and suppressed states.

Abstract: A flange part 31b is provided on a vertical surface 31a on the plate member PM of the front-rear swing part 3, the flange part 31b has a guide surface 31b1 extending to lateral direction and moving the rolling body 45 in the longitudinal direction, a lateral direction dimension of the guide surface 31b1 is greater than a thickness of the plate member PM, the flange part 31b and the portion of the plate member PM forming the vertical surface 31a around the flange part 31b are integrally formed of metal; and the flange part 31b has a shape that goes around the circumference of the guide hole 34 opened in the vertical surface 31a, and then, the rolling body 45 are provided independently to the left and right, to be able to a roll along the guide surface 31b1.

Abstract: In view of various movement of a seated person, when giving the left-right swinging operation to the seat in the non-conventional aspect, a chair configured such that the back can perform a new movement suitable for the left-right movement of the seat and return to the predetermined position when the seated person leaves a seat, is realized. For the purpose, a back 6 is arranged behind a seat 5, and the back 6 has an operation mechanism 6M turning-movably supporting the load received from a seated person in a left-right direction in a front view, and when the load is applied, at least a part of guide part 65a, 66a of the operation mechanism 6M is separated and the back moves freely, and when the applied load is removed, the back automatically returns to the neutral position along the guide part 65a, 66a.