Abstract: Providing a substrate cleaning device and a substrate cleaning method having high detergency. Provided is a substrate cleaning device including: a substrate rotating mechanism that rotates a substrate; and a first nozzle and a second nozzle that eject an ultrasonic cleaning solution toward a predetermined surface of the substrate that is rotated, wherein the first nozzle and the second nozzle are held in one casing.

Abstract: A substrate washing device includes a substrate holding mechanism 70 that holds a substrate W, a substrate rotating mechanism 72 that rotates the substrate W held by the substrate holding mechanism 70, and a two-fluid nozzle 46 that ejects a two-fluid jet toward a surface of the rotating substrate W. The two-fluid nozzle 46 is formed of a conductive material. Accordingly, the electrification amount of droplets ejected as the two-fluid jet from the two-fluid nozzle 46 can be suppressed.

Abstract: A substrate cleaning roll that has a cylindrical shape and scrubs a surface of a substrate by rotating about a rotational axis in a longitudinal direction in contact with the substrate, the longitudinal direction being parallel to the surface of the substrate, the substrate cleaning roll including a bevel cleaner at least at one end of the substrate cleaning roll in the longitudinal direction, the bevel cleaner including a sloping surface to be in contact with an outermost edge of a bevel portion at a rim of the substrate when the substrate cleaning roll comes into contact with the substrate and cleans the surface of the substrate.

Abstract: A cover for a swing member of a substrate processing apparatus includes an upper surface including a first groove, and a first side edge and a second side edge located respectively at both ends of the upper surface in the short-length direction of the cover, where a bottom portion of the first groove is located lower than the first side edge and the second side edge.

Abstract: The disclosure provides a jig for attaching and detaching a cleaning member, which facilitates attaching and detaching the cleaning member to and from a rotation device without holding the cleaning member directly by hand, even when there is no sufficient spacing around the cleaning member. The jig 100 for attaching and detaching a cleaning member 60 includes a pair of jig bodies 110 capable of clamping two ends 63 of a holder 62 of the cleaning member 60, and a connecting mechanism 120 that interlocks the movements of the pair of jig bodies 110 between a clamped state in which two ends 63 of the holder 62 are clamped and a non-clamped state in which the clamped state is released.

Abstract: According to one embodiment of the present disclosure, provided is a substrate cleaning method that performs an operation, in a state where a cleaning member is in contact with a rotating substrate, the cleaning member is moved between a first position on the substrate and a second position close to an edge of the substrate, n times (n is an integer of 2 or more), wherein a controller, which controls a driver that moves the cleaning member, controls the driver to perform an edge cleaning step to perform cleaning of the substrate in a state where the cleaning member is in contact with the second position on the substrate for a predetermined period of time after the cleaning member reaches the second position at least in one operation of the first to the (n-1)th operations.

Abstract: A substrate cleaning apparatus cleans a surface of a substrate in a non-contact state. The substrate cleaning apparatus includes a substrate holding mechanism configured to hold and rotate the substrate, a two-fluid nozzle configured to jet a two-fluid jet flow, comprising a gas and a liquid, downwardly toward the front surface of the substrate held by the substrate holding mechanism, and a moving mechanism configured to move the two-fluid nozzle in one direction from a central portion toward a radially outer side of the substrate held by the substrate holding mechanism. The two-fluid nozzle is inclined so that an angle between an ejection center line of the two-fluid jet flow jetted from the two-fluid nozzle and a vertical line becomes a certain inclined angle, and the two-fluid jet flow collides with the front surface of the substrate at a forward position in a moving direction of the two-fluid nozzle.

Abstract: A cleaning device, according to one embodiment, for cleaning a substrate by being rotated, includes: a cleaning member configured to clean a substrate; and a sleeve configured to be provided along a circumference of the cleaning member, a lower part of the sleeve being divided into a plurality of chucking claws each of which holds a portion of a side face of the cleaning member, wherein at inside of each of the plurality of chucking claws, a plurality of protrusions are provided substantially parallel to a rotation direction of the cleaning member, an end of each of the plurality of protrusions is configured to contact the side face of the cleaning member.

Abstract: Provided is a substrate cleaning apparatus including: a substrate support mechanism configured to support a substrate; and a roll-type first cleaning member configured to clean a first surface of the substrate by rotating while being in contact with a bevel and/or an edge of the first surface of the substrate, wherein a rotation axis of the first cleaning member is in parallel with the substrate, and the first cleaning member has a large diameter portion and a small diameter portion.

Abstract: A substrate cleaning apparatus comprises a substrate holding roller and an edge cleaner. The substrate holding roller is configured to hold and rotate a substrate to be processed. The edge cleaner is in contact with an edge portion of the substrate to be processed and includes resin material containing fluororesin particles at least in a portion in contact with the substrate to be processed.

Abstract: A roll-type cleaning member for scrubbing and cleaning a target cleaning surface of a substrate includes a plurality of nodules formed on a surface thereof. Each nodule includes a slit which extends so as not to be parallel to the rotation direction of the roll-type cleaning member, upstream edges are formed by the slit so as to serve as edges first contacting the target cleaning surface when a cleaning surface of the nodule contacts the target cleaning surface of the substrate by the rotation of the roll-type cleaning member, and the upstream edges are provided at a plurality of positions of the cleaning surface of the nodule in the circumferential direction.

Abstract: A roll-type cleaning member for scrubbing and cleaning a target cleaning surface of a substrate includes a plurality of nodules formed on a surface thereof. Each nodule includes a slit which extends so as not to be parallel to the rotation direction of the roll-type cleaning member, upstream edges are formed by the slit so as to serve as edges first contacting the target cleaning surface when a cleaning surface of the nodule contacts the target cleaning surface of the substrate by the rotation of the roll-type cleaning member, and the upstream edges are provided at a plurality of positions of the cleaning surface of the nodule in the circumferential direction.

Abstract: The present invention prevents or alleviates cleaning unevenness in cleaning of a substrate with the use of a roll cleaning member having protruding members. The roll cleaning device includes: a substrate support member that supports and rotates a substrate W; and an upper roll cleaning member (52) for scrub cleaning a surface of the substrate W which is rotated by the substrate support member, while rotating. The upper roll cleaning member (52) has a plurality of protruding members provided thereon that are arrayed in the longitudinal direction thereof, and slidably contact the surface of the substrate W. The roll cleaning device cleans the substrate W so that the trajectories of high cleaning force regions out of the parts of the protruding members which slidably contact the substrate W are present without a gap in a radial direction of the substrate W.

Abstract: The substrate drying apparatus includes a rinse agent nozzle configured to eject a rinse agent to the substrate while moving away from a center of the substrate relative to the substrate, a drying gas nozzle configured to spout a drying gas to the substrate while moving away from the center of substrate relative to the substrate with movement of the rinse agent nozzle, a liquid area sensor and a dried area sensor configured to sense a surface of the substrate around an interface of the rinse agent by moving away from the center of the substrate with movement of the rinse agent nozzle and the drying gas nozzle, and a control unit configured to control a drying condition based on the sensing results of the liquid area sensor and the dried area sensor.

Abstract: A cleaning member 10, for use in cleaning a substrate W, comprises: a tip surface 13 configured to be in contact with the substrate W when cleaning the substrate W, and the tip surface 13 being not covered with a skin layer 11; and a circumferential part having a covered part 16, which is disposed on the base end side and a circumferential surface of which is covered with the skin layer 11, and an exposed part 17, which is disposed on the tip end side and a circumferential surface of which is not covered with the skin layer 11.

Abstract: An apparatus for cleaning a substrate has a holding unit 60 that holds a substrate W; a rotated unit 30 connected to the holding unit 60; a rotating unit 35 that is provided on a peripheral outer side of the rotated unit 30 and rotates the rotated unit 30; and a cleaning unit 10, 20 that physically cleans the substrate W held by the holding unit 60.

Abstract: High-performance substrate cleaning apparatus, substrate cleaning method, substrate processing apparatus, and substrate drying apparatus are provided. A substrate cleaning apparatus, including: a substrate holding and rotating mechanism that holds and rotates a substrate; a first cleaning mechanism that brings a cleaning tool into contact with the substrate to clean the substrate, cleans the substrate using two-fluid jet, or cleans the substrate using ozone water; and a second cleaning mechanism that cleans the substrate using an ultrasonic cleaning liquid is provided.

Abstract: A washing device includes: a plurality of spindles which holds a substrate and rotates the substrate about a central axis of the substrate as a rotary axis; and a single tube nozzle which discharges a washing liquid toward an upper surface of the substrate, wherein the single tube nozzle discharges the washing liquid so that the washing liquid lands in front of the center of the substrate and the landed washing liquid flows on the upper surface of the substrate toward the center of the substrate. A liquid flow on the upper surface of the substrate after landing of the washing liquid discharged from the single tube nozzle passes through the center of the substrate.

Abstract: A substrate cleaning apparatus capable of quickly removing cleaning liquid that has been used in cleaning of a substrate with a roll cleaning tool from the substrate. The substrate cleaning apparatus includes a substrate holder configured to hold and rotate a substrate; a cleaning-liquid supply nozzle configured to supply cleaning liquid onto a first region of the substrate; a roll cleaning tool configured to be placed in sliding contact with the substrate in the presence of the cleaning liquid to thereby clean the substrate; and a fluid supply nozzle configured to supply fluid, which is constituted by pure water or chemical liquid, onto a second region of the substrate. The second region is located at an opposite side of the first region with respect to the roll cleaning tool, and a supply direction of the fluid is a direction from a central side toward a peripheral side of the substrate.

Abstract: A washing device includes: a plurality of spindles which holds a substrate and rotates the substrate about a central axis of the substrate as a rotary axis; and a single tube nozzle which discharges a washing liquid toward an upper surface of the substrate, wherein the single tube nozzle discharges the washing liquid so that the washing liquid lands in front of the center of the substrate and the landed washing liquid flows on the upper surface of the substrate toward the center of the substrate. A liquid flow on the upper surface of the substrate after landing of the washing liquid discharged from the single tube nozzle passes through the center of the substrate.