Abstract: Provided is a temperature control system applied to an apparatus for analyzing a sample using a pipette nozzle and a reaction container, including a pipette tip temperature controller that heats a pipette tip which is fitted on the pipette nozzle and aspirates or discharges liquid and a reaction container temperature controller that heats the reaction container. The pipette tip temperature controller heats, in a concentrated manner, at least a distal end portion of the pipette tip of the pipette nozzle located at a predetermined heating position with hot air emitted from a heat source and is configured such that a distal end is capable of arriving at the reaction container by lowering the pipette nozzle from the heating position.

Abstract: Provided is a program that causes a computer to have an agent as a guide in a game provide the game to a player. The program for the computer includes displaying, in a first region of a display unit, an image of the game played by the player, displaying, in a second region of the display unit, an operation object for the player to operate the game, and controlling progress of the game by receiving input made on the operation object. The displaying the operation object includes displaying an operation object corresponding to the game played by the player.

Abstract: A sensor module includes: a metal member having a recessed portion; a resin portion embedded within the recessed portion; a radiator provided within the resin portion and configured to emit radio waves; a wireless communication portion provided within the resin portion and connected to the radiator; and a sensor connected to the wireless communication portion, wherein the metal member is insulated from the radiator by the resin portion and functions as a parasitic element.

Abstract: A semiconductor device includes a first wiring board having a first surface mounted with a primary radiator, and a second surface mounted with a semiconductor chip, a second wiring board mounted with a secondary radiator that forms an antenna with the primary radiator, and a third wiring board, arranged between the first and second wiring boards, and forming a predetermined gap with each of the first and second wiring boards. A first board-to-board connection member is arranged between the first and third wiring boards, to form a space between the first and third wiring boards, and regulate the spacing between the first and third wiring boards. A second board-to-board connection member is arranged between the second and third wiring boards, to form a space between the second and third wiring boards, and regulate a spacing between the second and third wiring boards.

Abstract: A sensor module includes: a metal member having a recessed portion; a resin portion embedded within the recessed portion; a radiator provided within the resin portion and configured to emit radio waves; a wireless communication portion provided within the resin portion and connected to the radiator; and a sensor connected to the wireless communication portion, wherein the metal member is insulated from the radiator by the resin portion and functions as a parasitic element.

Abstract: A semiconductor device includes a first wiring board having a first surface mounted with a primary radiator, and a second surface mounted with a semiconductor chip, a second wiring board mounted with a secondary radiator that forms an antenna with the primary radiator, and a third wiring board, arranged between the first and second wiring boards, and forming a predetermined gap with each of the first and second wiring boards. A first board-to-board connection member is arranged between the first and third wiring boards, to form a space between the first and third wiring boards, and regulate the spacing between the first and third wiring boards. A second board-to-board connection member is arranged between the second and third wiring boards, to form a space between the second and third wiring boards, and regulate a spacing between the second and third wiring boards.

Abstract: An electronic device includes a first wiring substrate having a first corner part, a first ground pattern formed on a lower surface of the first wiring substrate with avoiding the first corner part, a second ground pattern formed on an upper surface of the first wiring substrate with avoiding the first corner part, a second wiring substrate provided above the first wiring substrate and including a second corner part above the first corner part, a third ground pattern formed on a lower surface of the second wiring substrate with avoiding the second corner part, a fourth ground pattern formed on an upper surface of the second wiring substrate with avoiding the second corner part, a plurality of terminals electrically connected to each of the first, second, third and fourth ground patterns, and an antenna fixed to the upper surface of the second wiring substrate at the second corner part.

Abstract: An electronic device includes a first wiring substrate having a first corner part, a first ground pattern formed on a lower surface of the first wiring substrate with avoiding the first corner part, a second ground pattern formed on an upper surface of the first wiring substrate with avoiding the first corner part, a second wiring substrate provided above the first wiring substrate and including a second corner part above the first corner part, a third ground pattern formed on a lower surface of the second wiring substrate with avoiding the second corner part, a fourth ground pattern formed on an upper surface of the second wiring substrate with avoiding the second corner part, a plurality of terminals electrically connected to each of the first, second, third and fourth ground patterns, and an antenna fixed to the upper surface of the second wiring substrate at the second corner part.

Abstract: A sensor includes: a base layer; first and second conduction paths supported by the base layer; a first adhesive layer covering a first portion of the first conduction path; a second adhesive layer covering the second conduction path; an insulation sheet including: a first protecting portion covering the second adhesive laver; a second protecting portion disposed between a second portion of the first conduction path, and a part of the second conduction path; and a third protecting portion covering the first adhesive layer; a detecting section; a wireless transmitter; and a power source. When the insulation sheet is peeled off, the second portion of the first conduction path, and the part of the second conduction path are caused to be in contact with each other, and an electric power is supplied from the power source to the detecting section and the wireless transmitter.

Abstract: A passive device substrate includes a substrate, a passive device disposed at a first surface of the substrate, an insulating layer disposed on the first surface of the substrate to cover the passive device, a magnetic layer disposed on an opposite side of the insulating layer from the substrate to overlap the passive device in a plan view taken in a thickness direction of the substrate, and a metal layer disposed on a second surface of the substrate to overlap the passive device in the plan view.

Abstract: A semiconductor device includes a board, an electronic component, an evaluation component, a wiring, and a groove portion. The board includes a product area, a non-product area, and a boundary area between the product area and the non-product area. The electronic component is mounted in the product area. The evaluation component is mounted in the non-product area. The wiring electrically connects the electronic component and the evaluation component. The groove portion is formed in the boundary area of the board so as to overlap at least a part of the wiring in a plan view. The non-product area is surrounded by the groove portion and at least a portion of sides of the board.

Abstract: A damper device is provided with a first rotating body, a second rotating body, a coil spring and a spring seat. The coil spring is interposed in a circumferential direction between the first and second rotating bodies. The resin spring seat includes a seat portion, an overhang portion and a pair of clamping protrusions. The overhang portion extends in the circumferential direction from an outer diameter end of the seat portion and covers an outer diameter side of the coil spring. The clamping protrusions protrude from the seat portion and sandwich an attaching portion of the one of the rotating bodies. The clamping protrusions are relatively turnable in a radial direction of the rotating bodies. The clamping protrusions have a low-rigidity portion on an outer diameter direction side of the spring central axis and a high-rigidity portion on an inner diameter direction side of the spring central axis.

Abstract: A damper device is provided with a first rotating body, a second rotating body, a coil spring and a spring seat. The coil spring is interposed in a circumferential direction between the first and second rotating bodies. The resin spring seat includes a metallic core member inside. The resin spring seat has a seat portion and an overhang portion. The metallic core member has includes a metallic core seat part with a metallic core exposed portion. The metallic core seat part is provided along the spring seating surface in the seat portion of the spring seats. The metallic core exposed portion is exposed so as to be capable of abutting the coil springs. The metallic core exposed portion is provided on a portion of the spring seating surface which slides against the coil springs.

Abstract: Provided is a film-forming apparatus capable of cleaning a discharge apparatus under a state in which a film-forming space and a cleaning gas ambience are separated from each other while continuing to form a film on an object to be film-formed having a film-like shape.

Abstract: A photovoltaic cell mounting substrate includes a substrate; and a plurality of grooves provided at one surface of the photovoltaic cell mounting substrate, the plurality of grooves including a first groove and a second groove that is placed at a circumferential side of the first groove, at the one surface of the substrate, the second groove being formed deeper than the first groove, with respect to the one surface of the substrate.

Abstract: A sensor includes: a base layer; first and second conduction paths supported by the base layer; a first adhesive layer covering a first portion of the first conduction path; a second adhesive layer covering the second conduction path; an insulation sheet including: a first protecting portion covering the second adhesive laver; a second protecting portion disposed between a second portion of the first conduction path, and a part of the second conduction path; and a third protecting portion covering the first adhesive layer; a detecting section; a wireless transmitter; and a power source. When the insulation sheet is peeled off, the second portion of the first conduction path, and the part of the second conduction path are caused to be in contact with each other, and an electric power is supplied from the power source to the detecting section and the wireless transmitter.

Abstract: A package includes a metal core substrate, a first insulation layer formed along a periphery of a first surface of the metal core substrate, the first surface of the metal core substrate being exposed at an inner side of the first insulation layer, a second insulation layer formed along at least a periphery of a second surface of the metal core substrate, a first through-electrode penetrating the second insulation layer at a first part of the periphery of the metal core substrate, and a second through-electrode penetrating the first insulation layer, the metal core substrate and the second insulation layer at a second part of the periphery of the metal core substrate, the second through-electrode being electrically insulated from the metal core substrate via an insulation member.

Abstract: A damper device is provided with a first rotating body, a second rotating body, a coil spring and a spring seat. The coil spring is interposed in a circumferential direction between the first and second rotating bodies. The resin spring seat includes a metallic core member inside. The resin spring seat has a seat portion and an overhang portion. The metallic core member has includes a metallic core seat part with a metallic core exposed portion. The metallic core seat part is provided along the spring seating surface in the seat portion of the spring seats. The metallic core exposed portion is exposed so as to be capable of abutting the coil springs. The metallic core exposed portion is provided on a portion of the spring seating surface which slides against the coil springs.

Abstract: A wiring board includes a first insulating layer; and a coil formed on the first insulating layer and including a first magnetic layer formed on the first insulating layer and formed by a plating layer, a coil portion formed on the first magnetic layer, a second insulating layer formed on the first insulating layer to cover the first magnetic layer and the coil portion, and a second magnetic layer formed on the second insulating layer and formed by a plating layer.

Abstract: A damper device is provided with a first rotating body, a second rotating body, a coil spring and a spring seat. The coil spring is interposed in a circumferential direction between the first and second rotating bodies. The resin spring seat includes a seat portion, an overhang portion and a pair of clamping protrusions. The overhang portion extends in the circumferential direction from an outer diameter end of the seat portion and covers an outer diameter side of the coil spring. The clamping protrusions protrude from the seat portion and sandwich an attaching portion of the one of the rotating bodies. The clamping protrusions are relatively turnable in a radial direction of the rotating bodies. The clamping protrusions have a low-rigidity portion on an outer diameter direction side of the spring central axis and a high-rigidity portion on an inner diameter direction side of the spring central axis.