Abstract: A light emitting device includes a light emitting element, a wire connected to the light emitting element, and a substrate supporting the light emitting element. The substrate is formed with a first recess and a second recess that are open in a common surface of the substrate. The first recess includes a first bottom surface and a first side surface connected to the first bottom surface, and the light emitting element is disposed on the first bottom surface. The second recess includes a second bottom surface and a second side surface connected to the second bottom surface, and the wire is bonded to the second bottom surface. Both of the first side surface and the second side surface reach the common surface. The first side surface is connected to both of the second bottom surface and the second side surface. The opening area of the first recess is larger than the opening area of the second recess.

Abstract: An LED lighting apparatus is disclosed. The LED lighting apparatus includes a board having a principal surface, a plurality of LED chips mounted on the principal surface of the board, and a wiring pattern which is formed on the principal surface of the board and makes electrical conduction with the plurality of LED chips. Further, the LED lighting apparatus includes a frame-like bank which is provided on the principal surface of the board and surrounds the plurality of LED chips. In this case, the wiring pattern has one or more pads having a first portion interposed between the bank and the plurality of LED chips. The LED lighting apparatus further includes a protective layer covering at least a portion of the pads.

Abstract: A light emitting unit includes: a light emitting element; a first lead having a first principal surface on which the light emitting element is disposed, a first rear surface configured to face opposite the first principal surface, and a first side configured to connect the first principal surface and the first rear surface; a second lead having a second side configured to face the first side; and a first resin molding body configured to hold the first lead and the second lead. The first resin molding body covers the first principal surface to expose a region of the first principal surface where the light emitting element is disposed, and at least a portion of the first side is exposed from the first resin molding body.

Abstract: A light emitting device includes a light emitting element, a wire connected to the light emitting element, and a substrate supporting the light emitting element. The substrate is formed with a first recess and a second recess that are open in a common surface of the substrate. The first recess includes a first bottom surface and a first side surface connected to the first bottom surface, and the light emitting element is disposed on the first bottom surface. The second recess includes a second bottom surface and a second side surface connected to the second bottom surface, and the wire is bonded to the second bottom surface. Both of the first side surface and the second side surface reach the common surface. The first side surface is connected to both of the second bottom surface and the second side surface. The opening area of the first recess is larger than the opening area of the second recess.

Abstract: An infrared data communication module (A1) includes a substrate (1) consisting of a first layer (1A) and a second layer (1B), where the first layer is formed with a recess (11) open at its obverse surface, and includes the opening of the recess (11) and the second layer is fixed to the first layer (1A) on the side opposite from the opening. The module also includes a bonding conductor layer (6A) covering at least the bottom surface of the recess (11), a light emitting element (2) mounted on the bonding conductor layer (6A), and a heat dissipating conductor layer (6C) sandwiched between the first layer (1A) and the second layer (1B) and connected to the bonding conductor layer (6A).

Abstract: An LED light source unit for a backlight of a liquid crystal display is provided. The light source unit includes a plurality of LED chips, an insulating substrate, and a metal film covering a principal surface of the substrate. The LED chips are mounted on the metal film. With this arrangement, brightness of the light source unit is enhanced.

Abstract: A tilt sensor capable of detecting more diverse orientations is to be provided. The tilt sensor includes a light emitting element and a plurality of photodetectors, a rolling element, and a hollow portion that accommodates the rolling element so as to allow the rolling element to roll in all of x-, y-, and z-direction, and to locate the rolling element, according to a direction of the gravity, at one of detecting positions including a complete blocking position that inhibits light from the light emitting element from reaching any of the photodetectors, a plurality of partial blocking positions that inhibits the light from the light emitting element from reaching at least one but not all of the photodetectors, and a nonblocking position that permits the light from the light emitting element to reach all of the photodetectors, and two of the detecting positions are each located on a respective end portion of the hollow portion in the x-, y-, and z-direction.

Abstract: A linear light source device illuminates a document properly, and an image reading device includes such a light source device. The light source device includes a light source and a light-guiding member. The light-guiding member introduces the light emitted from the light source from one end portion in x-direction, cause the light to travel in x-direction, and emits the light from a light exit portion at one end in z-direction, which is orthogonal to x-direction. The light-guiding member includes, at the other end in z-direction, a light-reflecting portion that reflects light to the light exit portion. One end face of the light-guiding member in y-direction, which is orthogonal to x- and z-directions, is inclined so as to become closer to the other end face in y-direction with decreasing distance from the light exit portion in z-direction. This allows light to easily travel to the light-reflecting portion.

Abstract: A reflection-type photointerrupter of the present invention includes a substrate, a light emitting element and a light receiving element. The substrate includes a first surface, a second surface opposite the first surface, and a first and a second recesses that are open in the first surface side. The light emitting element is arranged in the first recess, while the light receiving element is arranged in the second recess. The light emitting element is capable of emitting light. The light receiving element is capable of receiving the light emitted from the light emitting element and reflected by an object to be detected.

Abstract: A tilt sensor includes a light emitting element and two light receiving elements accommodated in a case. The case is formed with an inner space in which a rolling member is provided in a freely movable manner by the pulling force of gravity. A cover plate is fixed to the case to close the inner space. The cover plate is provided with an irregular, inner ceiling surface that is exposed to the inner surface so as to come into sliding contact with the rolling member.

Abstract: A light emitting device includes a light emitting element, a wire connected to the light emitting element, and a substrate supporting the light emitting element. The substrate is formed with a first recess and a second recess that are open in a common surface of the substrate. The first recess includes a first bottom surface and a first side surface connected to the first bottom surface, and the light emitting element is disposed on the first bottom surface. The second recess includes a second bottom surface and a second side surface connected to the second bottom surface, and the wire is bonded to the second bottom surface. Both of the first side surface and the second side surface reach the common surface. The first side surface is connected to both of the second bottom surface and the second side surface. The opening area of the first recess is larger than the opening area of the second recess.

Abstract: A tilt sensor capable of detecting more diverse orientations is to be provided. The tilt sensor includes a light emitting element and a plurality of photodetectors, a rolling element, and a hollow portion that accommodates the rolling element so as to allow the rolling element to roll in all of x-, y-, and z-direction, and to locate the rolling element, according to a direction of the gravity, at one of detecting positions including a complete blocking position that inhibits light from the light emitting element from reaching any of the photodetectors, a plurality of partial blocking positions that inhibits the light from the light emitting element from reaching at least one but not all of the photodetectors, and a nonblocking position that permits the light from the light emitting element to reach all of the photodetectors, and two of the detecting positions are each located on a respective end portion of the hollow portion in the x-, y-, and z-direction.

Abstract: A semiconductor module (A1) comprises a semiconductor device (10) provided with a semiconductor chip, and a conductive cover (6) for electromagnetic shielding bonded to the semiconductor device (10) via an adhesive coat (8). The conductive cover (6) includes a surface facing the adhesive coat (8), and the surface is formed with a convex portion (6a) protruding toward the adhesive coat (8). Around the convex portion (6a), a space (7) is formed for filling in adhesive to form the adhesive coat (8).

Abstract: A reflection-type photointerrupter of the present invention includes a substrate, a light emitting element and a light receiving element. The substrate includes a first surface, a second surface opposite the first surface, and a first and a second recesses that are open in the first surface side. The light emitting element is arranged in the first recess, while the light receiving element is arranged in the second recess. The light emitting element is capable of emitting light. The light receiving element is capable of receiving the light emitted from the light emitting element and reflected by an object to be detected.

Abstract: A tilt sensor includes a light emitting element and two light receiving elements accommodated in a case. The case is formed with an inner space in which a rolling member is provided in a freely movable manner by the pulling force of gravity. A cover plate is fixed to the case to close the inner space. The cover plate is provided with an irregular, inner ceiling surface that is exposed to the inner surface so as to come into sliding contact with the rolling member.

Abstract: A light receiving module includes a substrate, a light receiving element mounted on the substrate, a resin package covering the light receiving element, and a shield cover into which the resin package is inserted in an insertion direction. The shield cover includes first and second press plates configured to press the resin package in two different directions that are perpendicular to the insertion direction. The first press plate and the second press plate include a first end and a second end, respectively, which are adjacent but different in position in the insertion direction.

Abstract: An infrared data communication module (A1) includes a substrate (1) consisting of a first layer (1A) and a second layer (1B), where the first layer is formed with a recess (11) open at its obverse surface, and includes the opening of the recess (11) and the second layer is fixed to the first layer (1A) on the side opposite from the opening. The module also includes a bonding conductor layer (6A) covering at least the bottom surface of the recess (11), a light emitting element (2) mounted on the bonding conductor layer (6A), and a heat dissipating conductor layer (6C) sandwiched between the first layer (1A) and the second layer (1B) and connected to the bonding conductor layer (6A).

Abstract: A semiconductor module (A1) comprises a semiconductor device (10) provided with a semiconductor chip, and a conductive cover (6) for electromagnetic shielding bonded to the semiconductor device (10) via an adhesive coat (8). The conductive cover (6) includes a surface facing the adhesive coat (8), and the surface is formed with a convex portion (6a) protruding toward the adhesive coat (8). Around the convex portion (6a), a space (7) is formed for filling in adhesive to form the adhesive coat (8).

Abstract: An electronic component includes an electronic element, an electrode formed on the electronic element, a connection target connected to the electrode, and a wire for connecting the electrode and the connection target to each other. A first bump and a second bump are formed on the electrode. The wire includes a crown-shaped, first bonding end and a wedge-shaped, second bonding end. The crown-shaped bonding end is held in contact with the connection target, while the wedge-shaped bonding end is sandwiched between the first bump and the second bump.

Abstract: A light receiving module includes a substrate, a light receiving element mounted on the substrate, a resin package covering the light receiving element, and a shield cover into which the resin package is inserted in an insertion direction. The shield cover includes first and second press plates configured to press the resin package in two different directions that are perpendicular to the insertion direction. The first press plate and the second press plate include a first end and a second end, respectively, which are adjacent but different in position in the insertion direction.