Abstract: An optical communication module (A) of the present invention includes a substrate (1) having an elongated rectangular shape, a light emitting element (2) and a light receiving element (3) mounted on the substrate (1) to be arranged side by side in the longitudinal direction of the substrate, a resin package (5) which includes two lens portions (51, 52) respectively projecting in front of the light emitting element (2) and the light receiving element (3) and covers the light emitting element (2) and the light receiving element (3), and a shield case (6) for shielding the light emitting element (2) and the light receiving element (3) from electromagnetic waves and light. The optical communication module includes a surface extending in the longitudinal direction and serving as a mount surface for mounting on a mounting board (B).

Abstract: An infrared data communication module includes a substrate on which a wiring pattern including a pad member is disposed, a light emitting element bonded to the pad member, a light receiving element mounted on the substrate, an integrated circuit element for controlling driving of the light emitting element and the light receiving element, a protective resin member for shielding the light emitting element, and a resin package for shielding the light emitting element, the light receiving element, and the integrated circuit element. The infrared data communication module further includes an annular resin film for inwardly surrounding the light emitting element in a planar direction of the substrate. The resin film includes an outer peripheral end and an inner peripheral end. An outer peripheral end of the protective resin member coincides with the outer peripheral end of the resin film, or is formed at a position closer to the light emitting element than the outer peripheral end of the resin film.

Abstract: An infrared data communication module includes a substrate having a surface on which a light emitting element, a light receiving element, and an IC element are mounted. A resin package is formed on the substrate for integrally enclosing the light emitting element, the light receiving element and the IC element. A shield member is formed within the resin package for covering the IC element to prevent light-attributable noises from reaching the IC element.

Abstract: Disclosed is an infrared data communication module (1) comprising an infrared light-emitting device (3), an infrared light-receiving device (4) and an IC chip (5). The light-emitting device (3), light-receiving device (4) and IC chip (5) are mounted on a substrate (2) and covered with a sealing resin package (6). The substrate (2) is provided with a recessed portion (22) whose innner surface is covered with a ground-connected metal film (7), and the light-emitting device (3) is arranged in the recessed portion (22).

Abstract: An infrared communication module (A1) includes a sealing resin member (5) formed with an inclined surface (5b) positioned adjacent to a lens (5a) and inclined in both of the x direction in which an LED (2) and a photodiode (3) are arranged side by side and the y direction extending from the LED (2) to the lens (5a). The light refracted upon passing through the inclined surface (5b) is received by the photodiode (3). With this arrangement, the size of the infrared communication module (A1) can be reduced.

Abstract: An infrared data communication module (A) includes a substrate (1) having a surface (1a) for mounting a group (E) of components including a light emitting element (2), a light receiving element (3) and an IC element (4), and a molded body (5) formed of a molding resin to cover the entire surface (1a) of the substrate (1) for sealing the group (E) of components. The surface (1a) of the substrate (1) is formed with one or a plurality of jumper pads (11a, 11b) formed by plating a conductive film with gold. Each jumper pad (11a, 11b) is partially or entirely spaced from an edge of the substrate.

Abstract: A method of making an infrared data communication module includes the steps of: forming predetermined wiring patterns on an obverse and a reverse surfaces (10a, 10b) of a substrate (1); mounting, on one of the surfaces of the substrate (1), a group of components including plural sets of light emitting elements (2) and light receiving elements (3); resin-packaging the group of components mounted on the substrate (1); and dividing the resin-packaged components to provide a plurality of infrared data communication modules (4) each of which includes a respective set of light emitting element and light receiving element. The resin-packaging step includes forming a plurality of mutually separated resin packages (4) each of which collectively seals at least two sets of light emitting elements (2) and light receiving elements (3).

Abstract: An IC-card module (A) to be incorporated in an IC-card (B) includes a substrate (1), an IC chip (2) mounted on the substrate, and a protective member (4) bonded to the substrate (1) to cover the IC chip (2). A clearance (S) is provided between the protective member (4) and the IC chip (2) for avoiding direct contact of the protective member (4) with the IC chip (2). The clearance (S) is loaded with a filler (6) having a low modulus of elasticity, as required. The protective member (4) includes a reinforcing member (8).

Abstract: An electromagnetic shield cap (3) includes a projection (34) which is pressed against an electronic component (1) with an elastic force when the cap is mounted to the electronic component (1). Since the projection (34) is pressed against the electronic component (1), the electromagnetic shield cap (3) is prevented from being detached from the electronic component (1). Therefore, it is possible to eliminate the necessity for bonding the electromagnetic shield cap (3) to the electronic component (1) with an adhesive.

Abstract: An infrared data communication module includes a substrate having a surface on which a light emitting element, a light receiving element, and an IC element are mounted. A resin package is formed on the substrate for integrally enclosing the light emitting element, the light receiving element and the IC element. A shield member is formed within the resin package for covering the IC element to prevent light-attributable noises from reaching the IC element.

Abstract: An infrared data communication module (A) includes a substrate (1) having a surface (1a) for mounting a group (E) of components including a light emitting element (2), a light receiving element (3) and an IC element (4), and a molded body (5) formed of a molding resin to cover the entire surface (1a) of the substrate (1) for sealing the group (E) of components. The surface (1a) of the substrate (1) is formed with one or a plurality of jumper pads (11a, 11b) formed by plating a conductive film with gold. Each jumper pad (11a, 11b) is partially or entirely spaced from an edge of the substrate.

Abstract: In the method of manufacturing an IC module (1) including a resin packaging process using upper and lower dies (5) for forming a cavity (50) while the dies are clamped, the resin packaging process is carried out by introducing a melted resin while a substrate (2) on which an IC chip (3) is placed and a coil (20A) which has a doughnut shape when observed from above and is flattened as a whole are housed in the cavity (50). When a substrate (2) on which an antenna coil (20) is patterned is to be packaged with a resin, the resin packaging process is carried out by forming a spacer (28) having an equal and almost equal height to the height of the cavity (50) on the substrate (2), housing it in the cavity (50), and introducing a melted resin. Instead of forming the spacer (28) on the substrate (2), a substrate (2) housed in a cavity (50) may be sucked. The manufacturing method can provide good protection of an IC chip and an antenna coil.

Abstract: A manufacturing method includes the steps of integrally fabricating a plurality of circuit elements (41) on a substrate (1a), forming electrode bumps (11) on electrode pads (11b) conducting with circuit elements (41), forming a scribe line or a scribe line mark (21a) at a prescribed position of substrate (1a), and sticking an anisotropically conductive film (30) to cover each of the electrode bumps (11) and the scribe line or the scribe line mark (21a). The step of forming the electrode bumps (11) and the step of forming the scribe line or the scribe line mark (21a) are performed simultaneously. The electrode bumps (11) and the scribe line or the scribe line mark (21a) are preferably formed of gold. By the manufacturing method, even when an anisotropically conductive film is stuck on a semiconductor wafer having a plurality of circuit elements formed, the circuit elements can be diced as desired.

Abstract: An IC module incorporated in an IC-card includes a substrate, an IC chip mounted on the substrate, and an antenna coil electrically connected to the IC chip. The antenna coil includes a conductive film which is patterned on a surface of the substrate, thereby facilitating fabrication of the IC module while realizing a thickness reduction of the IC module.