Abstract: A transmission line includes a substrate, a high-frequency signal transmission line, a differential signal transmission line, and a power supply line. The substrate is insulating, extends in a predetermined direction, and internally includes each of the high-frequency signal transmission line, the differential signal transmission line, and the power supply line. The power supply line and the high-frequency signal transmission line are in parallel or substantially in parallel to each other, and the differential signal transmission line is between the power supply line and the high-frequency signal transmission line.

Abstract: An electronic device includes a circuit boards that have a same or substantially same shape, and flat cables that have a same or substantially same shape. The circuit boards are provided in a predetermined arrangement and are connected by the flat cables. Each of the flat cables is a semi-rigid cable, having a shape in accordance with the predetermined arrangement of the circuit boards.

Abstract: A flexible substrate includes a base substrate that has flexibility, connecting portions on the base substrate and connectible to an antenna substrate and a circuit substrate, and a first line and a second line at the base substrate and connected to the connecting portions. The first line and the second line include a first region in which the first line and the second line extend in parallel or substantially in parallel with each other, and a second region in which the first line and the second line are closer to each other than in the first region and coupled to each other, and the second region defines a directional coupler.

Abstract: A resin multilayer board includes an insulating substrate including a first main surface and mounting electrodes only on the first main surface. The insulating substrate includes first and second resin layers that are laminated. The Young's modulus of the second resin layers is higher than that of the first resin layers. The first and second resin layers are arranged in a distributed manner along a lamination direction of the first and second resin layers. The insulating substrate includes a first and second portions that are two equally divided portions of the insulating substrate in the lamination direction and are respectively positioned closer to the first main surface and farther from the first main surface, and a volume ratio of the second resin layers in the first portion is higher than a volume ratio of the second resin layers in the second portion.

Abstract: A transmission line board includes an insulating substrate including a first principal surface, first and second signal lines, first and second signal electrodes, which are provided at the insulating substrate. The first signal electrode is connected to the first signal line, and is connected by capacitive coupling to a different circuit board. The second signal electrode is connected to the second signal line, and is connected to the different circuit board via a conductive binder. The first signal line is provided to transmit a signal in a first frequency band, and the second signal line is provided to transmit a signal in a second frequency band lower than the first frequency band.

Abstract: A multilayer substrate includes a laminate, first and second signal lines, first and second ground conductors, and interlayer connection conductors. The first and second signal lines extend along a transmission direction and include parallel extending portions that extend in parallel or substantially in parallel with each other. The first and second ground conductors sandwich the first and second signal lines in a laminating direction. The first and second ground conductors respectively include a first opening and a third opening between the signal lines when viewed from the laminating direction, and respectively include second openings and fourth openings disposed outside in a width direction orthogonal or substantially orthogonal to the transmission direction in the parallel extending portions when viewed from the laminating direction. The interlayer connection conductors are disposed in the transmission direction and at least between the signal lines.

Abstract: A high frequency circuit module includes a variable inductance circuit portion and a reactance circuit portion. The variable inductance circuit portion is connected between an antenna port and ground. The variable reactance circuit is connected between the antenna port and a front-end port. The variable inductance circuit portion includes a first inductor, a second inductor, and a switch. The first inductor is connected between the antenna port and the ground. The second inductor and the switch are connected in series, and this series circuit is connected in parallel to the first inductor.

Abstract: A low-frequency radiating element and a high-frequency radiating element are configured so as to respectively operate in a relatively low frequency band and a relatively high frequency band that are non-contiguous with each other. A matching circuit is inserted between a transmission/reception circuit and a branching point. A high-frequency variable reactance circuit is inserted between the branching point and the high-frequency radiating element. A low-frequency variable reactance circuit is inserted between the branching point and the low-frequency radiating element. The high-frequency variable reactance circuit and the low-frequency variable reactance circuit are configured such that their reactances can be adjusted independently of each other.

Abstract: A power supply control IC is mounted on a surface of a multilayer body that defines a power supply control circuit module. A first inner-layer electrode connecting an inductor element and a switching regulator element for the power supply control IC, another first inner-layer electrode connecting the inductor element and a capacitor element, and still another first inner-layer electrode connecting the switching regulator element and the capacitor element are located on upper layer regions of the multilayer body and are routed in between a mounting area of the power supply control IC and a peripheral wall of the multilayer body. The first inner-layer electrodes have widths that are wider than those of second inner-layer electrodes which are located near a center region of the multilayer body and transmit control signals.

Abstract: A high frequency circuit module includes a variable inductance circuit portion and a reactance circuit portion. The variable inductance circuit portion is connected between an antenna port and ground. The variable reactance circuit is connected between the antenna port and a front-end port. The variable inductance circuit portion includes a first inductor, a second inductor, and a switch. The first inductor is connected between the antenna port and the ground. The second inductor and the switch are connected in series, and this series circuit is connected in parallel to the first inductor.

Abstract: In a power source control circuit module, switching regulator devices and a linear regulator device are mounted on a surface of a laminated body so as to be spaced from each other. In an interface between dielectric layers of the laminated body, first to fifth internal ground electrodes separated by an electrode non-formation portion are provided. The first, second, fourth, and fifth internal ground electrode are connected to the respective switching regulator devices. The third internal ground electrode is connected to the linear regulator device. The first to fifth internal ground electrodes are connected to respective different external ground terminals.

Abstract: A low-frequency radiating element and a high-frequency radiating element are configured so as to respectively operate in a relatively low frequency band and a relatively high frequency band that are non-contiguous with each other. A matching circuit is inserted between a transmission/reception circuit and a branching point. A high-frequency variable reactance circuit is inserted between the branching point and the high-frequency radiating element. A low-frequency variable reactance circuit is inserted between the branching point and the low-frequency radiating element. The high-frequency variable reactance circuit and the low-frequency variable reactance circuit are configured such that their reactances can be adjusted independently of each other.

Abstract: A power supply control IC is mounted on a surface of a multilayer body that defines a power supply control circuit module. A first inner-layer electrode connecting an inductor element and a switching regulator element for the power supply control IC, another first inner-layer electrode connecting the inductor element and a capacitor element, and still another first inner-layer electrode connecting the switching regulator element and the capacitor element are located on upper layer regions of the multilayer body and are routed in between a mounting area of the power supply control IC and a peripheral wall of the multilayer body. The first inner-layer electrodes have widths that are wider than those of second inner-layer electrodes which are located near a center region of the multilayer body and transmit control signals.

Abstract: In a power source control circuit module, switching regulator devices and a linear regulator device are mounted on a surface of a laminated body so as to be spaced from each other. In an interface between dielectric layers of the laminated body, first to fifth internal ground electrodes separated by an electrode non-formation portion are provided. The first, second, fourth, and fifth internal ground electrode are connected to the respective switching regulator devices. The third internal ground electrode is connected to the linear regulator device. The first to fifth internal ground electrodes are connected to respective different external ground terminals.

Abstract: In a variable capacitance module capable of achieving necessary variable capacitance ranges, a variable capacitance circuit includes a variable capacitance element and fixed capacitance elements. A first variable capacitance element and a first fixed capacitance element are connected in series, and the series circuit thereof and a second fixed capacitance element are connected in parallel. Accordingly, with reference to the capacitance of the second fixed capacitance element, the range of the combined capacitance of the variable capacitance circuit is provided by a step size of capacitance based on the combined capacitance of the variable capacitance element and the first fixed capacitance element. The first and second fixed capacitance elements are defined by inner-layer flat-plate electrodes in a laminated substrate, and the variable capacitance element is defined by an MEMS element mounted on a top surface of the laminated substrate.

Abstract: In a variable capacitance module capable of achieving necessary variable capacitance ranges, a variable capacitance circuit includes a variable capacitance element and fixed capacitance elements. A first variable capacitance element and a first fixed capacitance element are connected in series, and the series circuit thereof and a second fixed capacitance element are connected in parallel. Accordingly, with reference to the capacitance of the second fixed capacitance element, the range of the combined capacitance of the variable capacitance circuit is provided by a step size of capacitance based on the combined capacitance of the variable capacitance element and the first fixed capacitance element. The first and second fixed capacitance elements are defined by inner-layer flat-plate electrodes in a laminated substrate, and the variable capacitance element is defined by an MEMS element mounted on a top surface of the laminated substrate.

Abstract: An antenna device having a feeder electrode that extends linearly on a top surface of a dielectric substrate. A balanced electrode having two balanced transmission electrodes vertical to the extending direction of the feeder electrode and extending in parallel. The two balanced transmission electrodes are connected to the feeder electrode and separated by an interval of ½ of a wavelength of a transmission/reception signal. A radiation electrode having a first electrode connected to the one of the two balanced transmission electrodes and a second electrode connected to the other of the two balanced transmission electrodes and is positioned parallel to the feeder electrode. A waveguide electrode is formed at a position separated from the radiation electrode by a predetermined interval and in parallel to the radiation electrode. A ground electrode is formed at an area of a back surface of the dielectric substrate corresponding to an area including a portion where the feeder electrode is positioned.

Abstract: An array antenna includes a first end portion that has a first plurality of antennas arranged with a spacing d therebetween and a second end portion that has a second plurality of antennas arranged with the spacing d therebetween. In the array antenna, a spacing between respective antennas in both the first and second end portions and are closest to a central portion is set to 2d, which is a value obtained from multiplying 2, which is the number of the antennas constituting each of both end portions, by the spacing d for both end portions. The antennas in the antenna array are continuously selected as a transmitting antenna by switching, and continuously emit transmission signals. The antennas in the antenna array are also successively selected as a receiving antenna by switching. In this way, by switching between transmission and reception of the antennas of the antenna array, nine reception channels CH1 through CH9 that are arranged with a uniform phase difference therebetween are obtained.

Abstract: An array antenna includes a first end portion that has a first plurality of antennas arranged with a spacing d therebetween and a second end portion that has a second plurality of antennas arranged with the spacing d therebetween. In the array antenna, a spacing between respective antennas in both the first and second end portions and are closest to a central portion is set to 2d, which is a value obtained from multiplying 2, which is the number of the antennas constituting each of both end portions, by the spacing d for both end portions. The antennas in the antenna array are continuously selected as a transmitting antenna by switching, and continuously emit transmission signals. The antennas in the antenna array are also successively selected as a receiving antenna by switching. In this way, by switching between transmission and reception of the antennas of the antenna array, nine reception channels CH1 through CH9 that are arranged with a uniform phase difference therebetween are obtained.

Abstract: An antenna device having a primary radiator that includes a transmitting section formed of a cylindrical waveguide extending parallel to a direction in which the front of the antenna device faces (front direction), and a rectangular horn-shaped radiant section extending perpendicular to the front direction. A waveguide whose central axis in the extending direction corresponds to that of the transmitting section of the primary radiator is connected to an end of the transmitting section via a rotary joint so as to be rotatable. A first reflector is of an offset parabolic type, and is disposed above the primary radiator in a predetermined position with respect to the primary radiator such that a predetermined directivity is obtained. A second reflector is parabolic in the vertical direction, and is toric in the horizontal direction. The second reflector is disposed below the primary radiator in a predetermined position with respect to the primary radiator such that a predetermined directivity is obtained.