Abstract: Provided is a method of manufacturing a spring for inspecting the stress distribution of the spring under load. The method for manufacturing a spring (1) includes the steps of applying a load to the spring (1), measuring the stress of the spring (1) under the load, and releasing the load applied to the spring (1), the measuring the stress of the spring (1) being made by measuring the stress on the surface of the active part of the spring (1) using X-ray diffraction with the cos ? method, and the method further including the step of determining whether the magnitude of the stress of the spring (1) meets a criterion.

Abstract: A joint method includes a groove formation step of removing part of a first projection and part of the second projection to form a groove region between the first projection and the second projection, a first welding step of joining a first member and a second member to each other by butt welding, and a second welding step of filling the groove region by buildup welding. The groove formation step forms a first inclined surface in the first projection facing the groove region to be gradually distant from a joint position joined with the second projection so as to be closer to an outer surface of the first projection, and forms a second inclined surface in the second projection facing the groove region to be gradually distant from the joint position joined with the first projection so as to be closer to an outer surface of the second projection.

Abstract: The present technology relates to a light detection device and an electronic apparatus capable of increasing sensitivity of a specific pixel. The light detection device includes a pixel array unit in which a plurality of pixels is regularly arranged, the plurality of pixels including a first pixel and a second pixel, the first pixel including at least a photodiode and one or more pixel transistors, the second pixel including at least a photodiode larger in size than the photodiode of the first pixel, in which the pixel transistor in the first pixel is shared by the first pixel and the second pixel. The present technology may be applied to image sensors and the like, for example.

Abstract: A printing apparatus includes a head including a plurality of nozzles configured to discharge liquid to a medium, an abnormal nozzle detection unit configured to detect an abnormal nozzle having a discharging defect among the plurality of nozzles, a contact detection unit configured to detect contact between the head and the medium, a suction unit configured to perform an ejection operation of ejecting the liquid from the plurality of nozzles, and a control unit. The control unit executes a suction operation when the abnormal nozzle is detected and the contact between the head and the medium is detected, and the control unit executes a printing of complementing the abnormal nozzle when the abnormal nozzle is detected and the contact between the head and the medium is not detected.

Abstract: Provided is an electronic device that decreases a width of a bezel, and restricts a decrease in an image quality of an image captured with a camera. The electronic device includes: a displaying unit; and a capture unit arranged on a side opposite a displaying surface of the displaying unit. The capture unit includes: a plurality of photoelectric-conversion units that converts light that has been made to enter through the displaying unit into electricity; and a plurality of polarization elements arranged on a light entering side of at least one photoelectric-conversion unit of the plurality of photoelectric-conversion units.

Abstract: A solid-state imaging device according to an embodiment includes: a plurality of pixels, each of the plurality of pixels including a substrate having a first surface serving as a light incident surface, a photoelectric conversion unit located inside the substrate, a light shielding unit provided on a first surface side, the light shielding unit having a hole portion configured to allow light to be incident on the photoelectric conversion unit, and a first lens made of silicon, the first lens being provided on the light shielding unit and condensing incident light toward the hole portion.

Abstract: A component mounter includes a pickup member configured to pick up a component, and a control device. When a predetermined error occurs after a pickup operation that picks up the component is performed by the pickup member, the control device stops production in a state where the component, which is a target of an error, is held by the pickup member, in a case where a number of boards produced from a start of production is within a predetermined number of the boards, performs a retry operation that discards the component picked up by the pickup member and picks up a new component, in a case where the number of the boards produced from the start of production exceeds the predetermined number of the boards, and stops production when the error is not resolved even if the retry operation is performed.

Abstract: An imaging apparatus including (A) an imaging lens; and (B) an image sensor array in which a plurality of image sensor units are arrayed, wherein, a single image sensor unit includes a single microlens and a plurality of image sensors light passing through the imaging lens and reaching each image sensor unit passes through the microlens and forms an image on the plurality of image sensors constituting the image sensor unit, an inter-unit light shielding layer is formed between the image sensor units themselves, and a light shielding layer is not formed between the image sensor units which constitute the image sensor unit.

Abstract: Image quality is to be improved in a solid-state image pickup element that performs time delay integration. A correlated double sampling circuit generates a frame in which a predetermined number of lines each including a plurality of digital signals are arranged. A TDI frame memory retains a (K?1)-th frame generated before a K-th frame. A time delay integration circuit performs time delay integration processing of adding the line having a predetermined address in the K-th frame and the line having an address at a certain distance from the predetermined address in the (K?1)-th frame.

Abstract: An imaging apparatus including an imaging lens, and an image sensor array of first and second image sensor units, wherein a single first image sensor unit includes a single first microlens and a plurality of image sensors, a single second image sensor unit includes a single second microlens and a single image sensor, light passing through the imaging lens and reaching each first image sensor unit passes through the first microlens and forms an image on the image sensors constituting the first image sensor unit, light passing through the imaging lens and reaching each second image sensor unit passes through the second microlens and forms an image on the image sensor constituting the second image sensor unit, an inter-unit light shielding layer is formed between the image sensor units, and a light shielding layer is not formed between the image sensor units constituting the first image sensor unit.

Abstract: There is provided a method of manufacturing an imaging device including a plurality of imaging elements in an imaging area, where each imaging element includes a photoelectric conversion unit in a substrate and a wire grid polarizer arranged at a light-incident side of the photoelectric conversion unit. The method generally includes forming the wire grid polarizer that includes a plurality of stacked strip-shaped portions, where each of the plurality of stacked strip-shaped portions includes a portion of a light-reflecting layer and a portion of a light-absorbing layer. The light-reflecting layer may include a first electrical conducting material that is electrically connected to at least one of the substrate or the photoelectric conversion unit. The light-absorbing layer may include a second electrical conducting material, where at least a portion of the light-absorbing layer is in contact with the light-reflecting layer.

Abstract: An image capturing device (100) includes an image capturing unit (110), an acquisition unit (131), an additional information imparting unit (132), and an output unit (133). The image capturing unit (110) extends straight in a longitudinal direction. The acquisition unit (131) acquires line data from the image capturing unit (110). The additional information imparting unit (132) imparts first additional information to the line data that is a head line of a frame out of a plurality of the line data to generate output line data. The output unit (133) outputs the output line data.

Abstract: A substrate height measuring device includes an imaging section, a setting section, and a measurement section. The imaging section allows an imaging device to image a region of at least a part of a clamped substrate, the region including a measurement planned position at which a height of the substrate is to be measured. The setting section allows a display device to display a substrate image imaged by the imaging section and adjusts a measurement position at which the height of the substrate is actually measured based on the measurement planned position of the substrate image displayed on the display device to set the measurement position. The measurement section allows a measurement device to measure the height of the substrate at the measurement position set by the setting section.

Abstract: An information processing apparatus, an information processing method, and a non-transitory recording medium. The information processing apparatus determines an external device with maximum capacity among a plurality of external devices with non-volatile storage media for storing log information, changes an amount of log information according to a capacity of the external device with the maximum capacity, and outputs the log information to the external device with the maximum capacity.

Abstract: Pixel sensitivity is improved in a solid-state imaging element that performs time delay integration. The solid-state imaging element includes a plurality of photoelectric conversion elements and a given number of transistors. In the solid-state imaging element, the plurality of photoelectric conversion elements is arranged along a given direction with a given spacing. A size, in the given direction, of each of the plurality of photoelectric conversion elements that are arranged with the given spacing does not exceed the given spacing. Also, in the solid-state imaging element, the given number of transistors are arranged between the plurality of photoelectric conversion elements, and the transistors generate a signal commensurate with as amount of charge generated by any of the plurality of photoelectric conversion elements.

Abstract: An electrified vehicle system includes an electric motor coupled to a drive wheel via a plurality of power transmission components and a control device. The control device is configured to act as: a feedforward control section configured based on a transfer function simulating vibration transmission characteristics of a power transmission system, receiving as an input a required torque of the electric motor from a driver, and outputting a base command torque of the electric motor; a timing estimation section estimating, based on information on the power transmission system, a timing at which a backlash between the plurality of power transmission components is eliminated; and a torque correction section applying, to the base command torque, a correction torque for reducing a vibration generated in the power transmission system due to elimination of the backlash, in response to an arrival of the timing estimated by the timing estimation section.

Abstract: The speed of AD conversion is to be improved in a solid-state imaging device that performs time delay integration. A solid-state imaging device includes: a pair of photoelectric conversion elements; a pair of floating diffusion layers; and a transfer unit that switches the transfer destination of each of the pair of photoelectric conversion elements to one of the pair of floating diffusion layers, and transfers electric charges to the transfer destination. In the solid-state imaging device including the pair of photoelectric conversion elements, the pair of floating diffusion layers, and the transfer unit, the transfer unit switches the transfer destination of each of the pair of photoelectric conversion elements to one of the pair of floating diffusion layers, and transfers electric charges to the transfer destination.

Abstract: Image quality is to be improved in a solid-state image pickup element that performs time delay integration. A correlated double sampling circuit generates a frame in which a predetermined number of lines each including a plurality of digital signals are arranged. A TDI frame memory retains a (K?1)-th frame generated before a K-th frame. A time delay integration circuit performs time delay integration processing of adding the line having a predetermined address in the K-th frame and the line having an address at a certain distance from the predetermined address in the (K?1)-th frame.

Abstract: A component mounter includes a pickup member configured to pick up a component, and a control device. When a predetermined error occurs after a pickup operation that picks up the component is performed by the pickup member, the control device stops production in a state where the component, which is a target of an error, is held by the pickup member, in a case where a number of boards produced from a start of production is within a predetermined number of the boards, performs a retry operation that discards the component picked up by the pickup member and picks up a new component, in a case where the number of the boards produced from the start of production exceeds the predetermined number of the boards, and stops production when the error is not resolved even if the retry operation is performed.

Abstract: The purpose of the present disclosure is to improve the dynamic range of an image sensor including a polarization pixel. The image sensor includes: a high-sensitivity pixel group; and a low-sensitivity pixel group. The high-sensitivity pixel group included in the image sensor includes a plurality of high-sensitivity pixels. The low-sensitivity pixel group included in the image sensor includes a plurality of low-sensitivity pixels. A polarization unit that causes incident light in a predetermined polarization direction to be transmitted therethrough is disposed in part of pixels of at least the high-sensitivity pixel group, of the high-sensitivity pixel group and the low-sensitivity pixel group.