Abstract: A method of producing a rubber molded article, involving utilizing a compound different from a compound that has been used as a crosslinking agent. The method of producing a rubber molded article includes a crosslinking step of crosslinking a rubber component by decomposing a compound to be used as a crosslinking agent for the rubber component, the compound including a structure represented by the following formula (I), in a rubber composition containing the rubber component and the compound, the rubber composition including a sulfur content of 2.0 wt % or less: ?-?-? . . . (I) (in the formula (I), ? represents a monovalent organic group, ? represents —N?N—, and ? represents hydrogen or a monovalent organic group).

Abstract: In a semiconductor device, heat radiation plates are respectively disposed on a front surface side and a rear surface side of semiconductor chips in an upper arm and a lower arm. A lead-out conductor part includes a parallel conductor that includes a positive electrode terminal, a negative electrode terminal, and an insulating film disposed between the positive electrode terminal and the negative electrode terminal, and the positive electrode terminal and the negative electrode terminal are disposed oppositely while sandwiching the insulation film. The semiconductor chips are covered by a resin mold part, surfaces of the heat radiation plates opposite to the semiconductor chips, a part of the positive electrode terminal, and a part of the negative electrode terminal are exposed from the resin mold part, and at least a part of the parallel conductor in the lead-out conductor part enters the resin mold part.

Abstract: A semiconductor module is configured such that heat radiation substrates are connected to lead frames and semiconductor chips are directly connected to the lead frames so that the semiconductor chips are not connected to the lead frames through conductive portions of the heat radiation substrates. Therefore, the conductive portion can have a solid shape without being divided. As such, an occurrence of curving of the heat radiation substrates is suppressed when a temperature is reduced from a high temperature to a room temperature after resin-sealing at the high temperature or the like. Therefore, connection between the semiconductor chip and the lead frames and connection between the lead frames and the heat radiation substrates enhance.

Abstract: A light and inexpensive heat storage member applicable to spacecrafts is provided. The heat storage member includes a honeycomb structural body having a plurality of cells. Each of the cells is filled with a capsule, which contains a heat storage material, and a heat conductive filler. The heat storage member is provided by bringing a starting material that is a mixture of the capsule containing the heat storage material and the heat conductive filler into contact with the honeycomb structural body to cover at least one surface of the opening of the cells of the honeycomb structure body, subjecting the same to uniaxial pressure molding under the pressure of 4 MPa or more and 10 MPa or less, and filling each cell with the starting material.