Abstract: In a method of forming a metal wiring line, a first insulating film is formed directly or indirectly on a semiconductor substrate. A second insulating film is formed on the first insulating film. A wiring line groove is formed to pass through the second insulating film to an inside of the first insulating film. A conductive film is formed to fill the wiring line groove and to cover the second insulating film. The conductive film and the second insulating film are removed by a first CMP polishing process, using the first insulating film as a stopper film, until the first insulating film is exposed.

Abstract: Disclosed herein is an emulsifier or emulsifying composition which comprises one or more of the hydroxyalkyl or hydroxyalkenyl phosphates represented by the general formula (I) and/or (II): ##STR1## in which R represents an alkyl or alkenyl group of 5-21 carbon atoms, X.sub.1 and X.sub.2 independently represent a pair ion selected from the group consisting of hydrogen, alkali metal, ammonium, etc.The emulsifying composition according to the invention is highly safe to skin and widely usable in the emulsification of either W/O or O/W type.

Abstract: Disclosed herein is an emulsifying composition which comprises one or more of the alkyl or alkenyl glyceryl ether phosphate compounds represented by the formula (I) and/or (II): ##STR1## in which R represents a linear saturated or unsaturated hydrocarbon group having 8-20 carbon atoms, X.sub.1 and X.sub.2 are independently a pair ion selected from the group consisting of hydrogen, alkali metal, ammonium, alkylammonium which has an alkyl group having 1-5 carbon atoms, and alkanolamine which has a hydroxyalkyl group having 2 or 3 carbon atoms.The above emulsifying composition is high in safety against skin and can be widely used in either type of W/O or O/W emulsion.