Abstract: An imaging device includes a plurality of light-receiving elements arranged in a two-dimensional matrix shape. Each of the light-receiving elements includes a first electrode, a photoelectric conversion layer, and a second electrode. The photoelectric conversion layer has a laminated structure in which a first compound semiconductor layer having a first conductivity type and a second compound semiconductor layer having a second conductivity type that is a reverse conductivity type to the first conductivity type are laminated from a side of the first electrode. The second compound semiconductor layer has been removed in a region between the light-receiving elements. The first electrode and the first compound semiconductor layer are shared by the light-receiving elements. An impurity concentration of a first compound semiconductor layer near the first electrode is lower than that of a first compound semiconductor layer near the second compound semiconductor layer.

Abstract: A three-dimensional structure according to an embodiment of the present disclosure includes: a plurality of resin layers including a light curable resin, the light curable resin including a coloring compound, a color developing-reducing agent, and a photothermal conversion agent, the plurality of resin layers being stacked, the color developing-reducing agent having an average particle diameter of 10 ?m or more and 100 ?m or less.

Abstract: A three-dimensional structure according to an embodiment of the present disclosure includes a plurality of resin layers including a light curable resin, a coloring compound, a color developing-reducing agent, and a photothermal conversion agent, the plurality of resin layers being stacked.

Abstract: A light receiving element includes a surface recombination prevention layer composed of a first compound semiconductor on which light is incident; a photoelectric conversion layer composed of a second compound semiconductor; and a compound semiconductor layer composed of a third compound semiconductor, the surface recombination prevention layer having a thickness of 30 nm or less. Also, there are provided an image capturing element including the light receiving element, and an image capturing apparatus including the image capturing element.

Abstract: This light-receiving element includes: a substrate; a photoelectric conversion layer that is provided on the substrate and includes a first compound semiconductor, and absorbs a wavelength in an infrared region to generate electric charges; a semiconductor layer that is provided on the photoelectric conversion layer and includes a second compound semiconductor, and has an opening in a selective region; and an electrode that buries the opening of the semiconductor layer and is electrically coupled to the photoelectric conversion layer.

Abstract: This light-receiving element includes: a substrate; a photoelectric conversion layer that is provided on the substrate and includes a first compound semiconductor, and absorbs a wavelength in an infrared region to generate electric charges; a semiconductor layer that is provided on the photoelectric conversion layer and includes a second compound semiconductor, and has an opening in a selective region; and an electrode that buries the opening of the semiconductor layer and is electrically coupled to the photoelectric conversion layer.

Abstract: An imaging device includes a plurality of light-receiving elements arranged in a two-dimensional matrix shape. Each of the light-receiving elements includes a first electrode, a photoelectric conversion layer, and a second electrode. The photoelectric conversion layer has a laminated structure in which a first compound semiconductor layer having a first conductivity type and a second compound semiconductor layer having a second conductivity type that is a reverse conductivity type to the first conductivity type are laminated from a side of the first electrode. The second compound semiconductor layer has been removed in a region between the light-receiving elements. The first electrode and the first compound semiconductor layer are shared by the light-receiving elements. An impurity concentration of a first compound semiconductor layer near the first electrode is lower than that of a first compound semiconductor layer near the second compound semiconductor layer.

Abstract: An order reception apparatus according to an embodiment of the disclosure includes a receiving section and a transmitting section. The receiving section receives order information including identification information of a nail tip or a nail sticker, and user information. The transmitting section transmits the identification information and the user information received by the receiving section to a first external apparatus. Here, the first external apparatus corrects nail tip or nail slicker shape data corresponding to the identification information on the basis of measurement data of a nail corresponding to the user information, to thereby generate original nail tip or original nail sticker shape data.

Abstract: An imaging device includes a plurality of light-receiving elements arranged in a two-dimensional matrix shape. Each of the light-receiving elements includes a first electrode, a photoelectric conversion layer, and a second electrode. The photoelectric conversion layer has a laminated structure in which a first compound semiconductor layer having a first conductivity type and a second compound semiconductor layer having a second conductivity type that is a reverse conductivity type to the first conductivity type are laminated from a side of the first electrode. The second compound semiconductor layer has been removed in a reg between the light-receiving elements. The first electrode and the first compound semiconductor layer are shared by the light-receiving elements. An impurity concentration of a first compound semiconductor layer near the first electrode is lower than that of a first compound semiconductor layer near the second compound semiconductor layer.

Abstract: A nail production system according to an embodiment of the disclosure includes a first correction section and a first conversion section. The first correction section corrects shape data of an existing nail tip or an existing nail sticker on the basis of measurement data of a nail, to thereby generate shape data of an original nail tip or an original nail sticker. The first conversion section converts the shape data of the original nail tip or the original nail sticker that is generated by the first correction section into print data.

Abstract: A light receiving element according to an embodiment of the present disclosure includes a plurality of pixels, a photoelectric conversion layer common to the plurality of pixels, a first electrode layer provided on side of a light incident surface of the photoelectric conversion layer, and a light-shielding section embedded between the plurality of pixels adjacent to each other of the first electrode layer.

Abstract: A light receiving/emitting element 11 includes: a light receiving/emitting layer 21 in which a plurality of compound semiconductor layers are stacked; and an electrode 30 having a first surface 30A and a second surface 30B and made of a transparent conductive material, in which the second surface faces the first surface 30A, and the electrode is in contact, at the first surface 30A, with the light receiving/emitting layer 21. The transparent conductive material contains an additive made of one or more metals, or a compound thereof, selected from the group consisting of molybdenum, tungsten, chromium, ruthenium, titanium, nickel, zinc, iron, and copper, and concentration of the additive contained in the transparent conductive material near an interface to the first surface 30A of the electrode 30 is higher than concentration of the additive contained in the transparent conductive material near the second surface 30B of the electrode 30.

Abstract: An information processing system according to an embodiment of the technology includes: a plurality of first wireless communication units each having an identifier; and a second wireless communication unit that reads out the identifier from each of the plurality of first wireless communication units combined from among the plurality of first wireless communication units. The information processing system further includes an information processing unit that executes processing based on a combination of the plurality of identifiers that are read out by the second wireless communication unit.

Abstract: This light-receiving element includes: a substrate; a photoelectric conversion layer that is provided on the substrate and includes a first compound semiconductor, and absorbs a wavelength in an infrared region to generate electric charges; a semiconductor layer that is provided on the photoelectric conversion layer and includes a second compound semiconductor, and has an opening in a selective region; and an electrode that buries the opening of the semiconductor layer and is electrically coupled to the photoelectric conversion layer.

Abstract: [Object] To provide an information processing device, information processing method, and program that are capable of improving convenience of nail art creation systems and attaching additional values to provision of nail art designs. [Solution] The information processing device includes: a decision unit configured to decide a nail art design to be recommended to a user in accordance with information obtained by sensing a finger of the user; and an adjustment unit configured to adjust the decided nail art design.

Abstract: An optical shaping apparatus according to an embodiment of the technology includes: a light source that outputs diffusion light or converging light as outgoing light; an optical function section that is disposed in an optical path of the outgoing light and modulates the optical path or a phase of the outgoing light; and a sensor that acquires positional data of an object surface. The optical shaping apparatus further includes a controller that controls operation of the optical function section on the basis of the positional data and coordinate data of a shaped article, to apply modulated light generated by the optical function section to the object surface.

Abstract: An imaging device includes a plurality of light-receiving elements 10 arranged in a two-dimensional matrix shape. Each of the light-receiving elements 10 includes a first electrode 31, a photoelectric conversion layer 20, and a second electrode 32. The photoelectric conversion layer 20 has a laminated structure in which a first compound semiconductor layer 21 having a first conductivity type and a second compound semiconductor layer 22 having a second conductivity type that is a reverse conductivity type to the first conductivity type are laminated from a side of the first electrode. The second compound semiconductor layer has been removed in a region 11 between the light-receiving elements 10. The first electrode 31 and the first compound semiconductor layer 21 are shared by the light-receiving elements. An impurity concentration of a first compound semiconductor layer 21A near the first electrode is lower than that of a first compound semiconductor layer 21B near the second compound semiconductor layer.

Abstract: A stereolithographic object according to one embodiment of the technology includes: a first curable resin part that is provided at a position suitable for contact with a base member; and one or a plurality of second curable resin parts that are provided to be in contact with the first curable resin part and to allow part of a side surface of the first curable resin part to be exposed. The first curable resin part is configured by resin that has a functional group number and a polymer polymerization degree that are relatively small compared with those of the second curable resin part. The one or the plurality of second curable resin parts are configured by resin that has a functional group number and a polymer polymerization degree that are relatively great compared with those of the first curable resin part.

Abstract: An optical shaping apparatus includes: a light source unit that outputs collimated light; an optical function unit that is disposed on an optical path of the collimated light and modulates the optical path or a phase of the collimated light; and a control unit that controls operation of the optical function unit, to irradiate a target surface with modulated light produced in the optical function unit.

Abstract: A light receiving element includes a surface recombination prevention layer composed of a first compound semiconductor on which light is incident; a photoelectric conversion layer composed of a second compound semiconductor; and a compound semiconductor layer composed of a third compound semiconductor, the surface recombination prevention layer having a thickness of 30 nm or less. Also, there are provided an image capturing element including the light receiving element, and an image capturing apparatus including the image capturing element.