Abstract: Disclosed herein is a coil component that includes a spiral conductor, a magnetic material layer covering the spiral conductor and having a through hole exposing an end of the spiral conductor, a through-hole conductor embedded in the through hole and has first region and second regions that are exposed from the magnetic material layer, a first conductor layer formed on an upper surface of the magnetic material layer and covering the first region of the through-hole conductor without covering the second region, and a second conductor layer covering the first conductor layer and the second region of the through-hole conductor, wherein the second conductor layer has a lower resistance than the first conductor layer.

Abstract: Disclosed herein is a coil component that includes first and second magnetic members; a coil layer arranged between the first and second magnetic members, the coil layer including a plurality of conductor layers and a plurality of non-magnetic insulating layers, the conductor layers and the non-magnetic insulating layers being alternately laminated, the conductor layers being connected to each other via through holes formed in the non-magnetic insulating layers to form a coil pattern; a first external terminal covering one end of the coil pattern exposed to at least one of side surfaces of the coil layer without covering the first and second magnetic members; and a second external terminal covering other end of the coil pattern exposed to at least one of the side surfaces of the coil layer without covering the first and second magnetic members.

Abstract: Disclosed herein is a coil component that includes a first planar spiral conductor; a second planar spiral conductor laminated on the first planar spiral conductor and wound in an opposite direction to the first planar spiral conductor; a first external terminal electrically connected to an outer peripheral end of the first planar spiral conductor; a second external terminal electrically connected to an outer peripheral end of the second planar spiral conductor; and a third external terminal electrically connected in common to inner peripheral ends of the first and second planar spiral conductors.

Abstract: A common mode filter is provided with first and second spiral patterns provided on an insulating layer and connected to each other in series, and third and fourth spiral patterns provided on an insulating layer and connected to each other in series. The first and third spiral patterns overlap each other so as to be magnetically coupled with each other. The second and fourth spiral patterns overlap each other so as to be magnetically coupled with each other. Relationships between winding directions of the first and second spiral patterns and between winding directions of the third and fourth spiral patterns are set to cancel out magnetic fluxes of the couples of the spiral patterns each other, respectively. Each number of turns in the first and third spiral patterns is larger than each number of turns in the second and fourth spiral patterns respectively.

Abstract: An electronic component is provided with a substrate, a thin-film element layer provided on the substrate, first and second bump electrodes, provided on a surface of the thin-film element layer, and an insulator layer provided between the first bump electrode and the second bump electrode. The thin-film element layer contains a first spiral conductor which is a plane coil pattern. The first bump electrode is connected to an internal peripheral end of the first spiral conductor. The second bump electrode is connected to an external peripheral end of the first spiral conductor. Both of the first and second bump electrodes, have a first exposure surface exposed to a principal surface of the insulator layer and a second exposure surface exposed to an end face of the insulator layer.

Abstract: A common mode filter 1 is provided with spiral patterns 11 and 12 provided on an insulating layer 10A and connected to each other in series, and spiral patterns 13 and 14 provided on an insulating layer 10B and connected to each other in series. The spiral patterns 11 and 13 overlap each other so as to be magnetically coupled with each other. The spiral patterns 12 and 14 overlap each other so as to be magnetically coupled with each other. Relationships between winding directions of the spiral patterns 11 and 12 and between winding directions of the spiral patterns 13 and 14 are set to cancel out magnetic fluxes of the couples of the spiral patterns each other, respectively. Each number of turns in the spiral patterns 11 and 13 are larger than each number of turns in the spiral patterns 12 and 14, respectively.

Abstract: A coil component 100 is provided with a substrate 11, a thin-film coil layer 12 provided on the substrate 11, first and second bump electrodes 13a, 13b provided on a surface of the thin-film coil layer 12, a first lead conductor 20 provided on the surface of the thin-film coil layer 12 together with the first and second bump electrodes 13a, 13b and formed integrally with the first bump electrode 13a, and an insulator layer 14 provided between the first bump electrode 13a and the second bump electrode 13b. The thin-film coil layer 12 contains a first spiral conductor 16 which is a plane coil pattern. The first bump electrode 13a is connected to an internal peripheral end of the first spiral conductor 16 via the first lead conductor 20. The second bump electrode 13b is connected to an external peripheral end of the first spiral conductor 16.

Abstract: An electronic component is provided with a substrate, a thin-film element layer provided on the substrate, first and second bump electrodes, provided on a surface of the thin-film element layer, and an insulator layer provided between the first bump electrode and the second bump electrode. The thin-film element layer contains a first spiral conductor which is a plane coil pattern. The first bump electrode is connected to an internal peripheral end of the first spiral conductor. The second bump electrode is connected to an external peripheral end of the first spiral conductor. Both of the first and second bump electrodes, have a first exposure surface exposed to a principal surface of the insulator layer and a second exposure surface exposed to an end face of the insulator layer.

Abstract: A coil component 100 is provided with a substrate 11, a thin-film coil layer 12 provided on the substrate 11, first and second bump electrodes 13a, 13b provided on a surface of the thin-film coil layer 12, a first lead conductor 20 provided on the surface of the thin-film coil layer 12 together with the first and second bump electrodes 13a, 13b and formed integrally with the first bump electrode 13a, and an insulator layer 14 provided between the first bump electrode 13a and the second bump electrode 13b. The thin-film coil layer 12 contains a first spiral conductor 16 which is a plane coil pattern. The first bump electrode 13a is connected to an internal peripheral end of the first spiral conductor 16 via the first lead conductor 20. The second bump electrode 13b is connected to an external peripheral end of the first spiral conductor 16.

Abstract: A manufacturing method of electronic components includes forming a first insulation layer on a substrate, forming a plurality of passive elements on the first insulation layer, forming a second insulation layer on the passive elements, forming a plurality of conductor layers electrically connected to the respective passive elements, on the outer side of the second insulation layer to be exposed to an upper surface of each electronic component, and forming grooves between the electronic components including the respective passive elements to expose side surfaces of each electronic component and parts of the conductor layers from the side surfaces of each electronic component. The manufacturing method further including plating a plurality of external electrodes on the respective conductor layers exposed to the upper surface and the side surfaces of each electronic component, and cutting the substrate to completely separate into individual electronic components.

Abstract: A multi-channel head includes a substrate and a plurality of recording elements arranged on the substrate in a track width direction. At least one of the recording elements satisfies BGW<PW and BGD>BGW, where PW represents a pole width, BGW and BGD represent a width and a depth, respectively, of a back yoke.

Abstract: A thin-film magnetic head has a plurality of MR read head elements. Each MR read head element includes shield layers electrically insulated from the ground. An electrical resistor layer is electrically connected between the shield layer of one of the plurality of MR read head elements and the shield layer of the other one of the plurality of MR read head elements.

Abstract: A thin-film magnetic head where the closure is bonded with sufficiently high adhesive strength by the adhesive layer thinner than conventional and that is free from the problem of fine dusts, is provided. The head comprises: a substrate having an element-formed surface and an opposed-to-medium surface; at least one magnetic head element provided on/above the element-formed surface; an overcoat layer formed on the element-formed surface; an etching pattern formed on a part of an upper surface of the overcoat layer, the whole or a part of the etching pattern being filled up by adhesive; a closure provided on the etching pattern of the overcoat layer; and an opening portion formed close to an edge on the opposite side to the opposed-to-medium surface of an adhesive surface of the closure, being a portion exposed from the closure of the etching pattern.

Abstract: A manufacturing method of electronic components includes forming a first insulation layer on a substrate, forming a plurality of passive elements on the first insulation layer, forming a second insulation layer on the passive elements, forming a plurality of conductor layers electrically connected to the respective passive elements, on the outer side of the second insulation layer to be exposed to an upper surface of each electronic component, and forming grooves between the electronic components including the respective passive elements to expose side surfaces of each electronic component and parts of the conductor layers from the side surfaces of each electronic component. The manufacturing method further including plating a plurality of external electrodes on the respective conductor layers exposed to the upper surface and the side surfaces of each electronic component, and cutting the substrate to completely separate into individual electronic components.

Abstract: A common mode choke coil includes two extraction conductors formed on a resin insulating layer, and a concave portion is formed in the resin insulating layer in an area between a first portion covered with one of the extraction conductors and a second portion covered with the other extraction conductor. An upper resin insulating layer is embedded inside the concave portion. Accordingly, because the resin insulating layer is not flat in the portion where the extraction conductors are formed, a distance between the extraction conductors along the surface of the resin insulating layer increases. Therefore, a current path generated due to ion migration along the surface of the insulating layer is hardly formed, thereby enabling to obtain high withstand voltage, even if the distance between the extraction conductors is short.

Abstract: A common mode filter is provided as one in a three-layered structure with improved high-frequency characteristics. The common mode filter 1 has the three-layered structure including a first coil layer 14, a second coil layer 18, and a lead layer 16. A first planar coil 21 and a second planar coil 41 of a substantially circular spiral shape are formed in the first and second coil layers 14, 18, respectively. A first lead wire 31 and a second lead wire 32 formed in a lead layer 16 have a first straight portion 31c and a second straight portion 32c, respectively. The first straight portion 31c is located on a straight line L1 perpendicular to a plurality of first tangent lines to spirals 22, 42 at a plurality of respective intersection points with the spirals 22, 42. The second straight portion 32c is located on a straight line L2 perpendicular to a plurality of second tangent lines to the spirals 22, 42 at a plurality of respective intersection points with the spirals 22, 42.

Abstract: A common mode filter is provided as one in a three-layered structure with improved high-frequency characteristics. The common mode filter 1 has the three-layered structure including a first coil layer 14, a second coil layer 18, and a lead layer 16. A first planar coil 21 and a second planar coil 41 of a substantially circular spiral shape are formed in the first and second coil layers 14, 18, respectively. A first lead wire 31 and a second lead wire 32 formed in a lead layer 16 have a first straight portion 31c and a second straight portion 32c, respectively. The first straight portion 31c is located on a straight line L1 perpendicular to a plurality of first tangent lines to spirals 22, 42 at a plurality of respective intersection points with the spirals 22, 42. The second straight portion 32c is located on a straight line L2 perpendicular to a plurality of second tangent lines to the spirals 22, 42 at a plurality of respective intersection points with the spirals 22, 42.

Abstract: The invention relates to surface-mount type coil components having a mounting surface for mounting them on a printed circuit board or hybrid IC (HIC) and provides a coil component having high electrical characteristics. A common mode filter includes a coil conductor formed in a spiral shape, cut ends which are parts of the coil conductor cut to face each other, and bridge conductors formed so that an insulation film is interposed between the coil conductor and the same to connect the cut ends to each other.

Abstract: A common mode choke coil includes two extraction conductors formed on a resin insulating layer, and a concave portion is formed in the resin insulating layer in an area between a first portion covered with one of the extraction conductors and a second portion covered with the other extraction conductor. An upper resin insulating layer is embedded inside the concave portion. Accordingly, because the resin insulating layer is not flat in the portion where the extraction conductors are formed, a distance between the extraction conductors along the surface of the resin insulating layer increases. Therefore, a current path generated due to ion migration along the surface of the insulating layer is hardly formed, thereby enabling to obtain high withstand voltage, even if the distance between the extraction conductors is short.

Abstract: The invention relates to surface-mount type coil components having a mounting surface for mounting them on a printed circuit board or hybrid IC (HIC) and provides a low-cost coil component having a low direct-current resistance. A common mode filter includes a bridge conductor layer which has a bridge conductor one end of which is connected to one end of a lead wire and another end of which is connected to an inner circumferential end of a coil conductor and another bridge conductor one end of which is connected to one end of another lead wire and another end of which is connected to an inner circumferential end of another coil conductor, the bridge conductor layer being formed between two coil conductor layers with an insulation film interposed between the bridge conductor layer and each of the coil conductor layers.