Abstract: The invention relates to surface-mount type coil components having a mounting surface for mounting them on a printed circuit board or hybrid IC (HIC) and provides a low-cost coil component having a low direct-current resistance. A common mode filter includes a bridge conductor layer which has a bridge conductor one end of which is connected to one end of a lead wire and another end of which is connected to an inner circumferential end of a coil conductor and another bridge conductor one end of which is connected to one end of another lead wire and another end of which is connected to an inner circumferential end of another coil conductor, the bridge conductor layer being formed between two coil conductor layers with an insulation film interposed between the bridge conductor layer and each of the coil conductor layers.

Abstract: The invention relates to surface-mount type coil components having a mounting surface for mounting them on a printed circuit board or hybrid IC (HIC) and provides a coil component having high electrical characteristics. A common mode filter includes a coil conductor formed in a spiral shape, cut ends which are parts of the coil conductor cut to face each other, and bridge conductors formed so that an insulation film is interposed between the coil conductor and the same to connect the cut ends to each other.

Abstract: A multi-channel head includes a substrate and a plurality of recording elements arranged on the substrate in a track width direction. At least one of the recording elements satisfies BGW<PW and BGD>BGW, where PW represents a pole width, BGW and BGD represent a width and a depth, respectively, of a back yoke.

Abstract: The invention relates to surface-mount type coil components having a mounting surface for mounting them on a printed circuit board or hybrid IC (HIC) and provides a low-cost coil component having a low direct-current resistance. A common mode filter includes a bridge conductor layer which has a bridge conductor one end of which is connected to one end of a lead wire and another end of which is connected to an inner circumferential end of a coil conductor and another bridge conductor one end of which is connected to one end of another lead wire and another end of which is connected to an inner circumferential end of another coil conductor, the bridge conductor layer being formed between two coil conductor layers with an insulation film interposed between the bridge conductor layer and each of the coil conductor layers.

Abstract: A thin-film magnetic head has a plurality of MR read head elements. Each MR read head element includes shield layers electrically insulated from the ground. An electrical resistor layer is electrically connected between the shield layer of one of the plurality of MR read head elements and the shield layer of the other one of the plurality of MR read head elements.

Abstract: A thin-film magnetic head where the closure is bonded with sufficiently high adhesive strength by the adhesive layer thinner than conventional and that is free from the problem of fine dusts, is provided. The head comprises: a substrate having an element-formed surface and an opposed-to-medium surface; at least one magnetic head element provided on/above the element-formed surface; an overcoat layer formed on the element-formed surface; an etching pattern formed on a part of an upper surface of the overcoat layer, the whole or a part of the etching pattern being filled up by adhesive; a closure provided on the etching pattern of the overcoat layer; and an opening portion formed close to an edge on the opposite side to the opposed-to-medium surface of an adhesive surface of the closure, being a portion exposed from the closure of the etching pattern.