Abstract: An electronic component has a first member in which an electrostatic actuator is provided, a second member in which a drive integrated circuit for driving the electrostatic actuator is provided, and join parts that joins the first member and the second member while a surface on which the electrostatic actuator is provided in the first member and a surface on which the drive integrated circuit is provided in the second member are opposed to each other. The electrostatic actuator and the drive integrated circuit are disposed in a space surrounded by the first member, the second member, and the join parts.

Abstract: A wafer level package has a first wafer having a plurality of chips mounted or formed thereon in a plane, and a second wafer that is opposed to the first wafer. The first wafer and the second wafer are joined while a seal frame that seals a periphery of each chip is interposed therebetween. A gap is formed between the seal frames of the chips adjacent to each other. A partial connect part that partially connects the seal frames to each other is provided in the gap formed between the seal frames of the chips adjacent to each other.

Abstract: The thermal conductive sheet of the present invention includes a base sheet and, on one surface of the base sheet, a metal foil (C) that has a thickness of from 1 to 30% of a thickness of the base sheet. The base sheet includes a binder component (A) that exhibits elasticity at room temperature and a graphite powder (B) that has anisotropy, and the graphite powder (B) is oriented in a thickness direction.

Abstract: A heat radiation sheet having high heat-radiation property and excellent handleability and having sheet properties permitting the sheet to cope with changes in use temperature thereof. Also provided is a heat radiation device using the sheet. The heat radiation sheet comprises: a binder component comprising: (A) a thermoplastic rubber component; (B) a thermosetting rubber component; and (C) a thermosetting rubber curing agent crosslinkable with the thermosetting rubber component (B); and an anisotropic graphite powder oriented into a specified direction in the binder component.

Abstract: Two coil conductors of the same spiral shape are cut out from a lead frame. The two coil conductors are disposed back to back so that the front of a first coil conductor is superimposed over the rear of a second coil conductor. Central end portions of the first and second coil conductors are connected to each other through a connection layer. Outer end portions of the spirals of the first and second coil conductors are connected to corresponding ones of first and second terminals of the thin inductor, respectively. A sintered green sheet as a magnetic substance is disposed in gaps between the first and second coil conductors. In this manner, the invention can provide a thin inductor small in size, strong in mechanical strength and inexpensive, a method of producing the thin inductor, and an ultra small size power conversion apparatus using the thin inductor.

Abstract: A semiconductor device with an inductor device is small, thin, and low-cost. A laminated inductor is adhered fixedly onto a supporting conductive plate by Ag paste, and a semiconductor chip is adhered fixedly onto the laminated inductor via an insulating DAF tape. One end of the supporting conductive plate and a terminal electrode of the semiconductor chip are connected by a metal wire, and a plurality of terminal electrodes of the semiconductor chip and a plurality of external lead-out terminals are connected respectively by laterally extending metal wires. The entire structure is then sealed by a resin mold. By employing a laminated inductor and forming the metal wires to extend laterally in this manner, the thickness of the semiconductor device with an inductor can be reduced.

Abstract: The electrode of a thin-type capacitor is connected to the rear surface of a p-type semiconductor substrate which is brought to a ground potential, by a conductive DAF (Die Attach Film) or by a conductive adhesive, and the electrodes of the front surface of the p-type semiconductor substrate are respectively connected with and stacked on the terminals of a thin-type inductor by bumps, whereby manufacturing costs can be reduced while the occurrence of noise can be suppressed and packaging area can be made small.

Abstract: An inductor and a method of manufacture results in external electrodes that prevent generation of flashes. The inductor has a ferrite substrate, external electrodes, and a coil. The cross-sectional area of the external electrodes extending across the cutting line is reduced to suppress generation of flashes during the cutting process. Pairs of through-holes are formed at positions in line symmetry about the cutting line. A connection conductor is formed in each of the through-holes, and the external electrodes are formed on the front and back surfaces of the substrate, with the connection conductor connecting each of the pairs of external electrodes on the front and back surfaces. Through-holes can be oblong holes extending across the cutting line, and the external electrodes can extend away from the cutting line.

Abstract: A micro electromechanical relay opens and closes an electrical circuit by contact/separation between a fixed contact disposed on a base and a movable contact disposed on an actuator by driving of a movable electrode by electrostatic attraction by application of voltage between a fixed electrode disposed on the base and a movable electrode of the actuator. The actuator comprises a supporting portion disposed on the base, a beam portion extending in a cantilevered manner from the supporting portion, and a movable electrode and a movable contact elastically supported by the beam portion. The beam portion elastically supports, in order from the supporting portion end, the movable electrode and the movable contact. A slit is formed from the side of the supporting portion in the portion of the actuator connecting the beam portion and the movable electrode.

Abstract: The electrode of a thin-type capacitor is connected to the rear surface of a p-type semiconductor substrate which is brought to a ground potential, by a conductive DAF (Die Attach Film) or by a conductive adhesive, and the electrodes of the front surface of the p-type semiconductor substrate are respectively connected with and stacked on the terminals of a thin-type inductor by bumps, whereby manufacturing costs can be reduced while the occurrence of noise can be suppressed and packaging area can be made small.

Abstract: A semiconductor device with an inductor device is small, thin, and low-cost. A laminated inductor is adhered fixedly onto a supporting conductive plate by Ag paste, and a semiconductor chip is adhered fixedly onto the laminated inductor via an insulating DAF tape. One end of the supporting conductive plate and a terminal electrode of the semiconductor chip are connected by a metal wire, and a plurality of terminal electrodes of the semiconductor chip and a plurality of external lead-out terminals are connected respectively by laterally extending metal wires. The entire structure is then sealed by a resin mold. By employing a laminated inductor and forming the metal wires to extend laterally in this manner, the thickness of the semiconductor device with an inductor can be reduced.

Abstract: An inductor and a method of manufacture results in external electrodes that prevent generation of flashes. The inductor has a ferrite substrate, external electrodes, and a coil. The cross-sectional area of the external electrodes extending across the cutting line is reduced to suppress generation of flashes during the cutting process. Pairs of through-holes are formed at positions in line symmetry about the cutting line. A connection conductor is formed in each of the through-holes, and the external electrodes are formed on the front and back surfaces of the substrate, with the connection conductor connecting each of the pairs of external electrodes on the front and back surfaces. Through-holes can be oblong holes extending across the cutting line, and the external electrodes can extend away from the cutting line.

Abstract: An antenna device and non-contact transmitter/receiver device constituting at least the same includes a first conductor unit; a second conductor unit that is electrically connected to the first conductor unit; and a third conductor unit that is electrically connected to the first conductor unit and the second conductor unit. The first conductor is placed along a first virtual plane, the second conductor unit is placed along a second virtual plane, and the third conductor is placed along a third virtual plane. In this antenna, the plane that includes the first conductor unit, the plane that includes the second conductor unit, and the plane that includes the third conductor unit are perpendicular to one another.

Abstract: A fixed voltage and a movable electrode are placed face to face with each other, and an insulating film is formed on the surface of the fixed electrode. The insulating film is made of a nitride film (SiN) as a main material, with oxide films (SiO2) being formed on the front and rear surfaces of the nitride film. Moreover, a plurality of protrusions are formed on an area facing the movable electrode of the upper face of the insulating film. The charge quantity in the insulating film is mainly determined by a film thickness of the oxide film, and the nitride film is used for maintaining a sufficient film thickness required for the voltage proof characteristic.

Abstract: A micro electromechanical relay opens and closes an electrical circuit by contact/separation between a fixed contact disposed on a base and a movable contact disposed on an actuator by driving of a movable electrode by electrostatic attraction by application of voltage between a fixed electrode disposed on the base and a movable electrode of the actuator. The actuator comprises a supporting portion disposed on the base, a beam portion extending in a cantilevered manner from the supporting portion, and a movable electrode and a movable contact elastically supported by the beam portion. The beam portion elastically supports, in order from the supporting portion end, the movable electrode and the movable contact. A slit is formed from the side of the supporting portion in the portion of the actuator connecting the beam portion and the movable electrode.

Abstract: A plurality of fixed contacts and signal lines are provided on a fixed substrate. A movable contact which is closed or opened with the fixed contacts is provided on a movable substrate opposed to the fixed substrate. A film thickness of the fixed contacts is made to be smaller than that of the signal lines so that the movable contact is set in a concave portion constituted by the fixed contacts when the fixed contacts, and the movable contact are closed and the signal lines are linearly connected.

Abstract: A fuel-cell separator comprising a resin and an electric conductor dispersed in the resin is produced by thermally molding a mixture comprising the electric conductor and the resin.

Abstract: A plurality of fixed contacts and signal lines are provided on a fixed substrate. A movable contact which is closed or opened with the fixed contacts is provided on a movable substrate opposed to the fixed substrate. A film thickness of the fixed contacts is made to be smaller than that of the signal lines so that the movable contact is set in a concave portion constituted by the fixed contacts when the fixed contacts, and the movable contact are closed and the signal lines are linearly connected.

Abstract: Fixed contacts (23A, 24A) are provided on the upper surface of a silicon substrate (21). Signal lines (23, 24) electrically continuous with the fixed contacts (23A, 24A) are provided so as to pass through a silicon substrate (21) from the obverse surface to the reverse surface thereof. Bumps (32, 33) electrically continuous with the signal lines (23, 24) are provided on the reverse surface of the silicon substrate (21). A fixed electrode (22) is provided on both sides of the fixed contacts (23A, 24A). Wiring conductors (30, 31) electrically continuous with the fixed electrode (22) are provided so as to pass through the silicon substrate (21) from the obverse surface to the reverse surface thereof. Bumps (34, 35) electrically continuous with the wiring conductors (30, 31) are provided on the reverse surface of the silicon substrate (21).

Abstract: In one embodiment, a semiconductor device having single or multi-layer intermediate layers that easily adhere to a glass frit and lead lines of respective interconnections is disclosed. In general, the single or multi-layer intermediate layers are formed on at least the top surfaces of portions of the respective lead lines on which the glass frit is placed.