Abstract: A semiconductor module includes a plurality of semiconductor elements, a sealing resin body, a positive electrode side terminal, a negative electrode side terminal, and an output terminal. The positive electrode side terminal, the negative electrode side terminal, and the output terminal are each connected to any of the semiconductor elements, and project from a same surface of the sealing resin body. Projecting portions of the positive electrode side terminal, the negative electrode side terminal, and the output terminal are arranged next to each other in an arrangement direction so that the projecting portion of the output terminal is located at an end.

Abstract: The semiconductor device includes a plurality of semiconductor packages stacked on one another. Each semiconductor package includes a main current electrode terminal disposed in a case section of the semiconductor package, the main current electrode terminal being exposed outside the case section to be electrically connected to an external power supply. The main current electrode terminal extends in the stack direction of the semiconductor packages, and embedded in the case section at a surface portion thereof facing an external surface of the case section. Both end surface portions of the main current electrode terminal in the stack direction respectively reach end surface portions of the case section in the stack direction so that the main current electrode terminals of each adjacent two of the semiconductor packages are in contact with each other when the semiconductor packages are stacked on one another in the stack direction.

Abstract: The semiconductor device includes a plurality of semiconductor packages stacked on one another. Each semiconductor package includes a main current electrode terminal disposed in a case section of the semiconductor package, the main current electrode terminal being exposed outside the case section to be electrically connected to an external power supply. The main current electrode terminal extends in the stack direction of the semiconductor packages, and embedded in the case section at a surface portion thereof facing an external surface of the case section. Both end surface portions of the main current electrode terminal in the stack direction respectively reach end surface portions of the case section in the stack direction so that the main current electrode terminals of each adjacent two of the semiconductor packages are in contact with each other when the semiconductor packages are stacked on one another in the stack direction.

Abstract: A semiconductor device includes: a semiconductor element; a metallic plate having a heat radiation surface; a terminal connecting to the element; and a resin mold covering the element, the plate and the terminal. The metallic plate provides an electrode of the semiconductor element. The heat radiation surface is capable of radiating heat generated in the element. The heat radiation surface and a part of the terminal are exposed from the resin mold. The resin mold includes a concavity/convexity portion between the heat radiation surface and the part of the terminal in order to lengthen a creepage distance therebetween. The concavity/convexity portion is disposed on a surface of the resin mold.

Abstract: A semiconductor device includes: a semiconductor element; a metallic plate having a heat radiation surface; a terminal connecting to the element; and a resin mold covering the element, the plate and the terminal. The metallic plate provides an electrode of the semiconductor element. The heat radiation surface is capable of radiating heat generated in the element. The heat radiation surface and a part of the terminal are exposed from the resin mold. The resin mold includes a concavity/convexity portion between the heat radiation surface and the part of the terminal in order to lengthen a creepage distance therebetween. The concavity/convexity portion is disposed on a surface of the resin mold.