Abstract: This invention provides a wafer inspecting apparatus which enables macroscopic inspection of the entire surface of a wafer. According to the wafer inspecting apparatus of this invention, the edge portion of a wafer 8 is held by suction with the distal ends of wafer holding portions 702 of a wafer holding arm 7, and first-time observation of the lower surface of the wafer 8 is performed. Then, the wafer 8 is transported onto a center table 6. The center table 6 is rotated through a predetermined angle. The edge portion of the wafer 8 is held by suction again with the distal ends of the wafer holding portions 702 of the wafer holding arm 7. Then, second-time observation of the lower surface of the wafer 8 is performed.

Abstract: Of a plurality of wafers (15) circumferential edge portions of which are held by slot grooves (14) of a wafer cassette (13), the positions of a wafer (15) to be transferred and the wafers (15) above and beneath it are detected by a first sensor (16) and a second sensor (17). A calculating unit calculates an amount of bend of each wafer (15) based on the detected information. It is determine, based on the calculation result, whether the transfer arm (18) can be inserted under the wafer (15) to be transferred without contacting with the wafer beneath (15) and whether the wafer (15) to be transferred can be lifted up by the transfer arm (18) without contacting with the wafer above (15).