Patents by Inventor Tomoshi Inoue
Tomoshi Inoue has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11548113Abstract: A polishing method is used for polishing a substrate such as a semiconductor wafer to a flat mirror finish. A method of polishing a substrate by a polishing apparatus includes a polishing table (100) having a polishing surface, a top ring (1) for holding a substrate and pressing the substrate against the polishing surface, and a vertically movable mechanism (24) for moving the top ring (1) in a vertical direction. The top ring (1) is moved to a first height before the substrate is pressed against the polishing surface, and then the top ring (1) is moved to a second height after the substrate is pressed against the polishing surface.Type: GrantFiled: April 17, 2019Date of Patent: January 10, 2023Assignee: EBARA CORPORATIONInventors: Makoto Fukushima, Tetsuji Togawa, Shingo Togashi, Tomoshi Inoue
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Publication number: 20190240801Abstract: A polishing method is used for polishing a substrate such as a semiconductor wafer to a flat mirror finish. A method of polishing a substrate by a polishing apparatus includes a polishing table (100) having a polishing surface, a top ring (1) for holding a substrate and pressing the substrate against the polishing surface, and a vertically movable mechanism (24) for moving the top ring (1) in a vertical direction. The top ring (1) is moved to a first height before the substrate is pressed against the polishing surface, and then the top ring (1) is moved to a second height after the substrate is pressed against the polishing surface.Type: ApplicationFiled: April 17, 2019Publication date: August 8, 2019Inventors: Makoto FUKUSHIMA, Tetsuji TOGAWA, Shingo TOGASHI, Tomoshi INOUE
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Patent number: 10307882Abstract: A polishing method is used for polishing a substrate such as a semiconductor wafer to a flat mirror finish. A method of polishing a substrate by a polishing apparatus includes a polishing table (100) having a polishing surface, a top ring (1) for holding a substrate and pressing the substrate against the polishing surface, and a vertically movable mechanism (24) for moving the top ring (1) in a vertical direction. The top ring (1) is moved to a first height before the substrate is pressed against the polishing surface, and then the top ring (1) is moved to a second height after the substrate is pressed against the polishing surface.Type: GrantFiled: March 2, 2016Date of Patent: June 4, 2019Assignee: EBARA CORPORATIONInventors: Makoto Fukushima, Tetsuji Togawa, Shingo Togashi, Tomoshi Inoue
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Publication number: 20160176011Abstract: A polishing method is used for polishing a substrate such as a semiconductor wafer to a flat mirror finish. A method of polishing a substrate by a polishing apparatus includes a polishing table (100) having a polishing surface, a top ring (1) for holding a substrate and pressing the substrate against the polishing surface, and a vertically movable mechanism (24) for moving the top ring (1) in a vertical direction. The top ring (1) is moved to a first height before the substrate is pressed against the polishing surface, and then the top ring (1) is moved to a second height after the substrate is pressed against the polishing surface.Type: ApplicationFiled: March 2, 2016Publication date: June 23, 2016Inventors: Makoto FUKUSHIMA, Tetsuji TOGAWA, Shingo TOGASHI, Tomoshi INOUE
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Patent number: 9308621Abstract: A polishing method is used for polishing a substrate such as a semiconductor wafer to a flat mirror finish. A method of polishing a substrate by a polishing apparatus includes a polishing table (100) having a polishing surface, a top ring (1) for holding a substrate and pressing the substrate against the polishing surface, and a vertically movable mechanism (24) for moving the top ring (1) in a vertical direction. The top ring (1) is moved to a first height before the substrate is pressed against the polishing surface, and then the top ring (1) is moved to a second height after the substrate is pressed against the polishing surface.Type: GrantFiled: August 7, 2009Date of Patent: April 12, 2016Assignee: EBARA CORPORATIONInventors: Makoto Fukushima, Tetsuji Togawa, Shingo Saito, Tomoshi Inoue
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Patent number: 8485866Abstract: A substrate holding apparatus prevents a substrate from slipping out and allows the substrate to be polished stably. The substrate holding apparatus has a top ring body for holding and pressing a substrate against a polishing surface, and a retainer ring for pressing the polishing surface, the retainer ring being disposed on an outer circumferential portion of the top ring body. The retainer ring includes a first member made of a magnetic material and a second member having a magnet disposed on a surface thereof which is held in abutment against the first member.Type: GrantFiled: August 16, 2012Date of Patent: July 16, 2013Assignee: Ebara CorporationInventors: Hozumi Yasuda, Tetsuji Togawa, Osamu Nabeya, Kenichiro Saito, Makoto Fukushima, Tomoshi Inoue
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Patent number: 8357029Abstract: A polishing apparatus is used for polishing a substrate such as a semiconductor wafer to a flat mirror finish. The polishing apparatus includes a polishing table (100) having a polishing surface (101a), a top ring body (2) configured to hold and press a substrate against the polishing surface (101a), and a retainer ring (3) provided at an outer peripheral portion of the top ring body (2) and configured to press the polishing surface (101a). A fulcrum for receiving a lateral force applied from the substrate to the retainer ring (3) during polishing of the substrate is located above a central portion of the substrate.Type: GrantFiled: February 9, 2009Date of Patent: January 22, 2013Assignee: Ebara CorporationInventors: Makoto Fukushima, Tetsuji Togawa, Hozumi Yasuda, Koji Saito, Osamu Nabeya, Tomoshi Inoue
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Publication number: 20120309277Abstract: A substrate holding apparatus prevents a substrate from slipping out and allows the substrate to be polished stably. The substrate holding apparatus has a top ring body for holding and pressing a substrate against a polishing surface, and a retainer ring for pressing the polishing surface, the retainer ring being disposed on an outer circumferential portion of the top ring body. The retainer ring includes a first member made of a magnetic material and a second member having a magnet disposed on a surface thereof which is held in abutment against the first member.Type: ApplicationFiled: August 16, 2012Publication date: December 6, 2012Inventors: Hozumi YASUDA, Tetsuji Togawa, Osamu Nabeya, Kenichiro Saito, Makoto Fukushima, Tomoshi Inoue
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Patent number: 8267746Abstract: A substrate holding apparatus prevents a substrate from slipping out and allows the substrate to be polished stably. The substrate holding apparatus has a top ring body for holding and pressing a substrate against a polishing surface, and a retainer ring for pressing the polishing surface, the retainer ring being disposed on an outer circumferential portion of the top ring body. The retainer ring includes a first member made of a magnetic material and a second member having a magnet disposed on a surface thereof which is held in abutment against the first member.Type: GrantFiled: August 19, 2008Date of Patent: September 18, 2012Assignee: Ebara CorporationInventors: Hozumi Yasuda, Tetsuji Togawa, Osamu Nabeya, Kenichiro Saito, Makoto Fukushima, Tomoshi Inoue
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Patent number: 8100739Abstract: A substrate holding apparatus prevents a substrate from slipping out and allows the substrate to be polished stably. The substrate holding apparatus has a top ring body for holding and pressing a substrate against a polishing surface, and a retainer ring for pressing the polishing surface, the retainer ring being disposed on an outer circumferential portion of the top ring body. The retainer ring includes a first member made of a magnetic material and a second member having a magnet disposed on a surface thereof which is held in abutment against the first member.Type: GrantFiled: August 19, 2008Date of Patent: January 24, 2012Assignee: Ebara CorporationInventors: Hozumi Yasuda, Tetsuji Togawa, Osamu Nabeya, Kenichiro Saito, Makoto Fukushima, Tomoshi Inoue
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Publication number: 20110159783Abstract: A polishing method is used for polishing a substrate such as a semiconductor wafer to a flat mirror finish. A method of polishing a substrate by a polishing apparatus includes a polishing table (100) having a polishing surface, a top ring (1) for holding a substrate and pressing the substrate against the polishing surface, and a vertically movable mechanism (24) for moving the top ring (1) in a vertical direction. The top ring (1) is moved to a first height before the substrate is pressed against the polishing surface, and then the top ring (1) is moved to a second height after the substrate is pressed against the polishing surface.Type: ApplicationFiled: August 7, 2009Publication date: June 30, 2011Inventors: Makoto Fukushima, Tetsuji Togawa, Shingo Saito, Tomoshi Inoue
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Patent number: 7967665Abstract: A substrate holding apparatus prevents a substrate from slipping out and allows the substrate to be polished stably. The substrate holding apparatus has a top ring body for holding and pressing a substrate against a polishing surface, and a retainer ring for pressing the polishing surface, the retainer ring being disposed on an outer circumferential portion of the top ring body. The retainer ring includes a first member made of a magnetic material and a second member having a magnet disposed on a surface thereof which is held in abutment against the first member.Type: GrantFiled: March 29, 2007Date of Patent: June 28, 2011Assignee: Ebara CorporationInventors: Hozumi Yasuda, Tetsuji Togawa, Osamu Nabeya, Kenichiro Saito, Makoto Fukushima, Tomoshi Inoue
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Publication number: 20100273405Abstract: A polishing apparatus is used for polishing a substrate such as a semiconductor wafer to a flat mirror finish. The polishing apparatus includes a polishing table (100) having a polishing surface (101a), a top ring body (2) configured to hold and press a substrate against the polishing surface (101a), and a retainer ring (3) provided at an outer peripheral portion of the top ring body (2) and configured to press the polishing surface (101a). A fulcrum for receiving a lateral force applied from the substrate to the retainer ring (3) during polishing of the substrate is located above a central portion of the substrate.Type: ApplicationFiled: February 9, 2009Publication date: October 28, 2010Inventors: Makoto Fukushima, Tetsuji Togawa, Hozumi Yasuda, Koji Saito, Osamu Nabeya, Tomoshi Inoue
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Publication number: 20080318499Abstract: A substrate holding apparatus prevents a substrate from slipping out and allows the substrate to be polished stably. The substrate holding apparatus has a top ring body for holding and pressing a substrate against a polishing surface, and a retainer ring for pressing the polishing surface, the retainer ring being disposed on an outer circumferential portion of the top ring body. The retainer ring includes a first member made of a magnetic material and a second member having a magnet disposed on a surface thereof which is held in abutment against the first member.Type: ApplicationFiled: August 19, 2008Publication date: December 25, 2008Inventors: Hozumi Yasuda, Tetsuji Togawa, Osamu Nabeya, Kenichiro Saito, Makoto Fukushima, Tomoshi Inoue
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Publication number: 20080318492Abstract: A substrate holding apparatus prevents a substrate from slipping out and allows the substrate to be polished stably. The substrate holding apparatus has a top ring body for holding and pressing a substrate against a polishing surface, and a retainer ring for pressing the polishing surface, the retainer ring being disposed on an outer circumferential portion of the top ring body. The retainer ring includes a first member made of a magnetic material and a second member having a magnet disposed on a surface thereof which is held in abutment against the first member.Type: ApplicationFiled: August 19, 2008Publication date: December 25, 2008Inventors: Hozumi Yasuda, Tetsuji Togawa, Osamu Nabeya, Kenichiro Saito, Makoto Fukushima, Tomoshi Inoue
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Publication number: 20070232193Abstract: A substrate holding apparatus prevents a substrate from slipping out and allows the substrate to be polished stably. The substrate holding apparatus has a top ring body for holding and pressing a substrate against a polishing surface, and a retainer ring for pressing the polishing surface, the retainer ring being disposed on an outer circumferential portion of the top ring body. The retainer ring comprises a first member made of a magnetic material and a second member having a magnet disposed on a surface thereof which is held in abutment against the first member.Type: ApplicationFiled: March 29, 2007Publication date: October 4, 2007Inventors: Hozumi Yasuda, Tetsuji Togawa, Osamu Nabeya, Kenichiro Saito, Makoto Fukushima, Tomoshi Inoue
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Patent number: D634719Type: GrantFiled: February 25, 2010Date of Patent: March 22, 2011Assignee: Ebara CorporationInventors: Hozumi Yasuda, Keisuke Namiki, Makoto Fukushima, Osamu Nabeya, Koji Saito, Satoru Yamaki, Tomoshi Inoue, Shingo Togashi, Tetsuji Togawa