Patents by Inventor Tomoya Hosoda

Tomoya Hosoda has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20220118742
    Abstract: As an exemplary configuration, a long film is configured by thermomeltable polymers including a first unit based on tetrafluoroethylene and a second unit based on perfluoro (alkyl vinyl ether), including spherulites of the thermomeltable polymers, wherein radius of each spherulite is 10 ?m or less. As another exemplary configuration, a long film is configured by tetrafluoroethylene polymers having a melt flow rate within a range of 5 to 40 g/10 min. The long film is heated at 180° C. for 30 minutes so as to measure the thermal expansion rate, and when letting thermal expansion rate in a first direction, which extends at a 45-degree angle to a melt flow direction be A, and thermal expansion rate in a second direction orthogonal to the first direction be B, A and B are respectively within the range of ?2 to +1%, and |A?B| is 1% or less.
    Type: Application
    Filed: December 27, 2021
    Publication date: April 21, 2022
    Applicant: AGC Inc.
    Inventors: Wataru KASAI, Yuya HORIGUCHI, Seigo KOTERA, Tomoya HOSODA
  • Patent number: 11174411
    Abstract: To provide a liquid composition whereby a resin powder can be uniformly dispersed in a resin or the like without being scattered, and a method for producing a film, a laminate or the like by using the liquid composition. The liquid composition comprises a liquid medium and a resin powder dispersed in the liquid medium, and characterized in that the average particle size of the resin powder is from 0.3 to 6 ?m, the volume-based cumulative 90% diameter of the resin powder is at most 8 ?m, and the resin powder is a resin containing a fluorinated copolymer having a specific functional group. And, the method is a method for producing a film, a laminate or the like by using the liquid composition.
    Type: Grant
    Filed: January 16, 2019
    Date of Patent: November 16, 2021
    Assignee: AGC Inc.
    Inventors: Tomoya Hosoda, Tatsuya Terada, Shigeki Kobayashi, Atsumi Yamabe
  • Patent number: 11065790
    Abstract: To provide a fluorinated copolymer composition having improved impact resistance and excellent moldability without impairing the excellent heat resistance and mechanical properties inherent to a thermoplastic heat-resistant resin. This fluorinated copolymer composition comprises a thermoplastic resin A being a melt-moldable heat-resistant thermoplastic resin and a fluorinated elastomer B being a fluorinated elastic copolymer, wherein the fluorinated elastomer B is dispersed in the thermoplastic resin A, the number average particle diameter of the fluorinated elastomer B is from 1 to 300 ?m, the volume ratio of the thermoplastic resin A to the fluorinated elastomer B is from 97:3 to 55:45, and the fluorinated copolymer composition has a flexural modulus of from 1,000 to 3,700 MPa.
    Type: Grant
    Filed: October 24, 2018
    Date of Patent: July 20, 2021
    Assignee: AGC Inc.
    Inventors: Takashi Sato, Tomoya Hosoda, Tatsuya Terada, Masatoshi Abe
  • Patent number: 11041053
    Abstract: A resin powder having a high bulk density and an average particle size of at most 50 ?m from resin particles containing a fluorocopolymer as the main component and having a melting point of 260 to 320° C., where the fluorocopolymer contains a unit containing a carbonyl group-containing group, a unit based on tetrafluoroethylene, and a unit based on a perfluoro(alkyl vinyl ether) or a unit based on hexafluoropropylene. A method of producing the resin powder by subjecting resin particles (A) having an average particle size of at least 100 ?m to mechanical pulverization treatment. The resin particles (A) is made of a material (X) having a fluorocopolymer (X1) as the main component, which has a unit (1) based on a monomer containing at least one functional group selected from a carbonyl group-containing group, a hydroxy group, an epoxy group and an isocyanate group, and a unit (2) based on tetrafluoroethylene.
    Type: Grant
    Filed: December 10, 2019
    Date of Patent: June 22, 2021
    Assignee: AGC Inc.
    Inventors: Tomoya Hosoda, Eiichi Nishi, Toru Sasaki, Nobutaka Kidera
  • Patent number: 10982063
    Abstract: To provide a resin composition, wherein the resin composition is excellent in impregnation into a reinforcing fiber sheet as it contains a polyamide having a low viscosity number; wherein the resin composition can be molded into a film, a fiber, etc., even though it contains a polyamide having a low viscosity number; and wherein the resin composition can produce a fiber-reinforced molded product having excellent impact resistance; a molded product and a method for its production; and a fiber-reinforced molded product having excellent impact resistance and a method for its production. A resin composition comprising: a polyamide having a viscosity number of from 100 to 170 determined by a method specified in ISO 307: 2007; and a melt-processable fluororesin having at least one type of a functional group selected from the group consisting of a carbonyl group-containing group, a hydroxy group, an epoxy group and an isocyanate group, and having a melting point of from 100 to 325° C.
    Type: Grant
    Filed: January 24, 2020
    Date of Patent: April 20, 2021
    Assignee: AGC Inc.
    Inventors: Norio Ozawa, Tomoya Hosoda, Takashi Sato
  • Patent number: 10920030
    Abstract: To provide a prepreg excellent in storage stability and capable of obtaining a fiber-reinforced molded product excellent in impact resistance, and a method for its production, as well as a fiber-reinforced molded product excellent in impact resistance. The prepreg comprises reinforcing fibers and a matrix resin, wherein the matrix resin comprises a thermoplastic resin (but excluding the following fluororesin) and a melt-formable fluororesin having a melting point of from 100 to 325° C. and having functional groups of at least one type selected from the group consisting of carbonyl group-containing groups, hydroxy groups, epoxy groups and isocyanate groups, and in 100 mass % of the total of the thermoplastic resin and the fluororesin, the proportion of the thermoplastic resin is from more than 30 to 99 mass % and the proportion of the fluororesin is from 1 to less than 70 mass %.
    Type: Grant
    Filed: June 4, 2018
    Date of Patent: February 16, 2021
    Assignee: AGC Inc.
    Inventors: Tomoya Hosoda, Takashi Sato, Masatoshi Abe
  • Publication number: 20210040252
    Abstract: A material for a printed circuit board, which is a film composed of a fluorinated resin layer, where the fluorinated resin layer contains a composition containing a fluorinated copolymer having at least one functional group selected from a carbonyl group-containing group, a hydroxy group, an epoxy group and an isocyanate group, has a melt flow rate of at most 15 g/10 min measured at 372° C. under a load of 49N, and has a storage elastic modulus of at least 650 MPa.
    Type: Application
    Filed: October 14, 2020
    Publication date: February 11, 2021
    Applicant: AGC Inc.
    Inventors: Tomoya HOSODA, Wataru KASAI, Toru SASAKI, Masatoshi ABE
  • Publication number: 20210024702
    Abstract: To provide a dispersion, a laminate, a film and an impregnated woven fabric. A powder dispersion comprising powder I of polymer I having units based on tetrafluoroethylene and an oxygen-containing polar group, powder II of polymer II containing units based on a fluoroolefin, a dispersing agent, and a liquid dispersion medium, wherein the ratio of the mass content of the polymer I to the mass content of the polymer II is at most 0.7, or such a power dispersion wherein the dispersing agent is a fluorinated surfactant having a hydroxy group. A laminate, a film, and an impregnated woven fabric produced by using such a powder dispersion.
    Type: Application
    Filed: October 9, 2020
    Publication date: January 28, 2021
    Applicant: AGC Inc.
    Inventors: Atsumi YAMABE, Tomoya HOSODA, Wataru KASAI
  • Publication number: 20200369878
    Abstract: To provide a molded product which is excellent in impact resistance, flexibility and bending resistance without impairing the characteristics (heat resistance, mechanical properties, etc.) of a polyaryletherketone, and has little appearance defects, and a resin composition, whereby it is possible to obtain such a molded product. This resin composition comprises a polyaryletherketone and a fluorinated elastomer. The ratio (MFRA/MFRB) of the melt flow rate MFRA of the polyaryletherketone at a temperature of 372° C. under a load of 49 N to the melt flow rate MFRB of the fluorinated elastomer at a temperature of 372° C. under a load of 49 N is from 0.2 to 5.0, and the proportion of the volume of the polyaryletherketone in the total of the volume of the polyaryletherketone and the volume of the fluorinated elastomer is from 60 to 97 vol %.
    Type: Application
    Filed: August 13, 2020
    Publication date: November 26, 2020
    Applicant: AGC Inc.
    Inventors: Norio OZAWA, Tomoya Hosoda, Takashi Sato
  • Patent number: 10844153
    Abstract: A material having a fluorinated resin layer is subjected to heat treatment. The fluorinated resin layer is composed of a composition containing a fluorinated copolymer (a) having at least one type of functional group selected from a carbonyl group-containing group, a hydroxy group, an epoxy group and an isocyanate group, having a melting point of from 280 to 320° C. and a melt flow rate of at least 2 g/10 min measured at 372° C. under a load of 49 N. The heat treatment is carried out at a temperature of at least 250° C. and lower by at least 5° C. than the melting point of the fluorinated copolymer (a) so that the ratio of the melt flow rate of the fluorinated resin layer after the heat treatment to that before the heat treatment, and the melt flow rate of the fluorinated resin layer after the heat treatment, are respectively within specific ranges.
    Type: Grant
    Filed: October 18, 2017
    Date of Patent: November 24, 2020
    Assignee: AGC Inc.
    Inventors: Tomoya Hosoda, Wataru Kasai, Toru Sasaki, Masatoshi Abe
  • Publication number: 20200361181
    Abstract: To provide a method for producing a laminate, capable of forming a coating film excellent in abrasion resistance by using a fluororesin powder, and capable of suppressing foaming when the coating film is formed by using the fluororesin powder. A method for producing a laminate 10 comprising a substrate 12 and a coating film 14 formed on a surface of the substrate 12, which comprises applying the following powder composition to the surface of the substrate 12 to form the coating film 14. Powder composition: A powder composition comprising a fluororesin powder formed of a resin material containing as the main component a melt-moldable fluororesin which has a carbonyl group-containing group or the like, and having D50 of from 0.01 to 100 ?m, and a non-fluororesin powder formed of a resin material containing as the main component a non-fluororesin such as a polyarylketone, and having D50 of from 0.01 to 100 ?m, in a specific volume proportion.
    Type: Application
    Filed: August 4, 2020
    Publication date: November 19, 2020
    Applicant: AGC Inc.
    Inventors: Tomoya Hosoda, Norio Ozawa, Takashi Sato
  • Patent number: 10836877
    Abstract: To provide a prepreg excellent in storage stability and capable of obtaining a fiber-reinforced molded product excellent in impact resistance, chemical resistance and inter-member (interlayer) adhesion and a method for its production as well as a fiber-reinforced molded product excellent in impact resistance, chemical resistance and inter-member (interlayer) adhesion. The prepreg comprises reinforcing fibers and a matrix resin, wherein the matrix resin comprises, as a resin component, only a melt-moldable fluororesin having a melting point of from 100 to 325° C.
    Type: Grant
    Filed: June 4, 2018
    Date of Patent: November 17, 2020
    Assignee: AGC Inc.
    Inventors: Tomoya Hosoda, Takashi Sato, Masatoshi Abe
  • Publication number: 20200338872
    Abstract: The purpose of the present invention is to provide a laminate being excellent in chemical resistance, wear resistance, vibration absorption properties and flame resistance, and having high mechanical strength; and a method for its production. A laminate 1 comprises a fiber-reinforced resin layer 20 which comprises a reinforcing fiber base material and a resin component containing at least 50 vol % of a specific fluororesin, wherein the ratio of the reinforcing fiber base material to the total volume of the reinforcing fiber base material and the resin component is from 0.30 to 0.70, and a specific substrate 10, wherein at least one outermost layer is the fiber-reinforced resin layer 20, and the ratio of the total thickness of the fiber-reinforced resin layer 20 to the total thickness of the substrate 10 is from 1/99 to 30/70.
    Type: Application
    Filed: July 9, 2020
    Publication date: October 29, 2020
    Applicant: AGC Inc.
    Inventors: Norio OZAWA, Tomoya HOSODA, Takashi SATO
  • Publication number: 20200329558
    Abstract: To provide a long laminate capable of obtaining a printed wiring board which is capable of satisfying both reduction in the thickness of a resin layer and increase in the signal transmission speed, and which, while being excellent in dimensional stability and folding endurance, has no wrinkles in a fluororesin layer; a method for producing a long laminate which has a thin fluororesin layer which has no wrinkles; and a printed wiring board. A long laminate 10 comprising a metal layer 12 made of a long metal foil, a fluororesin layer 14 containing a fluororesin, in contact with the metal layer 12, and a heat-resistant resin layer 16 containing a heat-resistant resin, in contact with the fluororesin layer 14, wherein the thickness per one fluororesin layer 14 is from 1 to 10 ?m, the ratio (T1/T2) of the total thickness T1 of the fluororesin layer 14 to the total thickness T2 of the heat-resistant resin layer 16, is from 0.3 to 3.
    Type: Application
    Filed: June 25, 2020
    Publication date: October 15, 2020
    Applicant: AGO Inc.
    Inventors: Wataru Kasai, Tomoya Hosoda, Atsumi Yamabe
  • Publication number: 20200317948
    Abstract: To provide a dispersion excellent in miscibility with varnish, coating properties, dispersibility and dispersion stability; and methods for producing a metal laminate and a printed board. A dispersion comprises an organic solvent and a powder so that the powder is dispersed in the organic solvent, wherein the powder is a powder containing a tetrafluoroethylene type polymer having a melt viscosity at 380° C. of from 1×102 to 1×106 Pa·s; the viscosity is from 50 to 10,000 mPa·s; and the thixotropy ratio calculated by dividing the viscosity measured under the condition of rotational speed of 30 rpm by the viscosity measured under the condition of rotational speed of 60 rpm, is from 1.0 to 2.2.
    Type: Application
    Filed: June 18, 2020
    Publication date: October 8, 2020
    Applicant: AGC Inc.
    Inventors: Tatsuya Terada, Tomoya Hosoda, Atsumi Yamabe
  • Patent number: 10716203
    Abstract: To provide an adhesive film comprising a polyimide film and a fluorinated resin layer directly laminated, in which blisters (foaming) in an atmosphere corresponding to reflow soldering at high temperature are suppressed, and a flexible metal laminate. An adhesive film having a fluorinated resin layer containing a fluorinated copolymer (A) directly laminated on one side or both sides of a polyimide film, wherein the fluorinated copolymer (A) has a melting point of at least 280° C. and at most 320° C., is melt-moldable, and has at least one type of functional groups selected from the group consisting of a carbonyl group-containing group, a hydroxy group, an epoxy group and an isocyanate group, and the fluorinated resin layer has a thickness of from 1 to 20 ?m.
    Type: Grant
    Filed: April 28, 2016
    Date of Patent: July 14, 2020
    Assignee: AGC Inc.
    Inventors: Tomoya Hosoda, Eiichi Nishi, Toru Sasaki, Yasuhiko Matsuoka, Wataru Kasai
  • Publication number: 20200198310
    Abstract: To provide a molded product, a metal-clad laminate and a printed wiring board, each of which contains a tetrafluoroethylene type polymer, whereby an decrease in electrical characteristics is inhibited and a hole can be easily bored with UV-YAG laser; and methods for their production. A molded product containing a tetrafluoroethylene type polymer, in which the content of components other than the tetrafluoroethylene type polymer is at most 0.9 mass %, and which has a wavelength range where the extinction coefficient becomes to be from 1.2 to 4.5 at from 200 to 380 nm; and a method for its production. A metal-clad laminate having a conductive metal layer and a layer of the molded product; and a method for its production. A printed wiring board provided with the metal-clad laminate and having through-holes in the thickness direction of the polymer layer.
    Type: Application
    Filed: March 4, 2020
    Publication date: June 25, 2020
    Applicant: AGC Inc.
    Inventors: Wataru KASAI, Tomoya HOSODA
  • Patent number: 10677379
    Abstract: To provide a laminate which is formed from resins and is excellent in heat resistance and excellent in flexibility and mechanical properties under high-temperature conditions and which undergoes no separation of layers even when contacted with oil such as engine oil for a long period of time. The laminate comprises a first layer containing a fluorinated copolymer and a second layer containing a polyamide directly laminated on the first layer, wherein the fluorinated copolymer has units based on tetrafluoroethylene, units based on ethylene, units based on a copolymerizable another monomer not having a carbonyl group, and carbonyl group-containing groups, wherein the amounts of the respective units are in specific ranges, and the tensile elongation at 200° C. of the fluorinated copolymer is at least 200%, and the melting point of the polyamide and the flexural elastic modulus at 23° C. of the second layer are in specific ranges.
    Type: Grant
    Filed: October 2, 2017
    Date of Patent: June 9, 2020
    Assignee: AGC Inc.
    Inventors: Eiichi Nishi, Tomoya Hosoda, Toru Sasaki
  • Publication number: 20200157301
    Abstract: To provide a resin composition, wherein the resin composition is excellent in impregnation into a reinforcing fiber sheet as it contains a polyamide having a low viscosity number; wherein the resin composition can be molded into a film, a fiber, etc., even though it contains a polyamide having a low viscosity number; and wherein the resin composition can produce a fiber-reinforced molded product having excellent impact resistance; a molded product and a method for its production; and a fiber-reinforced molded product having excellent impact resistance and a method for its production. A resin composition comprising: a polyamide having a viscosity number of from 100 to 170 determined by a method specified in ISO 307: 2007; and a melt-processable fluororesin having at least one type of a functional group selected from the group consisting of a carbonyl group-containing group, a hydroxy group, an epoxy group and an isocyanate group, and having a melting point of from 100 to 325° C.
    Type: Application
    Filed: January 24, 2020
    Publication date: May 21, 2020
    Applicant: AGC Inc.
    Inventors: Norio OZAWA, Tomoya HOSODA, Takashi SATO
  • Publication number: 20200115509
    Abstract: To provide a method capable of producing, by means of mechanical pulverization, a resin powder having a high bulk density and an average particle size of at most 50 ?m from resin particles containing a fluorocopolymer as the main component and having a melting point of from 260 to 320° C., such as PFA. The method is to obtain a resin powder having an average particle size of from 0.02 to 50 ?m by subjecting resin particles (A) having an average particle size of at least 100 ?m to mechanical pulverization treatment. The resin particles (A) is made of a material (X) having a fluorocopolymer (X1) as the main component; and said fluorocopolymer (X1) has a unit (1) based on a monomer containing at least one type of functional group selected from the group consisting of a carbonyl group-containing group, a hydroxy group, an epoxy group and an isocyanate group, and a unit (2) based on tetrafluoroethylene, and has a melting point of from 260 to 320° C.
    Type: Application
    Filed: December 10, 2019
    Publication date: April 16, 2020
    Applicant: AGC Inc.
    Inventors: Tomoya HOSODA, Eiichi NISHI, Toru SASAKI, Nobutaka KIDERA