Abstract: A heat-resistant film that has high adhesion and low warping, a method for producing the film, and a metal-clad laminate and a coated metal conductor, using the film. The film includes an aromatic polyimide base film, and a layer containing a polymer having units based on tetrafluoroethylene and units based on a perfluoro(alkyl vinyl ether) and an aromatic polymer, formed on each side of the base film.

Abstract: As an exemplary configuration, a long film is configured by thermomeltable polymers including a first unit based on tetrafluoroethylene and a second unit based on perfluoro (alkyl vinyl ether), including spherulites of the thermomeltable polymers, wherein radius of each spherulite is 10 ?m or less. As another exemplary configuration, a long film is configured by tetrafluoroethylene polymers having a melt flow rate within a range of 5 to 40 g/10 min. The long film is heated at 180° C. for 30 minutes so as to measure the thermal expansion rate, and when letting thermal expansion rate in a first direction, which extends at a 45-degree angle to a melt flow direction be A, and thermal expansion rate in a second direction orthogonal to the first direction be B, A and B are respectively within the range of ?2 to +1%, and |A?B| is 1% or less.

Abstract: To provide a reinforced glass container which has impact resistance and which can be used for treatment involving exposure to high temperatures or ultraviolet irradiation. The reinforced glass container of the present invention comprises a glass container and a polymer layer provided on the outer surface of the glass container and having a thickness of more than 1 ?m, wherein the polymer layer contains a tetrafluoroethylene type polymer having a melting temperature of more than 260° C. and having carbonyl group-containing groups or hydroxy group-containing groups.

Abstract: To provide a molded product which is excellent in impact resistance, flexibility and bending resistance without impairing the characteristics (heat resistance, mechanical properties, etc.) of a polyaryletherketone, and has little appearance defects, and a resin composition, whereby it is possible to obtain such a molded product. This resin composition comprises a polyaryletherketone and a fluorinated elastomer. The ratio (MFRA/MFRB) of the melt flow rate MFRA of the polyaryletherketone at a temperature of 372° C. under a load of 49 N to the melt flow rate MFRB of the fluorinated elastomer at a temperature of 372° C. under a load of 49 N is from 0.2 to 5.0, and the proportion of the volume of the polyaryletherketone in the total of the volume of the polyaryletherketone and the volume of the fluorinated elastomer is from 60 to 97 vol %.

Abstract: To provide a powder dispersion comprising a tetrafluoroethylene polymer, a particular polyoxyalkylene-modified polydimethylsiloxane and a liquid dispersion medium, and a composite having a baked product having physical properties intrinsic to the tetrafluoroethylene polymer. [Solution] The powder dispersion of the present invention comprises a powder of a tetrafluorethylene polymer, a liquid dispersion medium and a polyoxyalkylene-modified polydimethylsiloxane having a weight average molecular weight of at most 3,000 and an HLB value of from 1 to 18 calculated by Griffin's equation The composite of the present invention is produced by applying the powder dispersion of the present invention to the surface of a substrate and heating the powder dispersion.

Abstract: The purpose of the present invention is to provide a laminate being excellent in chemical resistance, wear resistance, vibration absorption properties and flame resistance, and having high mechanical strength; and a method for its production. A laminate 1 comprises a fiber-reinforced resin layer 20 which comprises a reinforcing fiber base material and a resin component containing at least 50 vol % of a specific fluororesin, wherein the ratio of the reinforcing fiber base material to the total volume of the reinforcing fiber base material and the resin component is from 0.30 to 0.70, and a specific substrate 10, wherein at least one outermost layer is the fiber-reinforced resin layer 20, and the ratio of the total thickness of the fiber-reinforced resin layer 20 to the total thickness of the substrate 10 is from 1/99 to 30/70.

Abstract: Provided is a long laminate for a printed wiring board, which has reduced thickness of a resin layer and increased signal transmission speed, and which, while being excellent in dimensional stability and folding endurance, has no wrinkles in a fluororesin layer. The long laminate contains a metal layer of a long metal foil, a fluororesin layer containing a fluororesin and contacting the metal layer, and a heat-resistant resin layer containing a heat-resistant resin and contacting the fluororesin layer. Each fluororesin layer is 1 to 10 ?m thick. The ratio of the total thickness of the fluororesin layer to the total thickness of the heat-resistant resin layer is 0.3 to 3.0. The sum of the total thickness of the fluororesin layer and the total thickness of the heat-resistant resin layer is at most 50 ?m. Also provided are a method for producing the long laminate, and the printed wiring board.

Abstract: To provide a molded product, a metal-clad laminate and a printed wiring board, each of which contains a tetrafluoroethylene type polymer, whereby an decrease in electrical characteristics is inhibited and a hole can be easily bored with UV-YAG laser; and methods for their production. A molded product containing a tetrafluoroethylene type polymer, in which the content of components other than the tetrafluoroethylene type polymer is at most 0.9 mass %, and which has a wavelength range where the extinction coefficient becomes to be from 1.2 to 4.5 at from 200 to 380 nm; and a method for its production. A metal-clad laminate having a conductive metal layer and a layer of the molded product; and a method for its production. A printed wiring board provided with the metal-clad laminate and having through-holes in the thickness direction of the polymer layer.

Abstract: The purpose of the present invention is to provide a fluororesin film or fluororesin laminate excellent in heat resistance and excellent in interlayer adhesion to an object to be laminated, such as a prepreg, a method for producing a hot pressed laminate using said film or laminate, and a method for producing a printed circuit board. The fluororesin film contains a fluororesin having a melting point of from 260 to 380° C., and has an arithmetic average roughness Ra of at least 3.0 nm when inside of 1 ?m2 of at least one surface thereof in the thickness direction is measured by an atomic force microscope. The laminate 1 has a layer A10 containing said fluororesin and a layer B12 made of another substrate, wherein the layer A10 has an arithmetic average roughness Ra of at least 3.0 nm when inside of 1 ?m2 of a second surface 10b thereof is measured by an atomic force microscope.

Abstract: To provide a film which is excellent in heat resistance, which is less likely to be warped and which has high adhesion, a method for producing it, and a metal-clad laminate and a coated metal conductor, using the film. The film of the present invention comprises an aromatic polyimide base film, and a layer containing a polymer having units based on tetrafluoroethylene and units based on a perfluoro(alkyl vinyl ether) and an aromatic polymer, formed on each side of the base film.

Abstract: As an exemplary configuration, a long film is configured by thermomeltable polymers including a first unit based on tetrafluoroethylene and a second unit based on perfluoro (alkyl vinyl ether), including spherulites of the thermomeltable polymers, wherein radius of each spherulite is 10 ?m or less. As another exemplary configuration, a long film is configured by tetrafluoroethylene polymers having a melt flow rate within a range of 5 to 40 g/10 min. The long film is heated at 180° C. for 30 minutes so as to measure the thermal expansion rate, and when letting thermal expansion rate in a first direction, which extends at a 45-degree angle to a melt flow direction be A, and thermal expansion rate in a second direction orthogonal to the first direction be B, A and B are respectively within the range of ?2 to +1%, and |A?B| is 1% or less.

Abstract: To provide a liquid composition whereby a resin powder can be uniformly dispersed in a resin or the like without being scattered, and a method for producing a film, a laminate or the like by using the liquid composition. The liquid composition comprises a liquid medium and a resin powder dispersed in the liquid medium, and characterized in that the average particle size of the resin powder is from 0.3 to 6 ?m, the volume-based cumulative 90% diameter of the resin powder is at most 8 ?m, and the resin powder is a resin containing a fluorinated copolymer having a specific functional group. And, the method is a method for producing a film, a laminate or the like by using the liquid composition.

Abstract: To provide a fluorinated copolymer composition having improved impact resistance and excellent moldability without impairing the excellent heat resistance and mechanical properties inherent to a thermoplastic heat-resistant resin. This fluorinated copolymer composition comprises a thermoplastic resin A being a melt-moldable heat-resistant thermoplastic resin and a fluorinated elastomer B being a fluorinated elastic copolymer, wherein the fluorinated elastomer B is dispersed in the thermoplastic resin A, the number average particle diameter of the fluorinated elastomer B is from 1 to 300 ?m, the volume ratio of the thermoplastic resin A to the fluorinated elastomer B is from 97:3 to 55:45, and the fluorinated copolymer composition has a flexural modulus of from 1,000 to 3,700 MPa.

Abstract: A resin powder having a high bulk density and an average particle size of at most 50 ?m from resin particles containing a fluorocopolymer as the main component and having a melting point of 260 to 320° C., where the fluorocopolymer contains a unit containing a carbonyl group-containing group, a unit based on tetrafluoroethylene, and a unit based on a perfluoro(alkyl vinyl ether) or a unit based on hexafluoropropylene. A method of producing the resin powder by subjecting resin particles (A) having an average particle size of at least 100 ?m to mechanical pulverization treatment. The resin particles (A) is made of a material (X) having a fluorocopolymer (X1) as the main component, which has a unit (1) based on a monomer containing at least one functional group selected from a carbonyl group-containing group, a hydroxy group, an epoxy group and an isocyanate group, and a unit (2) based on tetrafluoroethylene.

Abstract: To provide a resin composition, wherein the resin composition is excellent in impregnation into a reinforcing fiber sheet as it contains a polyamide having a low viscosity number; wherein the resin composition can be molded into a film, a fiber, etc., even though it contains a polyamide having a low viscosity number; and wherein the resin composition can produce a fiber-reinforced molded product having excellent impact resistance; a molded product and a method for its production; and a fiber-reinforced molded product having excellent impact resistance and a method for its production. A resin composition comprising: a polyamide having a viscosity number of from 100 to 170 determined by a method specified in ISO 307: 2007; and a melt-processable fluororesin having at least one type of a functional group selected from the group consisting of a carbonyl group-containing group, a hydroxy group, an epoxy group and an isocyanate group, and having a melting point of from 100 to 325° C.

Abstract: To provide a prepreg excellent in storage stability and capable of obtaining a fiber-reinforced molded product excellent in impact resistance, and a method for its production, as well as a fiber-reinforced molded product excellent in impact resistance. The prepreg comprises reinforcing fibers and a matrix resin, wherein the matrix resin comprises a thermoplastic resin (but excluding the following fluororesin) and a melt-formable fluororesin having a melting point of from 100 to 325° C. and having functional groups of at least one type selected from the group consisting of carbonyl group-containing groups, hydroxy groups, epoxy groups and isocyanate groups, and in 100 mass % of the total of the thermoplastic resin and the fluororesin, the proportion of the thermoplastic resin is from more than 30 to 99 mass % and the proportion of the fluororesin is from 1 to less than 70 mass %.

Abstract: A material for a printed circuit board, which is a film composed of a fluorinated resin layer, where the fluorinated resin layer contains a composition containing a fluorinated copolymer having at least one functional group selected from a carbonyl group-containing group, a hydroxy group, an epoxy group and an isocyanate group, has a melt flow rate of at most 15 g/10 min measured at 372° C. under a load of 49N, and has a storage elastic modulus of at least 650 MPa.

Abstract: To provide a dispersion, a laminate, a film and an impregnated woven fabric. A powder dispersion comprising powder I of polymer I having units based on tetrafluoroethylene and an oxygen-containing polar group, powder II of polymer II containing units based on a fluoroolefin, a dispersing agent, and a liquid dispersion medium, wherein the ratio of the mass content of the polymer I to the mass content of the polymer II is at most 0.7, or such a power dispersion wherein the dispersing agent is a fluorinated surfactant having a hydroxy group. A laminate, a film, and an impregnated woven fabric produced by using such a powder dispersion.

Abstract: To provide a molded product which is excellent in impact resistance, flexibility and bending resistance without impairing the characteristics (heat resistance, mechanical properties, etc.) of a polyaryletherketone, and has little appearance defects, and a resin composition, whereby it is possible to obtain such a molded product. This resin composition comprises a polyaryletherketone and a fluorinated elastomer. The ratio (MFRA/MFRB) of the melt flow rate MFRA of the polyaryletherketone at a temperature of 372° C. under a load of 49 N to the melt flow rate MFRB of the fluorinated elastomer at a temperature of 372° C. under a load of 49 N is from 0.2 to 5.0, and the proportion of the volume of the polyaryletherketone in the total of the volume of the polyaryletherketone and the volume of the fluorinated elastomer is from 60 to 97 vol %.

Abstract: A material having a fluorinated resin layer is subjected to heat treatment. The fluorinated resin layer is composed of a composition containing a fluorinated copolymer (a) having at least one type of functional group selected from a carbonyl group-containing group, a hydroxy group, an epoxy group and an isocyanate group, having a melting point of from 280 to 320° C. and a melt flow rate of at least 2 g/10 min measured at 372° C. under a load of 49 N. The heat treatment is carried out at a temperature of at least 250° C. and lower by at least 5° C. than the melting point of the fluorinated copolymer (a) so that the ratio of the melt flow rate of the fluorinated resin layer after the heat treatment to that before the heat treatment, and the melt flow rate of the fluorinated resin layer after the heat treatment, are respectively within specific ranges.