Abstract: To provide a powder for coating, whereby it is possible to form a coating film excellent in acid resistance. The powder comprises a fluororesin and particles of a composite oxide containing at least two metals selected from the group consisting of Cu, Mn, Co, Ni and Zn.

Abstract: To provide a prepreg excellent in storage stability and capable of obtaining a fiber-reinforced molded product excellent in impact resistance, chemical resistance and inter-member (interlayer) adhesion and a method for its production as well as a fiber-reinforced molded product excellent in impact resistance, chemical resistance and inter-member (interlayer) adhesion. The prepreg comprises reinforcing fibers and a matrix resin, wherein the matrix resin comprises, as a resin component, only a melt-moldable fluororesin having a melting point of from 100 to 325° C.

Abstract: To provide a prepreg excellent in storage stability and capable of obtaining a fiber-reinforced molded product excellent in impact resistance, and a method for its production, as well as a fiber-reinforced molded product excellent in impact resistance. The prepreg comprises reinforcing fibers and a matrix resin, wherein the matrix resin comprises a thermoplastic resin (but excluding the following fluororesin) and a melt-formable fluororesin having a melting point of from 100 to 325° C. and having functional groups of at least one type selected from the group consisting of carbonyl group-containing groups, hydroxy groups, epoxy groups and isocyanate groups, and in 100 mass % of the total of the thermoplastic resin and the fluororesin, the proportion of the thermoplastic resin is from more than 30 to 99 mass % and the proportion of the fluororesin is from 1 to less than 70 mass %.

Abstract: To provide a process for producing a wiring substrate with conduction failure in a hole formed in an electrical insulator layer suppressed even without conducting an etching treatment using metal sodium, and with unexpected deformation such as warpage suppressed even when the electrical insulator layer contains no woven fabric or non-woven fabric comprising reinforcing fibers. A process for producing a wiring substrate 1, which comprises forming a hole 20 in a laminate comprising a first conductor layer 12, an electrical insulator layer 10 which contains a specific fluororesin layer (A) 16 and a heat resistant resin layer (B) 18, contains no reinforcing fiber to substrate, and has a dielectric constant of from 2.0 to 3.5 and a linear expansion coefficient of from 0 to 35 ppm/° C.

Abstract: To produce a wiring substrate having excellent electrical characteristics with conduction failure in a hole formed in a layer made of a fluororesin material sufficiently suppressed without conducting an etching treatment using metal sodium. A process for producing a wiring substrate 1, which comprises forming a hole 20 in a laminate comprising a first conductor layer 12, a layer (A) 10 which is made of a fluororesin material containing a melt-moldable fluororesin (a) having specific functional groups and a reinforcing fiber substrate and which has a dielectric constant of from 2.0 to 3.

Abstract: To provide a method for producing a formed product comprising a fiber-reinforced composite material which is excellent in flame retardancy and chemical resistance and which can be formed into a complicated shape; and a laminated substrate which is used for the production method. A laminated substrate comprising at least one prepreg layer containing a reinforcing fiber sheet and a resin matrix, and at least one polymer layer containing a fluorinated polymer, wherein at least one interface where the prepreg layer and the polymer layer are in contact with each other is present, and adhesive functional groups are present in the surface of the polymer layer at the interface; and a method for producing a formed product, which comprises forming the above laminated substrate with heating.

Abstract: To provide a material for a printed circuit board which is less likely to be warped in a high temperature region (from 150 to 200° C.) while maintaining electrical properties, a metal laminate, methods for producing them, and a method for producing a printed circuit board. A material having a fluorinated resin layer is subjected to a heat treatment. The fluorinated resin layer is composed of a composition containing a fluorinated copolymer (a) having at least one type of functional group selected from the group consisting of a carbonyl group-containing group, a hydroxy group, an epoxy group and an isocyanate group, having a melting point of from 280 to 320° C. and a melt flow rate of at least 2 g/10 min measured at 372° C. under a load of 49 N. The heat treatment is carried out at a temperature of at least 250° C. and lower by at least 5° C.

Abstract: To provide a laminate which is formed from resins and is excellent in heat resistance and excellent in flexibility and mechanical properties under high-temperature conditions and which undergoes no separation of layers even when contacted with oil such as engine oil for a long period of time. The laminate comprises a first layer containing a fluorinated copolymer and a second layer containing a polyamide directly laminated on the first layer, wherein the fluorinated copolymer has units based on tetrafluoroethylene, units based on ethylene, units based on a copolymerizable another monomer not having a carbonyl group, and carbonyl group-containing groups, wherein the amounts of the respective units are in specific ranges, and the tensile elongation at 200° C. of the fluorinated copolymer is at least 200%, and the melting point of the polyamide and the flexural elastic modulus at 23° C. of the second layer are in specific ranges.

Abstract: To provide an insulated electric wire having an insulating layer comprising PFA, which is excellent in the abrasion resistance without increasing the thickness of the insulating layer. An insulated electric wire comprising a conductor and an insulating layer covering the conductor, wherein the insulating layer comprises a fluorinated copolymer (A) having units based on tetrafluoroethylene and units based on a perfluoroalkyl vinyl ether, the content of the units based on a perfluoroalkyl vinyl ether is from 0.1 to 1.9 mol % to the total units in the fluorinated copolymer (A); MRF of the fluorinated copolymer (A) as measured by the method in accordance with ASTM D-3307 is at least 0.1 and less than 15; the melting point of the fluorinated copolymer (A) is at least 260° C.; and the ratio of the thickness Di of the insulating layer to the diameter Dc of the conductor (Di/Dc) is less than 0.5.

Abstract: To provide a method capable of producing, by means of mechanical pulverization, a resin powder having a high bulk density and an average particle size of at most 50 ?m from resin particles containing a fluorocopolymer as the main component and having a melting point of from 260 to 320° C., such as PFA. The method is to obtain a resin powder having an average particle size of from 0.02 to 50 ?m by subjecting resin particles (A) having an average particle size of at least 100 ?m to mechanical pulverization treatment. The resin particles (A) is made of a material (X) having a fluorocopolymer (X1) as the main component; and said fluorocopolymer (X1) has a unit (1) based on a monomer containing at least one type of functional group selected from the group consisting of a carbonyl group-containing group, a hydroxy group, an epoxy group and an isocyanate group, and a unit (2) based on tetrafluoroethylene, and has a melting point of from 260 to 320° C.

Abstract: To provide a resin-coated metal pipe which is excellent in corrosion resistance and impact resistance, wherein adhesion between a plating layer and a resin coating layer is good even without a primer layer, and whereby the number of steps at the time of production is small, and the environmental burden is low. A resin-coated metal pipe (10) comprises a metal pipe (12), a plating layer (14) formed by hot dipping plating on the outer peripheral surface of the metal pipe (12), and a resin coating layer (16) formed by melt molding on the surface of the plating layer (14), wherein the resin coating layer (16) is made of a resin material comprising a melt-moldable fluororesin (A) having at least one type of reactive functional group selected from the group consisting of a carbonyl group-containing group, a hydroxy group, an epoxy group and an isocyanate group.

Abstract: To provide a production method capable of improving the abrasion resistance of an electric wire or molded article using a fluororesin, by electron beam irradiation in air at a temperature where the fluororesin does not melt, and a method for producing a resin material containing a modified fluororesin whereby an electric wire or a molded article excellent in abrasion resistance can be obtained. A method for producing an electric wire, which comprises a step of irradiating an electron beam to an insulating layer containing a fluororesin and covering a conductor, to form an insulating layer containing a modified fluororesin, characterized in that the fluororesin has a crystalline melting point of at least 260° C.

Abstract: To provide an adhesive film comprising a polyimide film and a fluorinated resin layer directly laminated, in which blisters (foaming) in an atmosphere corresponding to reflow soldering at high temperature are suppressed, and a flexible metal laminate. An adhesive film having a fluorinated resin layer containing a fluorinated copolymer (A) directly laminated on one side or both sides of a polyimide film, wherein the fluorinated copolymer (A) has a melting point of at least 280° C. and at most 320° C., is melt-moldable, and has at least one type of functional groups selected from the group consisting of a carbonyl group-containing group, a hydroxy group, an epoxy group and an isocyanate group, and the fluorinated resin layer has a thickness of from 1 to 20 ?m.

Abstract: To provide an insulating tape for covering, in which a polyimide film and a fluorinated resin film are laminated with excellent adhesion, and a method for producing a structure, which comprises covering a conductor with such an insulating tape for covering, followed by thermal treatment. The insulating tape for covering, comprises a polyimide film and a fluorinated resin film directly laminated on one or both surfaces of the polyimide film, wherein the fluorinated resin film contains a fluorinated copolymer (A) which has a melting point of from 220 to 320° C. and can be melt-molded and which has at least one type of functional groups selected from the group consisting of carbonyl group-containing groups, hydroxy groups, epoxy groups and isocyanate groups.

Abstract: To provide a covering material for a heat resistant electric wire, which can cover a core wire without breakage from a weld line and which is excellent in the stress crack resistance at high temperature. A covering material for a heat resistant electric wire, which comprises a fluorinated copolymer composition containing a melt-moldable fluorinated copolymer (A) and a non-fluorinated thermoplastic resin (B1) in a volume ratio of (A)/(B1)=99/1 to 60/40, wherein the non-fluorinated thermoplastic resin (B1) is contained in the fluorinated copolymer composition in the form of fine particles having an average dispersed particle size of at most 8 ?m, and the fluorinated copolymer composition has a storage elastic modulus of at least 90 MPa by dynamic viscoelasticity measurement at 200° C. Instead of the non-fluorinated thermoplastic resin (B1), a non-fluorinated resin (B2) having no melting point at 450° C.

Abstract: Disclosed is a material for fiber manufacturing comprising a liquid crystal polyester satisfying the following requirements (a) and (b): (a) the weight-average molecular weight is equal to or less than 30000 and the polydispersity is equal to or less than 2.5; and (b) the melt viscosity measured at 360° C. with conditions of a nozzle pore diameter of 0.5 mm and a shear velocity of 1000 s?1 using a flow feature testing machine is equal to or less than 70 Pa·s.

Abstract: The present invention provides a method for producing a liquid-crystalline polyester, which comprises melt-polymerizing monomers in a reactor having a draw outlet to obtain a polymer melt and drawing the polymer melt through the draw outlet, characterized in that the monomers comprise a compound selected from an aromatic hydroxycarboxylic acid and derivatives thereof, a compound selected from an aromatic dicarboxylic acid and derivatives thereof and a compound selected from an aromatic diol, an aromatic hydroxyamine, an aromatic diamine and derivatives thereof; the amount of units derived from a compound containing a 1,2-phenylene and/or a 1,3-phenylene skeleton(s) in the polyester is from 0 to 10 mol %; the melt polymerization is performed in the presence of a heterocyclic compound containing two or more nitrogen atoms; and the polymer melt has a flow initiation temperature of from 220 to 250° C.

Abstract: The present invention provides a method for producing a liquid-crystalline polyester, the method comprising: a step of melt-polymerizing raw monomers in a melt polymerization vessel to obtain a polymer melt; a step of drawing the polymer melt from the melt polymerization vessel and granulating the polymer melt to obtain a granulate; a step of allowing the granulate to undergo solid phase polymerization in a solid phase polymerization vessel to obtain a solid phase polymer; and a step of making an impact on the solid phase polymerization vessel containing the solid phase polymer, and taking out the solid phase polymer from the solid phase polymerization vessel.

Abstract: The present invention provides a method for producing a liquid-crystalline polyester, which comprises melt-polymerizing monomers in a reactor having a draw outlet to obtain a polymer melt and drawing the polymer melt through the draw outlet, characterized in that the monomers comprise a compound selected from an aromatic hydroxycarboxylic acid and derivatives thereof, a compound selected from an aromatic dicarboxylic acid and derivatives thereof and a compound selected from an aromatic diol, an aromatic hydroxyamine, an aromatic diamine and derivatives thereof; the amount of units derived from a compound containing a 1,2-phenylene and/or a 1,3-phenylene skeleton(s) in the polyester is from 0 to 10 mold; the melt polymerization is performed in the presence of a heterocyclic compound containing two or more nitrogen atoms; and the polymer melt has a flow initiation temperature of from 220 to 250° C.

Abstract: The present invention provides a method for producing a liquid-crystalline polyester, the method comprising: a step of melt-polymerizing raw monomers in a melt polymerization vessel to obtain a polymer melt; a step of drawing the polymer melt from the melt polymerization vessel and granulating the polymer melt to obtain a granulate; a step of allowing the granulate to undergo solid phase polymerization in a solid phase polymerization vessel to obtain a solid phase polymer; and a step of making an impact on the solid phase polymerization vessel containing the solid phase polymer, and taking out the solid phase polymer from the solid phase polymerization vessel.