Abstract: An optical module according to one embodiment includes: an optical element having a first side, a second side, and a third side; a housing; a thermoelectric cooler with the optical element being mounted on the thermoelectric cooler; a driving circuit arranged on the side of the first side of the optical element; a first bonding pad arranged on the side of the second side of the optical element; and a first wiring pattern provided on the frame body of the housing and connected to the first bonding pad of the optical element through the first bonding wiring, wherein the thermoelectric cooler has a plurality of Peltier elements arranged with spacings. A spacing between the plurality of Peltier elements located on the side of the second side is narrower than a spacing between the plurality of Peltier elements located in the center of the optical element.

Abstract: An optical module of one embodiment includes a semiconductor modulator having a rectangular planar shape, an input lens system facing the input port, a first output lens system facing the first output port, a second output lens system facing the second output port, a first monitor element facing the first monitor port, a second monitor element facing the second monitor port, a first polarizer disposed between the first monitor port and the first monitor element, and a second polarizer disposed between the second monitor port and the second monitor element.

Abstract: A method of assembling an optical module according to the present disclosure includes disposing an input lens system at a position facing an input port, sensing a light intensity of divided light rays, adjusting the input lens system, and optically coupling the input lens system to the input port, and disposing a first output lens system and a second output lens system at positions facing a first output port and a second output port, respectively, and optically coupling the first output lens system and the second output lens system to the first output port and the second output port, respectively.

Abstract: An optical module includes an optical semiconductor element a stem including a signal pin and a ground pin; and a circuit board, the circuit board including a signal through-hole, a ground through-hole, a ground layer, and a junction part, the signal through-hole being configured to be pierced by the signal pin, the ground through-hole being configured to be pierced by the ground pin, the signal line being configured to be electrically connected with the signal pin, the ground layer being configured to be electrically connected with the ground pin, the junction part being configured to connect the assistance through-hole and the ground layer around the assistance through-hole with the stem. The circuit board has a first distance between the assistance through-hole and the signal through-hole, the first distance being smaller than a second distance between the ground through-hole and the signal through-hole.

Abstract: A light device according to one embodiment includes a light source and an optical lens having an incidence plane extending in both a first axis and a second axis intersecting the first axis and an emission plane extending in both the first axis and the second axis. The optical lens converts incident light emitted from the light source and incident on the incidence plane into parallel light and emits the parallel light from the emission plane, and the incidence plane has a convex portion provided in a first direction in which the first axis extends and a concave portion provided in a second direction in which the second axis extends.

Abstract: An optical module includes a circuit board having a through hole for the lead terminal, a signal wiring connected to the lead terminal, a ground layer providing a reference potential, an opening through which the ground layer is exposed, and a bonding material connecting the ground layer to the metallic base. The lead terminal extends in a first direction, and the circuit board and the signal wiring extend in a second direction. When the circuit board is viewed from the first direction, the opening overlaps with the signal wiring, or when the opening does not overlap with the signal wiring, a first distance between the signal wiring and a closest point of the opening to the signal wiring is smaller than a second distance between the closest point and an edge of the circuit board.

Abstract: An optical module includes a base plate, a carrier, an optical semiconductor device, an optical lens component, and a transmissive resin member in a cured state disposed between the optical semiconductor device and the optical lens component. The optical semiconductor device has an optical end surface, and emits an outgoing beam from the optical end surface or receives an incoming beam at the optical end surface. The optical lens component has a first lens surface and a second lens surface, the first lens surface facing the optical end surface of the optical semiconductor device, the first lens surface being provided between the optical end surface and the second lens surface. The transmissive resin contains either an optical path of the outgoing beam or an optical path of the incoming beam between the optical end surface of the optical semiconductor device and the first lens surface of the optical lens component.

Abstract: An optical module includes a circuit board having a through hole for the lead terminal, a signal wiring connected to the lead terminal, a ground layer providing a reference potential, an opening through which the ground layer is exposed, and a bonding material connecting the ground layer to the metallic base. The lead terminal extends in a first direction, and the circuit board and the signal wiring extend in a second direction. When the circuit board is viewed from the first direction, the opening overlaps with the signal wiring, or when the opening does not overlap with the signal wiring, a first distance between the signal wiring and a closest point of the opening to the signal wiring is smaller than a second distance between the closest point and an edge of the circuit board.

Abstract: An optical semiconductor device comprises: a first wiring pattern provided on a carrier mounting surface of a dielectric substrate; a first reference potential pattern surrounding the first wiring pattern; a carrier block provided on the carrier mounting surface and having a main surface, a side surface, and a second wiring pattern and a second reference potential pattern constituting coplanar lines; and an optical semiconductor element provided on the main surface. One end portion of the second wiring pattern extends to at least an end edge on the side surface side in the main surface and is conductively joined to the first wiring pattern with a conductive joining material therebetween. One end portion of the second reference potential pattern extends to at least the end edge on the side surface side in the main surface and is conductively joined to the first reference potential pattern with a conductive joining material therebetween.

Abstract: An optical module that provides a semiconductor modulator, an input lens system and first and second output lens systems, and two monitor photodiodes is disclosed. The semiconductor modulator provides an input port, first and second output ports, and two monitor ports in one side thereof. The input port and the first and second output ports face the input lens system and the first and second lens systems, respectively. The two monitor ports face the two monitor photodiodes, respectively. The first and second output ports are symmetrically disposed with respect to the input port in the one side. The two monitor ports are disposed in respective outer sides of the first and second output ports and symmetrically with respect to the input port.

Abstract: Disclosed is an optical device including a first lens and a second lens. The first lens of the optical device is joined to an end surface of an optical waveguide of an optical element to emit light emitted from the optical element. The second lens is optically coupled with the first lens to convert the light emitted from the first lens into collimated light.

Abstract: A method according to one embodiment includes steps of: preparing an optical module and optical fiber holding member; attaching a clip member to a receptacle of the optical module and the optical fiber holding member; and pressing the receptacle of the optical module and the optical fiber holding member from below and pressing the clip member from above. The pressing step has pressing the first flat surface of the receptacle and the second flat surface of the optical fiber holding member at the third flat surface of the clip member, and which performed until the first flat surface of the receptacle and the second flat surface of the optical fiber holding member establish parallelism with the third flat surface of the clip member by using a jig that changes the parallelism of the pressing surface.

Abstract: The optical module includes: a housing having first and second end walls and a pair of side walls; a semiconductor laser element; a first TEC; a wavelength locker unit including an optical splitting component and an etalon filter; and a second TEC. The second end wall is provided with a feedthrough. The pair of side walls is not provided with an external connection terminal. The second TEC is disposed between the first TEC and the second end wall and has: a first substrate thermally coupled to a bottom surface of the housing; a second substrate thermally coupled to the etalon filter; and a heat transfer part that transfers heat. The optical module further includes a wiring pattern that is arranged side by side with the heat transfer part and that supplies electric power to the first TEC from the feedthrough.

Abstract: An optical module includes a base plate, a carrier, an optical semiconductor device, an optical lens component, and a transmissive resin member in a cured state disposed between the optical semiconductor device and the optical lens component. The optical semiconductor device has an optical end surface, and emits an outgoing beam from the optical end surface or receives an incoming beam at the optical end surface. The optical lens component has a first lens surface and a second lens surface, the first lens surface facing the optical end surface of the optical semiconductor device, the first lens surface being provided between the optical end surface and the second lens surface. The transmissive resin contains either an optical path of the outgoing beam or an optical path of the incoming beam between the optical end surface of the optical semiconductor device and the first lens surface of the optical lens component.

Abstract: An optical connector according to an embodiment includes: a receptacle in a cylindrical shape, the receptacle being configured to hold a first optical fiber, the receptacle having a flat surface on an outer surface thereof, the flat surface being parallel with a first optical axis of the first optical fiber; a plug in a cylindrical shape, the plug being configured to hold an optical fiber, the plug having a flat surface on an outer surface thereof, the second flat surface being parallel with a second optical axis of the optical fiber; and a clip member having a contact surface the flat surface with the flat surface, the clip member being configured to press the receptacle and the plug against each other for optically coupling the first optical fiber to the second optical fiber.

Abstract: An optical semiconductor device comprises: a first wiring pattern provided on a carrier mounting surface of a dielectric substrate; a first reference potential pattern surrounding the first wiring pattern; a carrier block provided on the carrier mounting surface and having a main surface, a side surface, and a second wiring pattern and a second reference potential pattern constituting coplanar lines; and an optical semiconductor element provided on the main surface. One end portion of the second wiring pattern extends to at least an end edge on the side surface side in the main surface and is conductively joined to the first wiring pattern with a conductive joining material therebetween. One end portion of the second reference potential pattern extends to at least the end edge on the side surface side in the main surface and is conductively joined to the first reference potential pattern with a conductive joining material therebetween.

Abstract: A method according to one embodiment includes steps of: preparing an optical module and optical fiber holding member; attaching a clip member to a receptacle of the optical module and the optical fiber holding member; and pressing the receptacle of the optical module and the optical fiber holding member from below and pressing the clip member from above. The pressing step has pressing the first flat surface of the receptacle and the second flat surface of the optical fiber holding member at the third flat surface of the clip member, and which performed until the first flat surface of the receptacle and the second flat surface of the optical fiber holding member establish parallelism with the third flat surface of the clip member by using a jig that changes the parallelism of the pressing surface.

Abstract: A life and death judgment system for a go game played with a computer comprising an input reception unit that receives an input by a player, a life and death judgment processing unit that judges whether judgment subject stones or target stones are alive, and an output processing unit that outputs the result of the life and death judgment is provided. The life and death judgment processing unit tentatively determines the priority of a move at each point when implementing the judgment in a judgment realm, judges a point of a move with a high possibility and/or a move with a low possibility of a result of the judgment, changes the priority of the point of the move with a high possibility with respect to each priority of the tentatively determined point, and undertakes the move of each stone based on the priority after such change, thereby implement the judgment.

Abstract: An optical module that provides a semiconductor modulator, an input lens system and first and second output lens systems, and two monitor photodiodes is disclosed. The semiconductor modulator provides an input port, first and second output ports, and two monitor ports in one side thereof. The input port and the first and second output ports face the input lens system and the first and second lens systems, respectively. The two monitor ports face the two monitor photodiodes, respectively. The first and second output ports are symmetrically disposed with respect to the input port in the one side. The two monitor ports are disposed in respective outer sides of the first and second output ports and symmetrically with respect to the input port.