Abstract: To provide an information processing apparatus, an information processing method, and a program for restraining a burden on a user who observes a three-dimensional image. Therefore, a display control unit performs display control to cause a three-dimensional image to be displayed so that a first plane surface parallel to a horizontal plane in a real space is observed in an area based on a distance between a lower end and an upper end of a display surface on which a display unit displays the three-dimensional image and an angle between the horizontal plane and the display surface.

Abstract: A multilayer coil component includes coil conductors including silver planar conductors and ferrite layers containing copper and stacked with the coil conductors and the planar conductors interposed therebetween. The coil conductors define a portion of a coil with a winding axis extending in a lamination direction. The planar conductors are arranged in the lamination direction at a position on an upper side of the coil so that each of principal surfaces thereof faces in the lamination direction and a specific region of the principal surface overlaps with the coil when viewed from the lamination direction. Each of the planar conductors includes first through holes penetrating the principal surface in the lamination direction in the specific region.

Abstract: A stack-type inductor element includes a stack including a magnetic element layer, a coil conductor pattern provided in the stack and the magnetic element layer defines a magnetic element core, a plurality of first pad electrodes provided on one main surface of the stack, and a plurality of second pad electrodes provided on the other main surface of the stack so as to be symmetric to the plurality of first pad electrodes. One end and the other end of the coil conductor pattern are electrically connected to two of the plurality of first pad electrodes, respectively, and the plurality of second pad electrodes are all electrically open.

Abstract: In a laminated coil component include coil conductors are respectively included on magnetic layers and a carbon paste is included on a magnetic layer. The coil conductors include a partial coil conductor and a partial coil conductor respectively corresponding to an outer side portion circle and an inner side portion circle defining two circles. A width of the carbon paste at least partially overlaps an interval between the outer side portion circle and the inner side portion circle defining the two circles, and extends circularly along the two circles. The carbon paste is shifted to the interval between the outer side portion circle and the inner side portion circle defining the two circles at the time of pressure-bonding the magnetic layers. The carbon paste vanishes when being calcined to define an air gap.

Abstract: A multilayer coil component includes coil conductors including silver planar conductors and ferrite layers containing copper and stacked with the coil conductors and the planar conductors interposed therebetween. The coil conductors define a portion of a coil with a winding axis extending in a lamination direction. The planar conductors are arranged in the lamination direction at a position on an upper side of the coil so that each of principal surfaces thereof faces in the lamination direction and a specific region of the principal surface overlaps with the coil when viewed from the lamination direction. Each of the planar conductors includes first through holes penetrating the principal surface in the lamination direction in the specific region.

Abstract: Provided is a laminated-type inductance device capable of reducing the number of layers for sandwiching a non-magnetic body layer and enhancing direct-current superposition characteristics without intentionally providing a space. In a conductive pattern, portions of the outer circumferential section thereof adjacent to end surface electrodes are respectively recessed toward the inside of the pattern when viewed from above. In other words, line widths are narrower at the above portions. Further, non-magnetic paste is formed between the end surface electrode and the outer circumferential section of the conductive pattern at each of the portions where the line width is narrower. By applying the non-negative paste in a space between the conductive pattern and the end surface electrode, the portion where the non-magnetic paste is applied has the same function as in a case where the non-magnetic ferrite layer is inserted therein.

Abstract: In a laminated coil component include coil conductors are respectively included on magnetic layers and a carbon paste is included on a magnetic layer. The coil conductors include a partial coil conductor and a partial coil conductor respectively corresponding to an outer side portion circle and an inner side portion circle defining two circles. A width of the carbon paste at least partially overlaps an interval between the outer side portion circle and the inner side portion circle defining the two circles, and extends circularly along the two circles. The carbon paste is shifted to the interval between the outer side portion circle and the inner side portion circle defining the two circles at the time of pressure-bonding the magnetic layers. The carbon paste vanishes when being calcined to define an air gap.

Abstract: Line conductors are provided on one principal surface of a magnetic layer, and line conductors are provided on the other principal surface of the magnetic layer. In addition, side conductors are provided on side surfaces of the magnetic layer to connect the line conductors in a coil shape. A non-magnetic layer is stacked at the one principal surface side of the magnetic layer, and a non-magnetic layer is stacked at the other principal surface side of the magnetic layer. Line conductors are provided within the non-magnetic layer, and line conductors are provided within the non-magnetic layer. Via-hole conductors are provided within the non-magnetic layer to connect the line conductors in parallel with the line conductors. In addition, via-hole conductors are provided within the non-magnetic layer to connect the line conductors in parallel with the line conductors.

Abstract: A multilayer inductor device in which parasitic inductance is made smaller while preventing increase in a mounting area of the device and complexity of a wiring pattern, and a manufacturing method of the stated multilayer inductor device. An outer electrode and a terminal electrode are connected to each other through a via hole. A side surface of a non-magnetic member forms a part of an end surface of the device, while the other side surface thereof being in contact with the via hole. A side surface of the via hole that makes contact with the non-magnetic member is opened, which prevents the parasitic inductance from being increased. The via hole being provided in an arbitrary position makes it possible to prevent the wiring pattern from being complicated and a mounting area of the device from being increased.

Abstract: A multilayer body 12 includes nonmagnetic sheets SH1a and SH1b each having an upper surface provided with a plurality of linear conductors 16, a magnetic sheet SH3 having an upper surface provided with a plurality of linear conductors 18a, and a nonmagnetic sheet SH4 having an upper surface provided with a plurality of linear conductors 18b, which are stacked one on top of another. Via-hole conductors or side-surface conductors are disposed with the multilayer body 12 so as to connect these linear conductors to one another and form an inductor. The plurality of linear conductors have a pattern that is common among at least two sheets adjacent to each other in a stacking direction.

Abstract: A stack-type inductor element includes a stack including a magnetic element layer, a coil-shaped conductor pattern provided in the stack, a plurality of first pad electrodes provided on one main surface of the stack, and a plurality of second pad electrodes provided on the other main surface of the stack and symmetric to the plurality of first pad electrodes. The stack is rectangular or substantially rectangular when viewed in a direction of stack of the stack. A first end and a second end of the coil-shaped conductor pattern are electrically connected to two of the plurality of first pad electrodes, respectively, and the plurality of second pad electrodes are all electrically open.

Abstract: A stack-type inductor element includes a stack including a magnetic element layer, a coil conductor pattern provided in the stack and the magnetic element layer defines a magnetic element core, a plurality of first pad electrodes provided on one main surface of the stack, and a plurality of second pad electrodes provided on the other main surface of the stack so as to be symmetric to the plurality of first pad electrodes. One end and the other end of the coil conductor pattern are electrically connected to two of the plurality of first pad electrodes, respectively, and the plurality of second pad electrodes are all electrically open.

Abstract: A stack-type inductor element includes a stack including a magnetic element layer, a coil conductor pattern provided in the stack and the magnetic element layer defines a magnetic element core, a plurality of first pad electrodes provided on one main surface of the stack, and a plurality of second pad electrodes provided on the other main surface of the stack so as to be symmetric to the plurality of first pad electrodes. One end and the other end of the coil conductor pattern are electrically connected to two of the plurality of first pad electrodes, respectively, and the plurality of second pad electrodes are all electrically open.

Abstract: Provided is a multilayer substrate that can prevent generation of cracks caused by stress generated due to a difference between the coefficient of linear expansion of electrode pads and that of a ceramic material. An electrode pad arranged on a layer below an outermost component mounting electrode pad has a larger area than an area of the component mounting electrode pad. Similarly, an electrode pad arranged on a layer below a component mounting electrode pad has a larger area than an area of the component mounting electrode pad, an electrode pad arranged on a layer below a component mounting electrode pad has a larger area than an area of the component mounting electrode pad, and an electrode pad arranged on a layer below a component mounting electrode pad has a larger area than an area of the component mounting electrode pad.

Abstract: Provided is a laminated-type inductance device capable of reducing the number of layers for sandwiching a non-magnetic body layer and enhancing direct-current superposition characteristics without intentionally providing a space. In a conductive pattern, portions of the outer circumferential section thereof adjacent to end surface electrodes are respectively recessed toward the inside of the pattern when viewed from above. In other words, line widths are narrower at the above portions. Further, non-magnetic paste is formed between the end surface electrode and the outer circumferential section of the conductive pattern at each of the portions where the line width is narrower. By applying the non-negative paste in a space between the conductive pattern and the end surface electrode, the portion where the non-magnetic paste is applied has the same function as in a case where the non-magnetic ferrite layer is inserted therein.

Abstract: Line conductors are provided on one principal surface of a magnetic layer, and line conductors are provided on the other principal surface of the magnetic layer. In addition, side conductors are provided on side surfaces of the magnetic layer to connect the line conductors in a coil shape. A non-magnetic layer is stacked at the one principal surface side of the magnetic layer, and a non-magnetic layer is stacked at the other principal surface side of the magnetic layer. Line conductors are provided within the non-magnetic layer, and line conductors are provided within the non-magnetic layer. Via-hole conductors are provided within the non-magnetic layer to connect the line conductors in parallel with the line conductors. In addition, via-hole conductors are provided within the non-magnetic layer to connect the line conductors in parallel with the line conductors.

Abstract: Provided is a multilayer substrate that can prevent generation of cracks caused by stress generated due to a difference between the coefficient of linear expansion of electrode pads and that of a ceramic material. An electrode pad arranged on a layer below an outermost component mounting electrode pad has a larger area than an area of the component mounting electrode pad. Similarly, an electrode pad arranged on a layer below a component mounting electrode pad has a larger area than an area of the component mounting electrode pad, an electrode pad arranged on a layer below a component mounting electrode pad has a larger area than an area of the component mounting electrode pad, and an electrode pad arranged on a layer below a component mounting electrode pad has a larger area than an area of the component mounting electrode pad.

Abstract: A multilayer body 12 includes nonmagnetic sheets SH1a and SH1b each having an upper surface provided with a plurality of linear conductors 16, a magnetic sheet SH3 having an upper surface provided with a plurality of linear conductors 18a, and a nonmagnetic sheet SH4 having an upper surface provided with a plurality of linear conductors 18b, which are stacked one on top of another. Via-hole conductors or side-surface conductors are disposed with the multilayer body 12 so as to connect these linear conductors to one another and form an inductor. The plurality of linear conductors have a pattern that is common among at least two sheets adjacent to each other in a stacking direction.

Abstract: A multilayer inductor device in which parasitic inductance is made smaller while preventing increase in a mounting area of the device and complexity of a wiring pattern, and a manufacturing method of the stated multilayer inductor device. An outer electrode and a terminal electrode are connected to each other through a via hole. A side surface of a non-magnetic member forms a part of an end surface of the device, while the other side surface thereof being in contact with the via hole. A side surface of the via hole that makes contact with the non-magnetic member is opened, which prevents the parasitic inductance from being increased. The via hole being provided in an arbitrary position makes it possible to prevent the wiring pattern from being complicated and a mounting area of the device from being increased.