Abstract: A stack-type inductor element includes a stack including a magnetic element layer, a coil conductor pattern provided in the stack and the magnetic element layer defines a magnetic element core, a plurality of first pad electrodes provided on one main surface of the stack, and a plurality of second pad electrodes provided on the other main surface of the stack so as to be symmetric to the plurality of first pad electrodes. One end and the other end of the coil conductor pattern are electrically connected to two of the plurality of first pad electrodes, respectively, and the plurality of second pad electrodes are all electrically open.

Abstract: A stack-type inductor element includes a stack including a magnetic element layer, a coil-shaped conductor pattern provided in the stack, a plurality of first pad electrodes provided on one main surface of the stack, and a plurality of second pad electrodes provided on the other main surface of the stack and symmetric to the plurality of first pad electrodes. The stack is rectangular or substantially rectangular when viewed in a direction of stack of the stack. A first end and a second end of the coil-shaped conductor pattern are electrically connected to two of the plurality of first pad electrodes, respectively, and the plurality of second pad electrodes are all electrically open.

Abstract: In a laminated inductor element, outer electrodes and terminal electrodes are electrically connected by via holes, internal wiring lines, and end surface electrodes. The via holes on an upper surface side are provided immediately under the outer electrodes and in a non-magnetic ferrite layer. The via holes on a lower surface side are provided immediately above the terminal electrodes and in a non-magnetic ferrite layer. Since outermost layers are defined by the non-magnetic ferrite layers, a parasitic inductance is not increased, even if the outermost layers are provided with the via holes. In this case, the internal wiring lines are not routed on a surface of the element. Therefore, there is no complication of a wiring pattern, and it is possible to prevent an increase in a mounting area of the element.

Abstract: In a laminated inductor element, a magnetic ferrite layer sandwiched between two conductor patterns is thinner than other magnetic ferrite layers. Therefore, a crack occurs in the magnetic ferrite layer due to firing. As a result of the occurrence of this crack, a stress applied to each layer is relaxed, and it becomes possible to avoid warpage, a crack, or the like. In addition, in the laminated type inductor element, the two conductor patterns are electrically connected by two via holes, and subjected to a same potential. Since the two conductor patterns correspond to a same wiring pattern and a coil of coil conductor is defined by the two conductor patterns, even if upper and lower coil conductors are electrically in contact with each other due to the crack, the two conductor patterns are not put into a short-circuited state.

Abstract: In a laminated inductor element, outer electrodes and terminal electrodes are electrically connected by via holes, internal wiring lines, and end surface electrodes. The via holes on an upper surface side are provided immediately under the outer electrodes and in a non-magnetic ferrite layer. The via holes on a lower surface side are provided immediately above the terminal electrodes and in a non-magnetic ferrite layer. Since outermost layers are defined by the non-magnetic ferrite layers, a parasitic inductance is not increased, even if the outermost layers are provided with the via holes. In this case, the internal wiring lines are not routed on a surface of the element. Therefore, there is no complication of a wiring pattern, and it is possible to prevent an increase in a mounting area of the element.

Abstract: A laminated inductor element includes a laminated substrate including a plurality of layers including a magnetic layer, an inductor including coil conductors provided between layers of the laminated substrate and connected in a lamination direction of the laminated substrate, and a pair of non-magnetic layers laminated on the laminated substrate so as to sandwich the laminated substrate in the lamination direction. The non-magnetic layers include cover layers made of low temperature co-fired ceramics.

Abstract: A low temperature co-fired ceramic material includes a SiO2—BaO—Al2O3-based primary component, and, as secondary components, 0.044 to 0.077 parts by weight of iron in terms of Fe2O3 and 0.30 to 0.55 parts by weight of zirconium in terms of ZrO2 relative to 100 parts by weight of the SiO2—BaO—Al2O3-based primary component. The SiO2—BaO—Al2O3-based primary component preferably includes 47% to 60% by weight of SiO2, 20% to 42% by weight of BaO, and 5% to 30% by weight of Al2O3.

Abstract: A low temperature co-fired ceramic material includes a SiO2—BaO—Al2O3-based primary component, and, as secondary components, 0.044 to 0.077 parts by weight of iron in terms of Fe2O3 and 0.30 to 0.55 parts by weight of zirconium in terms of ZrO2 relative to 100 parts by weight of the SiO2—BaO—Al2O3-based primary component. The SiO2—BaO—Al2O3-based primary component preferably includes 47% to 60% by weight of SiO2, 20% to 42% by weight of BaO, and 5% to 30% by weight of Al2O3.

Abstract: The present invention provides a method for removing unsaturated uronic acid contained in chemical pulp for papermaking, characterized by adding glucuronidase. According to the preferred embodiment of the present invention, in an ECF or TCF bleaching method using no molecular chlorine, unsaturated uronic acid can be reduced while controlling a bleaching cost, and a brightness reversion property of pulp can be improved.

Abstract: A ceramic slurry composition, in which the content of an organic binder is reduced, the organic binder can be heated and removed in a short time, and the degree of shrinkage during baking is reduced, is provided. The ceramic slurry composition is composed of a ceramic powder and an organic vehicle containing an aqueous solvent and a polyurethane resin having an average particle diameter of about 300 nm or less. The organic vehicle is in an emulsion state in which fine particles of the polyurethane resin are dispersed in the aqueous solvent.

Abstract: A ceramic slurry composition, in which the content of an organic binder is reduced, the organic binder can be heated and removed in a short time, and the degree of shrinkage during baking is reduced, is provided. The ceramic slurry composition is composed of a ceramic powder and an organic vehicle containing an aqueous solvent and a polyurethane resin having an average particle diameter of about 300 nm or less. The organic vehicle is in an emulsion state in which fine particles of the polyurethane resin are dispersed in the aqueous solvent.