Abstract: A method for manufacturing a high pressure tank capable of uniformly heating a thermosetting resin in a short time is provided. A method for manufacturing a high-pressure tank including: a step (a) of preparing a tank intermediate product including a fiber-reinforced resin layer formed by winding a carbon fiber impregnated with a thermosetting resin around a liner including a cap attached thereto; and a step (b) of performing a process for thermosetting the fiber-reinforced resin layer of the tank intermediate product by induction-heating the fiber-reinforced resin layer using induction-heating means, in which: the induction-heating means includes first induction-heating means for induction-heating a trunk part of the tank intermediate product and second induction-heating means for induction-heating a dome part of the tank intermediate product; and a temperature of the trunk part of the tank intermediate product and a temperature of the dome part thereof are controlled independently.

Abstract: An electronic device includes: an electronic component; and a mounting member on which the electronic component is mounted. A center of gravity of the electronic component is at a position separated from the mounting member. The electronic device further includes: a rigid member having a frame shape, which is fixed to the mounting member and surrounds the electronic component in a direction perpendicular to a direction from the center of gravity of the electronic component to the mounting member; and a connecting member which connects the electronic component to the rigid member on a side opposite to the mounting member with respect to the electronic component.

Abstract: A filament winding apparatus includes: N guide members arranged around a liner having an elongate shape such that the N guide members are centered around a center axis of the liner, the center axis extending in a longitudinal direction of the liner, each of the N guide members being configured to supply one bundle of fibers, and N being an integer equal to or larger than two, a drive unit configured to repeat, W times, a winding operation to helically wind N bundles of fibers supplied respectively from the N guide members around the liner at the same winding angle to form a reinforcing layer, the winding operation being an operation in which each of the N guide members travels, in a direction parallel to the center axis of the liner, from and back to a winding start position, and W being an integer equal to or larger than two.

Abstract: A method for manufacturing a high pressure tank capable of uniformly heating a thermosetting resin in a short time is provided. A method for manufacturing a high-pressure tank including: a step (a) of preparing a tank intermediate product including a fiber-reinforced resin layer formed by winding a carbon fiber impregnated with a thermosetting resin around a liner including a cap attached thereto; and a step (b) of performing a process for thermosetting the fiber-reinforced resin layer of the tank intermediate product by induction-heating the fiber-reinforced resin layer using induction-heating means, in which: the induction-heating means includes first induction-heating means for induction-heating a trunk part of the tank intermediate product and second induction-heating means for induction-heating a dome part of the tank intermediate product; and a temperature of the trunk part of the tank intermediate product and a temperature of the dome part thereof are controlled independently.

Abstract: A filament winding device includes a controller configured to control a rotating unit, a first moving unit, a second moving unit, and a swing unit based on command values of a rotation angle of a liner, and a first position, a second position, and a swing angle of a guide roller. The controller includes an associating unit configured to associate measured values of the first position, the second position, and the swing angle of the guide roller, corresponding to each rotation angle of the liner, with a measured value of the rotation angle of the liner, a difference calculating unit configured to calculate differences between the command values and the measured values, and a speed lowering unit configured to, when any one of the differences exceeds a predetermined threshold, lower a winding speed of the fiber bundle on the liner.

Abstract: A filament winding apparatus includes: N guide members arranged around a liner having an elongate shape such that the N guide members are centered around a center axis of the liner, the center axis extending in a longitudinal direction of the liner, each of the N guide members being configured to supply one bundle of fibers, and N being an integer equal to or larger than two, a drive unit configured to repeat, W times, a winding operation to helically wind N bundles of fibers supplied respectively from the N guide members around the liner at the same winding angle to form a reinforcing layer, the winding operation being an operation in which each of the N guide members travels, in a direction parallel to the center axis of the liner, from and back to a winding start position, and W being an integer equal to or larger than two.

Abstract: An electronic device includes: an electronic component; and a mounting member on which the electronic component is mounted. A center of gravity of the electronic component is at a position separated from the mounting member. The electronic device further includes: a rigid member having a frame shape, which is fixed to the mounting member and surrounds the electronic component in a direction perpendicular to a direction from the center of gravity of the electronic component to the mounting member; and a connecting member which connects the electronic component to the rigid member on a side opposite to the mounting member with respect to the electronic component.

Abstract: A cooler includes: a narrow flow path that has a narrow cross-sectional area; a wide flow path that is connected to a downstream side of the narrow flow path, is in thermal contact with a heating body, and has a wide cross-sectional area; and at least one rectifying piece that is provided in an upstream portion of the wide flow path that is an upstream side from a position being in thermal contact with the heating body. A fluid refrigerant flows through the narrow flow path and the wide flow path, and heat generated by the heating body is radiated. The rectifying piece includes: a single first angle portion that protrudes toward the upstream side; and a first surface and a second surface that join at an acute angle to form the first angle portion.

Abstract: A filament winding device includes a controller configured to control a rotating unit, a first moving unit, a second moving unit, and a swing unit based on command values of a rotation angle of a liner, and a first position, a second position, and a swing angle of a guide roller. The controller includes an associating unit configured to associate measured values of the first position, the second position, and the swing angle of the guide roller, corresponding to each rotation angle of the liner, with a measured value of the rotation angle of the liner, a difference calculating unit configured to calculate differences between the command values and the measured values, and a speed lowering unit configured to, when any one of the differences exceeds a predetermined threshold, lower a winding speed of the fiber bundle on the liner.

Abstract: A cooler includes: a narrow flow path that has a narrow cross-sectional area; a wide flow path that is connected to a downstream side of the narrow flow path, is in thermal contact with a heating body, and has a wide cross-sectional area; and at least one rectifying piece that is provided in an upstream portion of the wide flow path that is an upstream side from a position being in thermal contact with the heating body. A fluid refrigerant flows through the narrow flow path and the wide flow path, and heat generated by the heating body is radiated. The rectifying piece includes: a single first angle portion that protrudes toward the upstream side; and a first surface and a second surface that join at an acute angle to form the first angle portion.

Abstract: A filament winding system includes a storage unit that stores in advance a reference shape of a winding object, and winding conditions including a winding position and a winding angle at which a fiber is wound around the winding object having the reference shape, a guide that is movable relative to the winding object, and feeds the fiber onto the winding object, a rotating device that rotates the winding object, such that the fiber fed from the guide is wound around the winding object, a measuring unit that measures a shape of the winding object, and a controller. When there is a difference between the reference shape stored in the storage unit, and the measured shape of the winding object, the controller corrects the winding conditions so as to reduce or eliminate the difference, and controls the guide according to the corrected conditions.

Abstract: A manufacturing method of a tank comprises winding a fiber on a liner by hoop winding. The winding comprises: forming an (N+1)-th layer such that a position closer to a center of the liner by a first predetermined distance along an axis line direction of the liner from an end in the axis line direction of an N-th layer is set to position of an end in the axis line direction of the (N+1)-th layer with respect to a direction perpendicular to the axis line direction; and winding the fiber on the N-th layer to provide one winding turn of the fiber, such that a pressing force of pressing the N-th layer in the axis line direction by the fiber is equal to or smaller than a total frictional force in an area in the N-th layer on an edge side in the axis line direction of a fiber winding position.

Abstract: A circuit board module includes: a first electronic component of a surface mounting type; a second electronic component of an insertion mounting type including a lead terminal; a circuit board; and a heat transfer body provided in the circuit board. The first electronic component is mounted on a front surface of the circuit board so as to overlap the heat transfer body in a board thickness direction. The heat transfer body is provided so as to transfer heat generated in the first electronic component to a back surface side of the circuit board. The second electronic component is mounted on a back surface of the circuit board. The second electronic component and the heat transfer body are thermally connected to a heat radiation body provided on the back surface side of the circuit board.

Abstract: A circuit board module includes: a first electronic component of a surface mounting type; a second electronic component of an insertion mounting type including a lead terminal; a circuit board; and a heat transfer body provided in the circuit board. The first electronic component is mounted on a front surface of the circuit board so as to overlap the heat transfer body in a board thickness direction. The heat transfer body is provided so as to transfer heat generated in the first electronic component to a back surface side of the circuit board. The second electronic component is mounted on a back surface of the circuit board. The second electronic component and the heat transfer body are thermally connected to a heat radiation body provided on the back surface side of the circuit board.

Abstract: A filament winding system includes a storage unit that stores in advance a reference shape of a winding object, and winding conditions including a winding position and a winding angle at which a fiber is wound around the winding object having the reference shape, a guide that is movable relative to the winding object, and feeds the fiber onto the winding object, a rotating device that rotates the winding object, such that the fiber fed from the guide is wound around the winding object, a measuring unit that measures a shape of the winding object, and a controller. When there is a difference between the reference shape stored in the storage unit, and the measured shape of the winding object, the controller corrects the winding conditions so as to reduce or eliminate the difference, and controls the guide according to the corrected conditions.

Abstract: A printed circuit board with integrated coil includes: a plurality of layers; and coil patterns which are formed of a conductor and which are provided in at least one outer surface layer and another layer of the plurality of layers. A heat-dissipation pattern formed of a conductor is provided on at least the one outer surface layer so as to correspond to the coil pattern provided in the another layer. The coil pattern provided in the one outer surface layer and the heat-dissipation pattern provided in the one outer surface layer are separated from each other. A thermal inter-layer connector formed of a conductor is provided to connect the coil pattern provided in the another layer and the heat-dissipation pattern provided in the one outer surface layer which correspond to each other.

Abstract: A printed board includes: a base member; a recess portion provided in the base member; a heat dissipation member fitted into the recess portion; and a wiring pattern provided on an upper side of the base member and the heat dissipation member via an insulator. A contact portion in which an inner circumferential surface of the recess portion and an outer circumferential surface of the heat dissipation member contact each other and a separation portion in which those do contact each other are formed. A gap between the recess portion and the heat dissipation member is filled with thermosetting resin of the base member melted by heating. At least a partial portion in a width direction of the wiring pattern passes through a position vertically overlapping the separation portion while an entire portion thereof does not pass through a position vertically overlapping the contact portion.

Abstract: A circuit board includes a first insulating layer having an upper surface on which mounting regions of electronic components and wiring patterns are provided, a metal core provided on the lower surface of the first insulating layer, in such a way as to vertically overlap with the mounting regions, and a second insulating layer provided on the lower surface of the first insulating layer, around the metal core. The lower surface of the metal core is exposed from the second insulating layer, the thermal conductivities of the first insulating layer and the metal core are higher than the thermal conductivity of the second insulating layer, and the hardness of the first insulating layer is higher than the hardness of the second insulating layer. Through holes that penetrate the insulating layers and that connect wiring patterns of the insulating layers are provided.

Abstract: A manufacturing method of a tank comprises winding a fiber on a liner by hoop winding. The winding comprises: forming an (N+1)-th layer such that a position closer to a center of the liner by a first predetermined distance along an axis line direction of the liner from an end in the axis line direction of an N-th layer is set to position of an end in the axis line direction of the (N+1)-th layer with respect to a direction perpendicular to the axis line direction; and winding the fiber on the N-th layer to provide one winding turn of the fiber, such that a pressing force of pressing the N-th layer in the axis line direction by the fiber is equal to or smaller than a total frictional force in an area in the N-th layer on an edge side in the axis line direction of a fiber winding position.

Abstract: A printed circuit board includes a first insulating layer having mounting regions for electronic components and wiring patterns provided on an upper surface, a second insulating layer provided so as to be in contact with a lower surface of the first insulating layer, and a metal core embedded in the second insulating layer so as to vertically overlap the mounting regions. The metal core is formed into a predetermined shape by stamping out a metal plate. One outer surface orthogonal to the thickness direction of the metal core is a protruding surface having a curved portion formed at its edge, and is in contact with the lower surface of the first insulating layer. The other outer surface orthogonal to the thickness direction of the metal core is a recessed surface having a protruding portion formed at its edge, and is exposed from a lower surface of the second insulating layer.