Abstract: A cooler includes: a bent flow path that is in thermal contact with a heating body, bends a flow direction of a refrigerant; and a dividing fin that divides the bent flow path into two or more divided paths in a curvature radial direction. A width of each of the divided paths in the curvature radial direction of the bent flow path is constant along the dividing fin. Inner curvature radii of the divided paths are substantially equal to each other, and outer curvature radii of the divided paths are substantially equal to each other. A thickness of the dividing fin in a center portion of the bent flow path in the curvature radial direction is thicker than a thickness of the dividing fin in an upstream portion and a downstream portion of the bent flow path in the curvature radial direction.

Abstract: A cooler includes: a narrow flow path that has a narrow cross-sectional area; a wide flow path that is connected to a downstream side of the narrow flow path, is in thermal contact with a heating body, and has a wide cross-sectional area; and at least one rectifying piece that is provided in an upstream portion of the wide flow path that is an upstream side from a position being in thermal contact with the heating body. A fluid refrigerant flows through the narrow flow path and the wide flow path, and heat generated by the heating body is radiated. The rectifying piece includes: a single first angle portion that protrudes toward the upstream side; and a first surface and a second surface that join at an acute angle to form the first angle portion.

Abstract: Coil patterns are provided in first and second outer surface layers and an inner layer of the board. First and second heat-dissipation patterns are provided in the second outer surface layer. A first thermal inter-layer connection member connects the coil pattern of the first outer surface layer and the first heat-dissipation pattern. A second thermal inter-layer connection member connects the coil pattern of the inner layer and the second heat-dissipation pattern. The coil pattern provided in the second outer surface layer and the first and second heat-dissipation patterns are separated from each other. An area of the second heat-dissipation pattern is larger than an area of the first heat-dissipation pattern.

Abstract: A printed circuit board includes a first insulating layer having mounting regions for electronic components and wiring patterns provided on an upper surface, a second insulating layer provided so as to be in contact with a lower surface of the first insulating layer, and a metal core embedded in the second insulating layer so as to vertically overlap the mounting regions. The metal core is formed into a predetermined shape by stamping out a metal plate. One outer surface orthogonal to the thickness direction of the metal core is a protruding surface having a curved portion formed at its edge, and is in contact with the lower surface of the first insulating layer. The other outer surface orthogonal to the thickness direction of the metal core is a recessed surface having a protruding portion formed at its edge, and is exposed from a lower surface of the second insulating layer.

Abstract: A printed board includes: a base member; a recess portion provided in the base member; a heat dissipation member fitted into the recess portion; and a wiring pattern provided on an upper side of the base member and the heat dissipation member via an insulator. A contact portion in which an inner circumferential surface of the recess portion and an outer circumferential surface of the heat dissipation member contact each other and a separation portion in which those do contact each other are formed. A gap between the recess portion and the heat dissipation member is filled with thermosetting resin of the base member melted by heating. At least a partial portion in a width direction of the wiring pattern passes through a position vertically overlapping the separation portion while an entire portion thereof does not pass through a position vertically overlapping the contact portion.

Abstract: There is provided a manufacturing method of a tank. The manufacturing method comprises a preparation process of providing a fiber bundle in which a resin adheres to at least part of fibers when the fiber bundle is viewed in a section perpendicular to a longitudinal direction of fibers and in which an amount of the resin adhering to fibers on one side of the fiber bundle is smaller than an amount of the resin adhering to fibers On the other side of the fiber bundle in the section; and a winding process of winding the fiber bundle on a rolling body that includes a liner and a fiber bundle already wound on the liner, such that the fibers on the other side of the fiber bundle is located below the fibers on the one side in a stacking direction of the fiber bundle when the fiber bundle is stacked on the liner.

Abstract: A coil-integrated printed circuit board includes: a first outer layer which includes a first outer thick electric conductor made of a thick metallic foil and a first outer thin electric conductor made of a thin metallic foil having a thickness smaller than that of the first outer thick electric conductor, and which is exposed to an outside; and a first inner layer which includes an inner thick electric conductor made of a thick metallic foil, and which is not exposed to the outside. Coil patterns are respectively formed by the first outer thick electric conductor and the inner thick electric conductor. A first electronic component is surface-mounted on the first outer thin electric conductor provided on the outer layer.

Abstract: A circuit board includes a first insulating layer having an upper surface on which mounting regions of electronic components and wiring patterns are provided, a metal core provided on the lower surface of the first insulating layer, in such a way as to vertically overlap with the mounting regions, and a second insulating layer provided on the lower surface of the first insulating layer, around the metal core. The lower surface of the metal core is exposed from the second insulating layer, the thermal conductivities of the first insulating layer and the metal core are higher than the thermal conductivity of the second insulating layer, and the hardness of the first insulating layer is higher than the hardness of the second insulating layer. Through holes that penetrate the insulating layers and that connect wiring patterns of the insulating layers are provided.

Abstract: Coil patterns are provided in first and second outer surface layers and an inner layer of the board. First and second heat-dissipation patterns are provided in the second outer surface layer. A first thermal inter-layer connection member connects the coil pattern of the first outer surface layer and the first heat-dissipation pattern. A second thermal inter-layer connection member connects the coil pattern of the inner layer and the second heat-dissipation pattern. The coil pattern provided in the second outer surface layer and the first and second heat-dissipation patterns are separated from each other. An area of the second heat-dissipation pattern is larger than an area of the first heat-dissipation pattern.

Abstract: A printed circuit board with integrated coil includes: a plurality of layers; and coil patterns which are formed of a conductor and which are provided in at least one outer surface layer and another layer of the plurality of layers. A heat-dissipation pattern formed of a conductor is provided on at least the one outer surface layer so as to correspond to the coil pattern provided in the another layer. The coil pattern provided in the one outer surface layer and the heat-dissipation pattern provided in the one outer surface layer are separated from each other. A thermal inter-layer connector formed of a conductor is provided to connect the coil pattern provided in the another layer and the heat-dissipation pattern provided in the one outer surface layer which correspond to each other.

Abstract: A thermal curing device is used to manufacture a high-pressure gas tank by FW method. In the thermal curing device, a tank vessel configured to have a fiber layer formed on its outer surface by winding carbon fibers impregnated with a thermosetting resin is held to be rotatable about a virtual central axis of the tank vessel. In the thermal curing device, the tank vessel is heated by a heating unit during rotation, so as to thermally cure the thermosetting resin in the fiber layer and thereby form a fiber-reinforced resin layer. A bubble removal process for preventing formation of air bubble in the fiber-reinforced resin layer is performed at multiple different stages during such heating.

Abstract: An electronic component fixing structure includes: a mount; an electronic component mounted on the mount; and a fixing member which is formed of an elastic body and which fixes the electronic component to the mount. The mount includes: a mounting region on which the electronic component is mounted; an engaging surface which engages with the fixing member on a side opposite to a side on which the mounting region is positioned; and a wall which faces the mounting region and which is provided closer to an end surface of the mount than the mounting region. The fixing member includes: a pressing portion which presses the electronic component toward the mounting region; an engaging portion which engages with the engaging surface against a reactive force by the pressing portion; and a connection portion which is brought into contact with the wall between the pressing portion and the engaging portion.

Abstract: A coil-integrated printed circuit board includes: a first outer layer which includes a first outer thick electric conductor made of a thick metallic foil and a first outer thin electric conductor made of a thin metallic foil having a thickness smaller than that of the first outer thick electric conductor, and which is exposed to an outside; and a first inner layer which includes an inner thick electric conductor made of a thick metallic foil, and which is not exposed to the outside. Coil patterns are respectively formed by the first outer thick electric conductor and the inner thick electric conductor. A first electronic component is surface-mounted on the first outer thin electric conductor provided on the outer layer.

Abstract: A fuel cell system including an ejector that merges a hydrogen gas to be supplied from a hydrogen tank to a fuel cell with a hydrogen-off gas exhausted from the fuel cell and supplies the resulting gases to the fuel cell. A hydrogen pump that pressurizes the hydrogen-off gas in a hydrogen circulation flow path and sends the hydrogen-off gas toward a hydrogen supply flow path and a control unit that controls, when the pressure of the hydrogen-off gas in the hydrogen circulation flow path is increased by the ejector and the hydrogen pump, the pressure of the hydrogen gas to be supplied to the ejector and the pressure increase of the hydrogen-off gas realized by the hydrogen pump so that the pressure increase of the hydrogen-off gas realized by the ejector is 0 or higher.

Abstract: A fuel cell system includes a fuel gas supply/discharge mechanism, an oxidative gas supply/discharge mechanism, and a coolant circulation mechanism that cools a fuel cell. A motor employed in an air compressor of the fuel gas supply/discharge mechanism includes a generally circular cylindrical rotor. The axial length of the rotor is related to its diameter such that the ratio is approximately equal to a maximum value satisfying a relationship: Ta?Tm, where Ta denotes a permissible torque of the motor, and that Tm denotes a maximum torque for which a request is to be made to the motor.

Abstract: A thermal curing device is used to manufacture a high-pressure gas tank by FW method. In the thermal curing device, a tank vessel configured to have a fiber layer formed on its outer surface by winding carbon fibers impregnated with a thermosetting resin is held to be rotatable about a virtual central axis of the tank vessel. In the thermal curing device, the tank vessel is heated by a heating unit during rotation, so as to thermally cure the thermosetting resin in the fiber layer and thereby form a fiber-reinforced resin layer. A bubble removal process for preventing formation of air bubble in the fiber-reinforced resin layer is performed at multiple different stages during such heating.

Abstract: An object is to provide a fuel cell system having a simple structure, which is capable of supplying gas appropriately through an ejector in accordance with the load of a fuel cell. The fuel cell system (1) uses an ejector (24) disposed in a gas supply system (4) to combine a new gas to be supplied to the fuel cell (2) with an off-gas discharged from the fuel cell (2) and supply the fuel cell (2) with the resulting combined gas. The ejector (24) includes a nozzle (46) for ejecting the new gas and generating a negative pressure for aspirating the off-gas, and a flow rate control mechanism (47) for controlling the flow rate of the new gas which passes through the nozzle (46). A first flow path (81) for leading the off-gas to the flow rate control mechanism (47) is provided in the gas supply system (4), and the flow rate control mechanism (47) controls the flow rate of the new gas in accordance with the pressure of the off-gas led from the first flow path (81).

Abstract: In a fuel cell system having an ejector downstream a hydrogen pump, the pressure of a hydrogen-off gas is efficiently increased with a simple configuration.

Abstract: A valve in which durability of a sealing member made from an elastic material can be increased and sealing capability can be advantageously maintained over a wide range from a large differential pressure to a low differential pressure. A valve (100), in which a valve disc (1) and a valve seat (2) are brought into close contact via a sealing member (5) composed of an elastic material and provided at the valve disc (1) or valve seat (2), comprises a throttle section (30) defined by the shape of at least one of the valve disc (1) and valve seat (2). The throttle section (30) narrows a flow passage formed between the valve disc (1) and valve seat (2) and is provided near the sealing member (5). The flow passage narrowed by the throttle section (30) is so set that narrowing preferentially proceeds in the flow passage in close proximity to the sealing member (5) during the closing operation of the valve disc (1).

Abstract: A valve in which durability of a sealing member made from an elastic material can be increased and sealing capability can be advantageously maintained over a wide range from a large differential pressure to a low differential pressure. A valve (100), in which a valve disc (1) and a valve seat (2) are brought into close contact via a sealing member (5) composed of an elastic material and provided at the valve disc (1) or valve seat (2), comprises a throttle section (30) defined by the shape of at least one of the valve disc (1) and valve seat (2). The throttle section (30) narrows a flow passage formed between the valve disc (1) and valve seat (2) and is provided near the sealing member (5). The flow passage narrowed by the throttle section (30) is so set that narrowing preferentially proceeds in the flow passage in close proximity to the sealing member (5) during the closing operation of the valve disc (1).