Abstract: An adhesive for separatably attaching a support to a circuit side of a wafer to process a rear surface of the wafer, the adhesive including a component (A) that is cured by a hydrosilylation reaction and a component (B) containing a phenyl group-containing polyorganosiloxane, wherein a ratio in % by mass of the component (A) to the component (B) is 95:5 to 30:70. A separation method including applying the adhesive onto a first body to form an adhesion layer, attaching a second body to the adhesion layer, heating the adhesion layer from a side of the first body to cure the adhesive to form a layered body, processing the layered body, and carrying out separation between the adhesion layer, and the first and second bodies. The processing may be polishing the rear surface of the wafer.

Abstract: A demand prediction unit predicts a time series of demand values related to a predetermined prediction period using a predictive model. The predictive model is a learned model learned to output a demand value of an energy source by inputting an operation plan value of a plant and a predicted value related to an environment of the plant. An optimizing unit specifies operating indices of a plant that satisfy a plurality of demand values and satisfy a desired condition for each time related to the predicted time series of demand values. A presentation unit presents information related to the time series of operating indices related to the prediction period.

Abstract: An evaluation value prediction unit predicts an evaluation value at a time point after a given time passes from a predetermined evaluation time based on input data related to an operation of a factory at the evaluation time using a learned prediction model. The prediction model is a learned model that is learned so that the evaluation value related to the operation of the factory at a time point after the given time passes from one time point is output by inputting a plurality of kinds of data related to the operation of the factory at one time point. An evaluation value output unit outputs information related to the evaluation value.

Abstract: An acquisition unit acquires a quantity relating to an operating rate of a facility of a plant and a quantity relating to energy consumption of the facility. An index value specification unit specifies a higher index value as the energy consumption is lower, and a higher index value as the operating rate is higher, or a lower index value as the energy consumption is lower, and a lower index value as the operating rate is higher, based on the quantity acquired by the acquisition unit. An index value output unit outputs information relating to the index value.

Abstract: An adhesive can be easily peeled off after polishing the back face of a wafer, which has heat resistance and can be easily washed off. An adhesive for peelably adhering between a support and a circuit-bearing face of a wafer and thereby processing a back face of the wafer, a peeling face upon peeling becomes selectable according to heating from the support side or wafer side when the adhesive is cured. The adhesive includes a component (A) curing by hydrosilylation reaction and a component (B) containing a polydimethylsiloxane. A peeling method including forming an adhesion layer by applying the adhesive to a surface of a first substrate, bonding a surface of a second substrate to the adhesion layer, curing the adhesion layer by heating from the first substrate side to form a laminate, processing the laminate, and peeling off between the first substrate and the adhesion layer.

Abstract: A temporary adhesive is good peelability, heat resistance and cleaning removability after polishing of the rear surface of the wafer. A layered body for processing a rear surface of a wafer opposite to a circuit surface of the wafer, the layered body being a temporary adhesive loaded between a support and circuit surface of the wafer and including an adhesive layer (A) that includes a polyorganosiloxane to be cured by a hydrosilylation reaction and is releasably bonded, and a separation layer (B) includes a polyorganosiloxane and is releasably bonded, in which the polyorganosiloxane forming the separation layer (B) is a polyorganosiloxane containing a siloxane unit of RRSiO2/2 (provided that each R is bonded to a silicon atom as a Si—C bond), and at least one R is an aralkyl group, epoxy group, or phenyl group. Methods for producing and separating these layered bodies and composition for forming the separation layer.

Abstract: An acquisition unit acquires a quantity relating to an operating rate of a facility of a plant and a quantity relating to energy consumption of the facility. An index value specification unit specifies a higher index value as the energy consumption is lower, and a higher index value as the operating rate is higher, or a lower index value as the energy consumption is lower, and a lower index value as the operating rate is higher, based on the quantity acquired by the acquisition unit. An index value output unit outputs information relating to the index value.

Abstract: A novel photocurable resin composition including: a polymer with a weight average molecular weight of 1,000 to 50,000, the polymer having a structural unit of formula (1), and having a structure of formula (2) at an end: wherein X is a C1-6 alkyl group, vinyl group, allyl group, or glycidyl group; m and n are each independently 0 or 1; Q is a divalent hydrocarbon group having a carbon atom number of 1 to 16; Z is a divalent linking group having a carbon atom number of 1 to 4, wherein the divalent linking group is attached to the —O— group in formula (1); and R1 is a hydrogen atom or methyl group; a radical photopolymerization initiator; and a solvent.

Abstract: A time series acquisition unit acquires a time series related to power consumption of a machine for a certain time. A classification unit classifies the time series into any one of a plurality of clusters. A process estimation unit estimates a process executed by the machine, based on relationship information indicating a relationship between the plurality of clusters and the process of the machine, and the cluster into which the time series is classified.

Abstract: According to the present invention, a selection unit receives selection of at least one explanatory variable from among a plurality of candidate explanatory variables regarding the operation of a factory. A value input unit receives an input of a value regarding the selected explanatory variable. An energy demand identification unit identifies the value of a target variable regarding the operation of the factory on the basis of the inputted value. An output unit outputs the identified value of the target variable.

Abstract: A novel photosensitive adhesive composition including the following components (A), (B), (C), and (D): Component (A): a polymer having a structural unit of the following formula (1) and a structure of the following formula (2) at a terminal, Component (B): a polymer having the structural unit of formula (1), and a carboxy group or hydroxy group at a terminal, Component (C): a radical photopolymerization initiator, and Component (D): a solvent, wherein the content by mass of the component (B) is larger than that of the component (A), (wherein X is a C1-6 alkyl group, a vinyl group, an allyl group, or a glycidyl group, m and n are each independently 0 or 1, Q is a divalent C1-16 hydrocarbon group, Z is a divalent C1-4 linking group, the divalent linking group being bonded to an —O— group in formula (1), and R1 is a hydrogen atom or a methyl group.

Abstract: An adhesive for separatably attaching a support to a circuit side of a wafer to process a rear surface of the wafer, the adhesive including a component (A) that is cured by a hydrosilylation reaction and a component (B) containing a phenyl group-containing polyorganosiloxane, wherein a ratio in % by mass of the component (A) to the component (B) is 95:5 to 30:70. A separation method including applying the adhesive onto a first body to form an adhesion layer, attaching a second body to the adhesion layer, heating the adhesion layer from a side of the first body to cure the adhesive to form a layered body, processing the layered body, and carrying out separation between the adhesion layer, and the first and second bodies. The processing may be polishing the rear surface of the wafer.

Abstract: A novel photosensitive adhesive composition including the following components (A), (B), (C), and (D): Component (A): a polymer having a structural unit of the following formula (1) and a structure of the following formula (2) at a terminal, Component (B): a polymer having the structural unit of formula (1), and a carboxy group or hydroxy group at a terminal, Component (C): a radical photopolymerization initiator, and Component (D): a solvent, wherein the content by mass of the component (B) is larger than that of the component (A), (wherein X is a C1-6 alkyl group, a vinyl group, an allyl group, or a glycidyl group, m and n are each independently 0 or 1, Q is a divalent C1-16 hydrocarbon group, Z is a divalent C1-4 linking group, the divalent linking group being bonded to an —O— group in formula (1), and R1 is a hydrogen atom or a methyl group.

Abstract: An adhesive can be easily peeled off after polishing the back face of a wafer, which has heat resistance and can be easily washed off. An adhesive for peelably adhering between a support and a circuit-bearing face of a wafer and thereby processing a back face of the wafer, a peeling face upon peeling becomes selectable according to heating from the support side or wafer side when the adhesive is cured. The adhesive includes a component (A) curing by hydrosilylation reaction and a component (B) containing a polydimethylsiloxane. A peeling method including forming an adhesion layer by applying the adhesive to a surface of a first substrate, bonding a surface of a second substrate to the adhesion layer, curing the adhesion layer by heating from the first substrate side to form a laminate, processing the laminate, and peeling off between the first substrate and the adhesion layer.

Abstract: There is provided a film-forming composition for forming a film that covers a substrate and exhibits good electrical insulation properties, heat resistance, and solvent resistance after heating at a low temperature. A film-forming composition including a polymer (A) containing a unit structure of Formula (1): (wherein T1 is an arylene group or a combination of an arylene group with T0, T0 is an alkylene group, a fluorinated alkylene group, a carbonyl group, a sulfonyl group, or a combination thereof, R1 is a carboxyl group, an amino group, or an imino group, and n1 is an integer of 1 to 6), and a compound (B) having at least two isocyanate groups or blocked isocyanate groups.

Abstract: A photosensitive resin composition comprises a polymer having a repeating structural unit of the following Formula (1): (wherein R1 and R2 are each independently a single bond, a methylene group, or an ethylene group, Y is an alkylene group of Formula (2) or a combination of the alkylene group of Formula (2) with an alkylene group of Formula (3), n is an integer of 1 to 110, and X is a divalent aliphatic hydrocarbon group, a divalent alicyclic hydrocarbon group, or a divalent aromatic hydrocarbon group) and a (meth)acryloyl group at both ends, a bifunctional (meth)acrylate compound, a polyfunctional thiol compound, a photo-radical generator and an organic solvent, and then the bifunctional (meth)acrylate compound contained in an amount of 5% to 50% by mass and the polyfunctional thiol compound is contained in an amount of 0.1% to 10% by mass, relative to the content of the polymer.

Abstract: There is provided a novel polymer, a composition containing the polymer, and a novel adhesive composition containing the polymer from which a cured film having desired properties is obtained. A polymer comprising a structural unit of Formula (1): wherein Q is a bivalent group, R1 is a C1-10 alkylene group, a C2-10 alkenylene group or C2-10 alkynylene group, a C6-14 arylene group, a C4-10 cyclic alkylene group, etc., or a polymer comprising a structural unit of Formula (6): wherein Q4 is an allyl group, a vinyl group, an epoxy group, or a glycidyl group, and R5 is a bivalent organic group having a main chain containing only carbon atom or at least one of oxygen atom, nitrogen atom and sulfur atom in addition to carbon atom, a composition comprising the polymer, and an adhesive composition comprising the polymer and a solvent.

Abstract: There is provided a composition for forming a passivation film that satisfies electric insulation, heat-tolerance, solvent-tolerance, and a dry etch back property at the same time.