Abstract: In order to more satisfactorily cool a heat generation component without enhancing a blowing capacity of a fan, a heat radiation component is assumed to be covered by a wiring substrate and a cover portion that includes a first opening and a second opening, the heat radiation component including: a heat reception portion contacting with a heat generation component installed on the wiring substrate; and a plurality of heat radiation plates thermally connected to the heat reception portion, wherein a first part as a part included in the heat radiation plate and between the heat generation component and the first opening includes an end portion that is on a side more separated from the wiring substrate and whose distance from the wiring substrate decreases as being closer to the first opening.

Abstract: An electronic device includes a board to which a heat generation component is attached, a heat sink that radiates heat generated by the heat generation component, a cooling target component that is between the board and the heat sink and is attached to the board, and a duct that takes in a part of a cooling air flow for cooling at least the heat sink and introduces the cooling air flow which is taken in to the cooling target component, thereby sufficiently cooling the cooling target component that is between the heat sink increased in size and the board and is positioned on a side to which the cooling air flow being applied to the heat sink flows away from the heat sink.

Abstract: Electronic equipment 100 includes a circuit board 10, a first housing 20, and a deformation suppressing portion 30. A heating element H is mounted on the circuit board 10. The first housing 20 is mounted on a first main surface 11 of the circuit board 10 in such a way that the heating element H and a coolant COO are sealed with respect to the first main surface 11. The deformation suppressing portion 30 suppresses deformation of the circuit board 10. According to this configuration, it is possible to suppress a failure such as leakage of a coolant and cutting of a wiring formed on a circuit board, even when a heating element and a coolant are sealed in a space surrounded by the circuit board and a housing.

Abstract: A cooling device comprises a frame and a heat radiating portion. The frame is mounted on a substrate, and includes a convex portion for cooling the substrate. The heat radiating portion is mounted on the frame at a position associated with a heating component located on the substrate. The convex portion assists positioning where the heat radiating portion is mounted.

Abstract: An electronic device includes a board to which a heat generation component is attached, a heat sink that radiates heat generated by the heat generation component, a cooling target component that is between the board and the heat sink and is attached to the board, and a duct that takes in a part of a cooling air flow for cooling at least the heat sink and introduces the cooling air flow which is taken in to the cooling target component, thereby sufficiently cooling the cooling target component that is between the heat sink increased in size and the board and is positioned on a side to which the cooling air flow being applied to the heat sink flows away from the heat sink.

Abstract: Electronic equipment 100 includes a circuit board 10, a first housing 20, and a deformation suppressing portion 30. A heating element H is mounted on the circuit board 10. The first housing 20 is mounted on a first main surface 11 of the circuit board 10 in such a way that the heating element H and a coolant COO are sealed with respect to the first main surface 11. The deformation suppressing portion 30 suppresses deformation of the circuit board 10. According to this configuration, it is possible to suppress a failure such as leakage of a coolant and cutting of a wiring formed on a circuit board, even when a heating element and a coolant are sealed in a space surrounded by the circuit board and a housing.

Abstract: A cooling device comprises a frame and a heat radiating portion. The frame is mounted on a substrate, and includes a convex portion for cooling the substrate. The heat radiating portion is mounted on the frame at a position associated with a heating component located on the substrate. The convex portion assists positioning where the heat radiating portion is mounted.

Abstract: Heat dissipaters 120a, 120b are thermally coupled to a memory 220 and a CPU 230 (heat generating components) disposed on a top surface (a first surface) of a substrate 210. A frame 130 is thermally conductive and is attached above the top surface of the substrate 210. Openings 131 are formed in locations corresponding to locations in the frame 130 where the heat dissipaters 120a, 120b are provided. Elastic rubber elements 150 are thermally conductive and flexible, and thermally couple the heat dissipaters 120a, 120b to the frame 130. This configuration is capable of dissipating heat generated by the heat generating components even when the heat generating components generate amounts of heat that exceed the heat dissipation ability of the heat dissipaters thermally coupled to the heat generating components.

Abstract: In order to suppress an increase in the temperature of a leeward heat sink without increasing cost, a heat dissipating structure 140 according to the present invention includes a plurality of regions arranged along the direction of airflow from an air blower unit 150, wherein the regions are arranged in descending order of thermal resistance in each region, from windward to leeward.

Abstract: First and the second heat dissipation sections 120a and 120b are thermally coupled with a memory 220 and a CPU 230 mounted on a surface of a substrate 210, respectively. A frame 130 is arranged above the surface of the substrate. First and second openings 131a and 131b are formed at the positions corresponding to the positions at which the first and second heat dissipation sections 120a are provided in the frame 130. First and second elastic rubbers 150a and 150b (first and second connecting sections) are provided at periphery of the first and second openings. The first and second elastic rubbers connect the first and second heat dissipation sections and the frame, respectively. With this configuration, each of a plurality of heat-generating components is thermally coupled with each of a plurality of heat dissipation sections stably, even when the plurality of heat-generating components have different heights.

Abstract: Heat dissipaters 120a, 120b are thermally coupled to a memory 220 and a CPU 230 (heat generating components) disposed on a top surface (a first surface) of a substrate 210. A frame 130 is thermally conductive and is attached above the top surface of the substrate 210. Openings 131 are formed in locations corresponding to locations in the frame 130 where the heat dissipaters 120a, 120b are provided. Elastic rubber elements 150 are thermally conductive and flexible, and thermally couple the heat dissipaters 120a, 120b to the frame 130. This configuration is capable of dissipating heat generated by the heat generating components even when the heat generating components generate amounts of heat that exceed the heat dissipation ability of the heat dissipaters thermally coupled to the heat generating components.

Abstract: First and the second heat dissipation sections 120a and 120b are thermally coupled with a memory 220 and a CPU 230 mounted on a surface of a substrate 210, respectively. A frame 130 is arranged above the surface of the substrate. First and second openings 131a and 131b are formed at the positions corresponding to the positions at which the first and second heat dissipation sections 120a are provided in the frame 130. First and second elastic rubbers 150a and 150b (first and second connecting sections) are provided at periphery of the first and second openings. The first and second elastic rubbers connect the first and second heat dissipation sections and the frame, respectively. With this configuration, each of a plurality of heat-generating components is thermally coupled with each of a plurality of heat dissipation sections stably, even when the plurality of heat-generating components have different heights.

Abstract: An object of the present invention is to reduce imbalance of an airflow volume passed through each fin even when a heat sink is brought close to an air blowing part. In order to achieve the object, the heat sink according to the present invention includes a flat plate shaped base part and a plurality of fins erected on one surface of the base part, and at least part of the plurality of fins includes an air guide region guiding air to at least an adjacent fin, at a location where air flows in.

Abstract: An object of the present invention is to constantly maintain the degree of contact between a heat generating element that generates high temperature and a heat dissipater. To achieve the object, a cooling structure 130 according to the present invention includes a heat dissipater 140 which is disposed in such a way as to thermally couple to a plurality of heat generating elements 120 and dissipates heat generated by the plurality of heat generating elements 120, and a protruding portion 143 which is positioned at a surface of the heat dissipater 140 that faces the heat generating elements 120 and reduces the distance to a first heat generating element 121 that generates the highest temperature among the heat generating elements 120.

Abstract: In order to suppress an increase in the temperature of a leeward heat sink without increasing cost, a heat dissipating structure 140 according to the present invention includes a plurality of regions arranged along the direction of airflow from an air blower unit 150, wherein the regions are arranged in descending order of thermal resistance in each region, from windward to leeward.

Abstract: Provided is a heat sink capable of easing restrictions on direction of cooling air for acquiring a sufficient cooling effect. The heat sink includes a base heat sink including a circular female screw structure at a position opposite to a mounting position of a cooled component, and a cylindrical heat sink including a male screw structure configured to be engaged with the female screw structure of the base heat sink on a side face and a pin fin structure protruded roughly vertically in one bottom surface.

Abstract: A cooling mechanism for cooling an object includes a duct that leads a fluid for cooling, multiple fans that are placed on a channel in the duct and send forth the fluid for cooling, and a bypass channel that detours at least one of the multiple fans.

Abstract: A mounting structure is provided which is capable of easily attaching a heat sink irrespective of a thickness of an LSI (Large-Scale Integration circuit) mounted on a printed circuit board. Each female screw metal fitting of each female screw portion is attached on an upper surface of a cylindrical gel in a stacked manner and a lower surface of the cylindrical gel is attached to the printed circuit board. An end portion of each male screw is made to pass through each through-hole of the heat sink so as to be screwed into each of the female screw portions. With a progress of screwing therein, each of the female screw portions is elevated and the cylindrical gel is pulled and elongated. Since a restoring force occurs when the cylindrical gel is elongated, the heat sink is pulled by each of the female screw portions toward the LSI. Thus, variations in height can be accommodated.

Abstract: A mounting structure is provided which is capable of easily attaching a heat sink irrespective of a thickness of an LSI (Large-Scale Integration circuit) mounted on a printed circuit board. Each female screw metal fitting of each female screw portion is attached on an upper surface of a cylindrical gel in a stacked manner and a lower surface of the cylindrical gel is attached to the printed circuit board. An end portion of each male screw is made to pass through each through-hole of the heat sink so as to be screwed into each of the female screw portions. With a progress of screwing therein, each of the female screw portions is elevated and the cylindrical gel is pulled and elongated. Since a restoring force occurs when the cylindrical gel is elongated, the heat sink is pulled by each of the female screw portions toward the LSI. Thus, variations in height can be accommodated.

Abstract: A mounting structure is provided which is capable of easily attaching a heat sink irrespective of a thickness of an LSI (Large-Scale Integration circuit) mounted on a printed circuit board. Each female screw metal fitting of each female screw portion is attached on an upper surface of a cylindrical gel in a stacked manner and a lower surface of the cylindrical gel is attached to the printed circuit board. An end portion of each male screw is made to pass through each through-hole of the heat sink so as to be screwed into each of the female screw portions. With a progress of screwing therein, each of the female screw portions is elevated and the cylindrical gel is pulled and elongated. Since a restoring force occurs when the cylindrical gel is elongated, the heat sink is pulled by each of the female screw portions toward the LSI. Thus, variations in height can be accommodated.