Abstract: A cooling mechanism for cooling an object includes a duct that leads a fluid for cooling, multiple fans that are placed on a channel in the duct and send forth the fluid for cooling, and a bypass channel that detours at least one of the multiple fans.

Abstract: A mounting structure is provided which is capable of easily attaching a heat sink irrespective of a thickness of an LSI (Large-Scale Integration circuit) mounted on a printed circuit board. Each female screw metal fitting of each female screw portion is attached on an upper surface of a cylindrical gel in a stacked manner and a lower surface of the cylindrical gel is attached to the printed circuit board. An end portion of each male screw is made to pass through each through-hole of the heat sink so as to be screwed into each of the female screw portions. With a progress of screwing therein, each of the female screw portions is elevated and the cylindrical gel is pulled and elongated. Since a restoring force occurs when the cylindrical gel is elongated, the heat sink is pulled by each of the female screw portions toward the LSI. Thus, variations in height can be accommodated.