Abstract: A method for manufacturing a composite metal material combined with a nanocarbon material comprises heating a metal alloy to a half-melted state in which both liquid and solid phases are present. Next, a nongraphitized nanocarbon material is added to the half-melted metal alloy and stirred to form a composite metal material combined with a nanocarbon.

Abstract: A method for kneading a carbon nanomaterial with a metal material and manufacturing a composite-metal-forming material. A semi-molten metal material obtained by heating the metal material to a temperature of a region where a solid and a liquid are both present is kneaded with the carbon nanomaterial, and the composite metal material is obtained. The composite metal material is heated to the solution temperature of the metal material, and a solution treatment is performed, whereby the composite-metal-forming material is obtained.

Abstract: A method for manufacturing a composite metal alloy from a carbon nanomaterial and a metal material is disclosed. The carbon nanomaterial and the metal material are mixed, and a mixture is obtained. Afterwards, the mixture is dissolved. In the dissolving step, the carbon nanomaterial moves through the melt while adhering to the metal material.

Abstract: A data stream inputted to the inventive system from the outside is supplied to a PID (packet ID) extracting circuit 1, in which a PID is detected from a transport stream TS regardless of whether the transport stream TS is a full transport stream TS or a partial transport stream TS. The PID extracting circuit 1 transmits the thus extracted PID and data stream to a TS replacing/deleting circuit 2. The TS replacing/deleting circuit 2 has n 188-byte buffers and is able to set replaced TS packets to the buffers. A control circuit 3 such as a CPU (central processing unit) designates m PIDs relative to the respective buffers and designates the respective PIDs as the PID of the packet to be deleted or the PID of the packet to be replaced. Then, the TS replacing/deleting circuit 2 compares the PID received from the PID extracting circuit 1 with the PID designated by the control circuit 3.

Abstract: There is provided a receiving device including: a receiving unit that receives a packet stream; an oscillator; a measuring unit that performs a measuring operation; an acquiring unit that reads the newest time stamp read from the packet stream received by the receiving unit and the newest measurement value measured by the measuring unit with a predetermined period, from a point of time when the packet stream starts to be received; a calculating unit that calculates an accumulation value of the time stamps and the measurement values acquired by the acquiring unit; a comparing unit that compares a difference between the accumulation value of the time stamps and the accumulation value of the measurement values calculated by the calculating unit, and a value corresponding to a network jitter; and a frequency control unit that controls the oscillation frequency of the oscillator based on the comparison result by the comparing unit.

Abstract: A resin sealing semiconductor device (2) having a structure in which a portion to be sealed of components including a plurality of chip mounting board, a semiconductor chip mounted to a front surface of each chip mounting board, and a plurality of leads provided correspondingly to each chip mounting board is embedded in resin molded portions (41 and 42) molded into a generally plate shape, and outer lead portions of the plurality of leads (16 and 17) are led out in line from a side surface at one end in a width direction of the resin molded portions, and back surfaces as exposed surfaces (11u1 to 11w1 and 12u1 to 12w1) of each chip mounting board are placed on one surfaces of the resin molded portions (41 and 42), wherein a plurality of positioning protrusions (50) are provided on one surfaces of the resin molded portions (41 and 42), and a protrusion height of the positioning protrusions is set so that a gap to be filled with insulating resin is formed between each part of the exposed surface of each chip mo

Abstract: FIG. 3B shows buffer occupancy rate of a transport stream buffer 21 when a TS packet is transferred to the transport stream buffer 21 having a transport rate Rt and a leak rate Rx. A time T1 during which the buffer occupancy rate of the transport stream buffer 21 increases and a time T2 during which the buffer occupancy rate of the transport stream buffer 21 decreases are expressed by (Rt?Rx)×T1=Rx×T2 and T1=(188×8)/Rt. A time T is T=T1+T2=(188×8)/Rx. Therefore, the time T is equal to a time T? shown in FIG. 3C. Thus, when a TS packet is transferred in a cycle of the time T?, the transport stream buffer 21 will not overflow and the transport stream buffer 21 becomes empty at least once a second, whereby simulation for the transport stream buffer 21 is not required in the simulation for the T-STD model.

Abstract: A carbon nanocomposite material composed of a carbon nanomaterial and a film formed on the surface thereof is disclosed. The film contains the element Si. The average thickness of the film is 10 to 50 nm.

Abstract: A semiconductor device having a plurality of semiconductor chips mounted on a lead frame (10) and required portions covered with seal portions in which: the plurality of semiconductor chips are divided into a first group of semiconductor chips (Dx to Dz) and a second group of semiconductor chips (Du to Dw and Thx to Thz); both groups of semiconductor chips are mounted on the lead frame (10) at a distance from each other; the seal portions are comprised of first and second resin-seal portions (41 and 42) which cover the first and second groups of semiconductor chips, respectively, along with required portions of the lead frame; both resin-seal portions are mechanically coupled with each other by coupling portions; and a group of read terminals respectively connected to circuits within the first resin-seal portion and circuits within the second resin-seal portion are led out through a gap between the first resin-seal portion (41) and the second resin-seal portion (42).

Abstract: A method for manufacturing a composite metal material combined with a nanocarbon material comprises heating a metal alloy to a half-melted state in which both liquid and solid phases are present. Next, a nongraphitized nanocarbon material is added to the half-melted metal alloy and stirred to form a composite metal material combined with a nanocarbon.

Abstract: A diaphragm subassembly comprises a voice coil, a diaphragm, a frame, and a pair of terminal members. A magnetic circuit unit comprises a yoke, a magnet, and a base. The diaphragm subassembly and the magnetic circuit unit are accommodated in a bottomed cylindrical cover. In the manufacturing process, the cover is placed with the open end directed upward. The diaphragm subassembly, the yoke, the magnet, and the base are dropped into the cover in this order. The manufacturing process of a dynamic electroacoustic transducer is thereby simplified.

Abstract: A composite plating layer contains carbon nanofibers. A composite plating solution contains a Watts bath composed mainly of nickel sulfate and nickel chloride, a brightening agent, a surface active agent and carbon nanofibers. Polyacrylic acid is used as the surface active agent.

Abstract: A diving apparatus includes a support structure (18) that is engageable with a diver's head, the support structure (18) defining a lens opening (262) and an equalization opening (104). A lens (26) is mounted on the support structure (18) to close the lens opening (262) so that the support structure (18) and the lens (26) define a breathing space (30) from which the diver can be supplied with air. A sealing arrangement is positioned on the support structure (18) sealingly to engage the diver's face so that the breathing space (30) is substantially airtight. An equalization assembly (106) is mounted on the support structure (18) to close the equalization opening (104). The equalization assembly (106) includes an access means to permit the diver to gain access to his or her nose so that the diver can carry out an equalization procedure. A gas supply arrangement is in fluid communication with the breathing space (30).

Abstract: A data stream inputted to the inventive system from the outside is supplied to a PID (packet ID) extracting circuit 1, in which a PID is detected from a transport stream TS regardless of whether the transport stream TS is a full transport stream TS or a partial transport stream TS. The PID extracting circuit 1 transmits the thus extracted PID and data stream to a TS replacing/deleting circuit 2. The TS replacing/deleting circuit 2 has n 188-byte buffers and is able to set replaced TS packets to the buffers. A control circuit 3 such as a CPU (central processing unit) designates m PIDs relative to the respective buffers and designates the respective PIDs as the PID of the packet to be deleted or the PID of the packet to be replaced. Then, the TS replacing/deleting circuit 2 compares the PID received from the PID extracting circuit 1 with the PID designated by the control circuit 3.

Abstract: A diaphragm subassembly comprises a voice coil, a diaphragm, a frame, and a pair of terminal members. A magnetic circuit unit comprises a yoke, a magnet, and a base. The diaphragm subassembly and the magnetic circuit unit are accommodated in a bottomed cylindrical cover. In the manufacturing process, the cover is placed with the open end directed upward. The diaphragm subassembly, the yoke, the magnet, and the base are dropped into the cover in this order. The manufacturing process of a dynamic electroacoustic transducer is thereby simplified.

Abstract: The diaphragm is supported by the frame at the outer edge thereof. The pair of terminal members is mounted on the frame, and a pair of lead wire drawn from the voice coil is fixed to the land portion of the terminal member for electrical continuity. Since the land portion is disposed on the upper side of the frame, fixation of the lead wire can be performed without turning the frame upside down. This simplifies the manufacturing process of the speaker and also prevents a breakage of the lead wire that conventionally happens when the frame is turned upside down. Further, this prevents the operator from touching the lead wire since no part of the lead wire is exposed outside the frame after the fixation.

Abstract: A pair of lead wire drawn from a voice coil is fixed to a land portion of a pair of terminal member by thermo-compression bonding. The pair of terminal member is integrally formed with the frame by insert molding. The frame made of synthetic resin has a pair of circular holes on the back side of the land portion to expose the land portion to the back space of the frame. In thermo-compression bonding, a supporting jig is pressed against the back side of the land portion via the circular hole. Thereby, generated heat is immediately transmitted to the supporting jig, preventing melting part of the frame around the land portion. Pressing force of a thermo-compression jig is received by the supporting jig, preventing sinking of the land portion in the frame.

Abstract: The diaphragm is supported by the frame at the outer edge thereof. The pair of terminal members is mounted on the frame, and a pair of lead wire drawn from the voice coil is fixed to the land portion of the terminal member for electrical continuity. Since the land portion is disposed on the upper side of the frame, fixation of the lead wire can be performed without turning the frame upside down. This simplifies the manufacturing process of the speaker and also prevents a breakage of the lead wire that conventionally happens when the frame is turned upside down. Further, this prevents the operator from touching the lead wire since no part of the lead wire is exposed outside the frame after the fixation.

Abstract: A pair of lead wire drawn from a voice coil is fixed to a land portion of a pair of terminal member by thermo-compression bonding. The pair of terminal member is integrally formed with the frame by insert molding. The frame made of synthetic resin has a pair of circular holes on the back side of the land portion to expose the land portion to the back space of the frame. In thermo-compression bonding, a supporting jig is pressed against the back side of the land portion via the circular hole. Thereby, generated heat is immediately transmitted to the supporting jig, preventing melting part of the frame around the land portion. Pressing force of a thermo-compression jig is received by the supporting jig, preventing sinking of the land portion in the frame.

Abstract: FIG. 3B shows buffer occupancy rate of a transport stream buffer 21 when a TS packet is transferred to the transport stream buffer 21 having a transport rate Rt and a leak rate Rx. A time T1 during which the buffer occupancy rate of the transport stream buffer 21 increases and a time T2 during which the buffer occupancy rate of the transport stream buffer 21 decreases are expressed by (Rt−Rx)×T1=Rx×T2 and T1=(188×8)/Rt. A time T is T=T1+T2=(188×8)/Rx. Therefore, the time T is equal to a time T′ shown in FIG. 3C. Thus, when a TS packet is transferred in a cycle of the time T′, the transport stream buffer 21 will not overflow and the transport stream buffer 21 becomes empty at least once a second, whereby simulation for the transport stream buffer 21 is not required in the simulation for the T-STD model.