Patents by Inventor Tongbi Jiang

Tongbi Jiang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20180358324
    Abstract: Microelectronic devices and method of forming a plurality of microelectronic devices on a semiconductor workpiece are disclosed herein. One such method includes placing a plurality of first interconnect elements on a side of a semiconductor workpiece, forming a layer on the side of the workpiece, reshaping the first interconnect elements by heating the first interconnect elements, and coupling a first portion of a plurality of individual second interconnect elements to corresponding first interconnect elements with a second portion of the individual second interconnect elements exposed.
    Type: Application
    Filed: August 21, 2018
    Publication date: December 13, 2018
    Inventors: Young Do Kweon, Tongbi Jiang
  • Patent number: 10083931
    Abstract: Microelectronic devices and method of forming a plurality of microelectronic devices on a semiconductor workpiece are disclosed herein. One such method includes placing a plurality of first interconnect elements on a side of a semiconductor workpiece, forming a layer on the side of the workpiece, reshaping the first interconnect elements by heating the first interconnect elements, and coupling a first portion of a plurality of individual second interconnect elements to corresponding first interconnect elements with a second portion of the individual second interconnect elements exposed.
    Type: Grant
    Filed: December 9, 2015
    Date of Patent: September 25, 2018
    Assignee: Micron Technology, Inc.
    Inventors: Young Do Kweon, Tongbi Jiang
  • Patent number: 10041847
    Abstract: Sensor packages and manners of formation are described. In an embodiment, a sensor package includes a supporting die characterized by a recess area and a support anchor protruding above the recess area. A sensor die is bonded to the support anchor such that an air gap exists between the sensor die and the recess area. The sensor die includes a sensor positioned directly above the air gap.
    Type: Grant
    Filed: December 8, 2016
    Date of Patent: August 7, 2018
    Assignee: APPLE INC.
    Inventors: Caleb C. Han, Tongbi Jiang, Jun Zhai
  • Patent number: 9656856
    Abstract: MEMS packages, modules, and methods of fabrication are described. In an embodiment, a MEMS package includes a MEMS die and an IC die mounted on a front side of a surface mount substrate, and a molding compound encapsulating the IC die and the MEMS die on the front side of the surface mount substrate. In an embodiment, a landing pad arrangement on a back side of the surface mount substrate forms and anchor plane area for bonding the surface mount substrate to a module substrate that is not directly beneath the MEMS die.
    Type: Grant
    Filed: August 2, 2016
    Date of Patent: May 23, 2017
    Assignee: Apple Inc.
    Inventors: Tongbi Jiang, Jie-Hua Zhao, Peter G. Hartwell
  • Patent number: 9624093
    Abstract: MEMS packages and modules are described. In an embodiment, a module includes a package mounted within an opening in a module board. The package includes a flexible wiring board mounted to a back surface of the module board and spanning across the opening in the module board. A die is mounted on the flexible wiring board and is encapsulated within an overmold. An air gap exists laterally between the overmold and side surface of the opening in the module board.
    Type: Grant
    Filed: November 17, 2014
    Date of Patent: April 18, 2017
    Assignee: Apple Inc.
    Inventors: Tongbi Jiang, Jun Zhai
  • Publication number: 20170089783
    Abstract: Sensor packages and manners of formation are described. In an embodiment, a sensor package includes a supporting die characterized by a recess area and a support anchor protruding above the recess area. A sensor die is bonded to the support anchor such that an air gap exists between the sensor die and the recess area. The sensor die includes a sensor positioned directly above the air gap.
    Type: Application
    Filed: December 8, 2016
    Publication date: March 30, 2017
    Inventors: Caleb C. Han, Tongbi Jiang, Jun Zhai
  • Patent number: 9574959
    Abstract: Sensor packages and manners of formation are described. In an embodiment, a sensor package includes a supporting die characterized by a recess area and a support anchor protruding above the recess area. A sensor die is bonded to the support anchor such that an air gap exists between the sensor die and the recess area. The sensor die includes a sensor positioned directly above the air gap.
    Type: Grant
    Filed: October 17, 2014
    Date of Patent: February 21, 2017
    Assignee: Apple Inc.
    Inventors: Caleb C. Han, Tongbi Jiang, Jun Zhai
  • Publication number: 20160340175
    Abstract: MEMS packages, modules, and methods of fabrication are described. In an embodiment, a MEMS package includes a MEMS die and an IC die mounted on a front side of a surface mount substrate, and a molding compound encapsulating the IC die and the MEMS die on the front side of the surface mount substrate. In an embodiment, a landing pad arrangement on a back side of the surface mount substrate forms and anchor plane area for bonding the surface mount substrate to a module substrate that is not directly beneath the MEMS die.
    Type: Application
    Filed: August 2, 2016
    Publication date: November 24, 2016
    Inventors: Tongbi Jiang, Jie-Hua Zhao, Peter G. Hartwell
  • Patent number: 9446941
    Abstract: MEMS packages, modules, and methods of fabrication are described. In an embodiment, a MEMS package includes a MEMS die and an IC die mounted on a front side of a surface mount substrate, and a molding compound encapsulating the IC die and the MEMS die on the front side of the surface mount substrate. In an embodiment, a landing pad arrangement on a back side of the surface mount substrate forms and anchor plane area for bonding the surface mount substrate to a module substrate that is not directly beneath the MEMS die.
    Type: Grant
    Filed: December 12, 2014
    Date of Patent: September 20, 2016
    Assignee: Apple Inc.
    Inventors: Tongbi Jiang, Jie-Hua Zhao, Peter G. Hartwell
  • Publication number: 20160167949
    Abstract: MEMS packages, modules, and methods of fabrication are described. In an embodiment, a MEMS package includes a MEMS die and an IC die mounted on a front side of a surface mount substrate, and a molding compound encapsulating the IC die and the MEMS die on the front side of the surface mount substrate. In an embodiment, a landing pad arrangement on a back side of the surface mount substrate forms and anchor plane area for bonding the surface mount substrate to a module substrate that is not directly beneath the MEMS die.
    Type: Application
    Filed: December 12, 2014
    Publication date: June 16, 2016
    Inventors: Tongbi Jiang, Jie-Hua Zhao, Peter G. Hartwell
  • Publication number: 20160137488
    Abstract: MEMS packages and modules are described. In an embodiment, a module includes a package mounted within an opening in a module board. The package includes a flexible wiring board mounted to a back surface of the module board and spanning across the opening in the module board. A die is mounted on the flexible wiring board and is encapsulated within an overmold. An air gap exists laterally between the overmold and side surface of the opening in the module board.
    Type: Application
    Filed: November 17, 2014
    Publication date: May 19, 2016
    Inventors: Tongbi Jiang, Jun Zhai
  • Publication number: 20160086910
    Abstract: Microelectronic devices and method of forming a plurality of microelectronic devices on a semiconductor workpiece are disclosed herein. One such method includes placing a plurality of first interconnect elements on a side of a semiconductor workpiece, forming a layer on the side of the workpiece, reshaping the first interconnect elements by heating the first interconnect elements, and coupling a first portion of a plurality of individual second interconnect elements to corresponding first interconnect elements with a second portion of the individual second interconnect elements exposed.
    Type: Application
    Filed: December 9, 2015
    Publication date: March 24, 2016
    Inventors: Young Do Kweon, Tongbi Jiang
  • Publication number: 20160061677
    Abstract: Sensor packages and manners of formation are described. In an embodiment, a sensor package includes a supporting die characterized by a recess area and a support anchor protruding above the recess area. A sensor die is bonded to the support anchor such that an air gap exists between the sensor die and the recess area. The sensor die includes a sensor positioned directly above the air gap.
    Type: Application
    Filed: October 17, 2014
    Publication date: March 3, 2016
    Inventors: Caleb C. Han, Tongbi Jiang, Jun Zhai
  • Patent number: 9240385
    Abstract: Microelectronic devices and method of forming a plurality of microelectronic devices on a semiconductor workpiece are disclosed herein. One such method includes placing a plurality of first interconnect elements on a side of a semiconductor workpiece, forming a layer on the side of the workpiece, reshaping the first interconnect elements by heating the first interconnect elements, and coupling a first portion of a plurality of individual second interconnect elements to corresponding first interconnect elements with a second portion of the individual second interconnect elements exposed.
    Type: Grant
    Filed: December 29, 2014
    Date of Patent: January 19, 2016
    Assignee: Micron Technology, Inc.
    Inventors: Young Do Kweon, Tongbi Jiang
  • Publication number: 20150325554
    Abstract: A device is disclosed which includes at least one integrated circuit die, at least a portion of which is positioned in a body of encapsulant material, and at least one conductive via extending through the body of encapsulant material.
    Type: Application
    Filed: July 17, 2015
    Publication date: November 12, 2015
    Inventors: Tongbi Jiang, Yong Poo Chia
  • Patent number: 9099571
    Abstract: A device is disclosed which includes at least one integrated circuit die, at least a portion of which is positioned in a body of encapsulant material, and at least one conductive via extending through the body of encapsulant material.
    Type: Grant
    Filed: May 8, 2014
    Date of Patent: August 4, 2015
    Assignee: Micron Technology, Inc.
    Inventors: Tongbi Jiang, Yong Poo Chia
  • Publication number: 20150118796
    Abstract: Microelectronic devices and method of forming a plurality of microelectronic devices on a semiconductor workpiece are disclosed herein. One such method includes placing a plurality of first interconnect elements on a side of a semiconductor workpiece, forming a layer on the side of the workpiece, reshaping the first interconnect elements by heating the first interconnect elements, and coupling a first portion of a plurality of individual second interconnect elements to corresponding first interconnect elements with a second portion of the individual second interconnect elements exposed.
    Type: Application
    Filed: December 29, 2014
    Publication date: April 30, 2015
    Inventors: Young Do Kweon, Tongbi Jiang
  • Patent number: 8922002
    Abstract: Microelectronic devices and method of forming a plurality of microelectronic devices on a semiconductor workpiece are disclosed herein. One such method includes placing a plurality of first interconnect elements on a side of a semiconductor workpiece, forming a layer on the side of the workpiece, reshaping the first interconnect elements by heating the first interconnect elements, and coupling a first portion of a plurality of individual second interconnect elements to corresponding first interconnect elements with a second portion of the individual second interconnect elements exposed.
    Type: Grant
    Filed: June 8, 2010
    Date of Patent: December 30, 2014
    Assignee: Micron Technology, Inc.
    Inventors: Young Do Kweon, Tongbi Jiang
  • Patent number: 8846424
    Abstract: Solid state lighting (SSL) devices including a plurality of SSL emitters and methods for manufacturing SSL devices are disclosed. Several embodiments of SSL devices in accordance with the technology include a support having a first lead and a second lead, a plurality of individual SSL emitters attached to the support, and a plurality of lenses. Each SSL emitter has a first contact electrically coupled to the first lead of the support and a second contact electrically coupled to the second lead of the support such that the SSL emitters are commonly connected. Each lens has a curved surface and is aligned with a single corresponding SSL emitter.
    Type: Grant
    Filed: October 7, 2013
    Date of Patent: September 30, 2014
    Assignee: Micron Technology, Inc.
    Inventors: Jin Li, Tongbi Jiang
  • Publication number: 20140242751
    Abstract: A device is disclosed which includes at least one integrated circuit die, at least a portion of which is positioned in a body of encapsulant material, and at least one conductive via extending through the body of encapsulant material.
    Type: Application
    Filed: May 8, 2014
    Publication date: August 28, 2014
    Applicant: MICRON TECHNOLOGY, INC.
    Inventors: Tongbi Jiang, Yong Poo Chia