Patents by Inventor Tongbi T. Jiang

Tongbi T. Jiang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20220085231
    Abstract: An integrated sensor package for an electronic device may include a matrix material defining a body structure of the integrated sensor package, a light emitting diode at least partially encapsulated in the matrix material, a photodiode at least partially encapsulated in the matrix material and configured to detect light emitted by the light emitting diode and reflected by an object external to the integrated sensor package, a via structure at least partially encapsulated in the matrix material, a permanent magnet at least partially encapsulated in the matrix material, a first conductive member on a first side of the integrated sensor package and conductively coupling the light emitting diode to a first end of the via structure, and a second conductive member on a second side of the integrated sensor package opposite the first side and conductively coupled to a second end of the via structure.
    Type: Application
    Filed: September 13, 2021
    Publication date: March 17, 2022
    Inventors: Saijin Liu, Tongbi T. Jiang, Saahil Mehra
  • Publication number: 20220005798
    Abstract: An electronic device may include a display having a monolithic array of light-emitting diodes mounted to a surface of a substrate layer. The diodes may include contact pads. Driver circuitry may independently drive each of the diodes in the array using drive signals. The driver circuitry may be formed on a driver integrated circuit. Bond pads may be formed on a surface of the integrated circuit. Copper pillars may be grown on the bond pads. In another suitable arrangement, the driver circuitry may be formed on a driver printed circuit board coupled to an interposer by a flexible printed circuit. The interposer may include bond pads and copper pillars grown on the bond pads. The contact pads on each of the diodes may be simultaneously bonded to the copper pillars. A surface of the substrate layer may be patterned to form light redirecting elements if desired.
    Type: Application
    Filed: September 15, 2021
    Publication date: January 6, 2022
    Inventors: Jun Qi, Rong Liu, Saijin Liu, Shaofeng Liu, Tongbi T. Jiang, Victor H. Yin, Xia Li, Xiang Fang, Ziruo Hong
  • Patent number: 11211515
    Abstract: A device includes a semiconductor chip, and a semiconductor chip package in which the semiconductor chip is packaged. The semiconductor chip has a first major surface opposite a second major surface, and a set of four edges extending between the first major surface and the second major surface. The semiconductor chip package includes at least first and second electrodes exposed to an exterior of the semiconductor chip package and positioned apart from the semiconductor chip. The at least first and second electrodes overlap only one edge of the semiconductor chip. The semiconductor chip package also includes a filler that is molded between the semiconductor chip and each of the at least first and second electrodes.
    Type: Grant
    Filed: February 27, 2019
    Date of Patent: December 28, 2021
    Assignee: Apple Inc.
    Inventors: Tongbi T. Jiang, Miaolei Yan
  • Publication number: 20210072176
    Abstract: An electronic device can include a housing defining an internal volume and a pressure sensor assembly disposed in the internal volume and in communication with an ambient environment. The pressure sensor assembly can include a structure at least partially enclosing a sensor volume, a pressure sensor affixed to a die disposed in the sensor volume, and an exposed moisture detection conductor positioned in the sensor volume.
    Type: Application
    Filed: April 21, 2020
    Publication date: March 11, 2021
    Inventors: Caleb C. Han, Brad G. Boozer, David MacNeil, Gregory B. Arndt, Patrick E. O'Brien, Roham Solasi, Tongbi T. Jiang, Ashwin Balasubramanian, William S. Lee, Manoj K. Bhattacharyya, Jiahui Liang, James G. Horiuchi, Savas Gider
  • Publication number: 20200274020
    Abstract: A device includes a semiconductor chip, and a semiconductor chip package in which the semiconductor chip is packaged. The semiconductor chip has a first major surface opposite a second major surface, and a set of four edges extending between the first major surface and the second major surface. The semiconductor chip package includes at least first and second electrodes exposed to an exterior of the semiconductor chip package and positioned apart from the semiconductor chip. The at least first and second electrodes overlap only one edge of the semiconductor chip. The semiconductor chip package also includes a filler that is molded between the semiconductor chip and each of the at least first and second electrodes.
    Type: Application
    Filed: February 27, 2019
    Publication date: August 27, 2020
    Inventors: Tongbi T. Jiang, Miaolei Yan
  • Patent number: 10454241
    Abstract: An optoelectronic device includes a semiconductor substrate, having front and back sides and having at least one cavity extending from the back side through the semiconductor substrate into proximity with the front side. At least one optoelectronic emitter is formed on the front side of the semiconductor substrate in proximity with the at least one cavity. A heat-conducting material at least partially fills the at least one cavity and is configured to serve as a heat sink for the at least one optoelectronic emitter.
    Type: Grant
    Filed: August 21, 2018
    Date of Patent: October 22, 2019
    Assignee: APPLE INC.
    Inventors: Tongbi T. Jiang, Weiping Li, Xiaofeng Fan
  • Publication number: 20190181610
    Abstract: An optoelectronic device includes a semiconductor substrate, having front and back sides and having at least one cavity extending from the back side through the semiconductor substrate into proximity with the front side. At least one optoelectronic emitter is formed on the front side of the semiconductor substrate in proximity with the at least one cavity. A heat-conducting material at least partially fills the at least one cavity and is configured to serve as a heat sink for the at least one optoelectronic emitter.
    Type: Application
    Filed: August 21, 2018
    Publication date: June 13, 2019
    Inventors: Tongbi T. Jiang, Weiping Li, Xiaofeng Fan
  • Patent number: 10103512
    Abstract: An optoelectronic device includes a semiconductor substrate, having front and back sides and having at least one cavity extending from the back side through the semiconductor substrate into proximity with the front side. At least one optoelectronic emitter is formed on the front side of the semiconductor substrate in proximity with the at least one cavity. A heat-conducting material at least partially fills the at least one cavity and is configured to serve as a heat sink for the at least one optoelectronic emitter.
    Type: Grant
    Filed: July 4, 2017
    Date of Patent: October 16, 2018
    Assignee: APPLE INC.
    Inventors: Tongbi T. Jiang, Weiping Li, Xiaofeng Fan
  • Publication number: 20180048115
    Abstract: An optoelectronic device includes a semiconductor substrate, having front and back sides and having at least one cavity extending from the back side through the semiconductor substrate into proximity with the front side. At least one optoelectronic emitter is formed on the front side of the semiconductor substrate in proximity with the at least one cavity. A heat-conducting material at least partially fills the at least one cavity and is configured to serve as a heat sink for the at least one optoelectronic emitter.
    Type: Application
    Filed: July 4, 2017
    Publication date: February 15, 2018
    Inventors: Tongbi T. Jiang, Weiping Li, Xiaofeng Fan
  • Patent number: 9735539
    Abstract: An optoelectronic device includes a semiconductor substrate, having front and back sides and having at least one cavity extending from the back side through the semiconductor substrate into proximity with the front side. At least one optoelectronic emitter is formed on the front side of the semiconductor substrate in proximity with the at least one cavity. A heat-conducting material at least partially fills the at least one cavity and is configured to serve as a heat sink for the at least one optoelectronic emitter.
    Type: Grant
    Filed: January 31, 2016
    Date of Patent: August 15, 2017
    Assignee: APPLE INC.
    Inventors: Tongbi T. Jiang, Weiping Li, Xiaofeng Fan
  • Publication number: 20170156002
    Abstract: MEMS microphone and vibration sensor dies and packages are described. In an embodiment, a MEMS microphone and vibration sensor die includes a die substrate, a MEMS microphone on the die substrate and a MEMS vibration sensor on the die substrate. The MEMS vibration sensor may include a plurality of beams with different proof masses corresponding to different resonant frequencies, wherein the different proof masses comprise a same material as the die substrate.
    Type: Application
    Filed: January 25, 2016
    Publication date: June 1, 2017
    Inventors: Caleb C. Han, Jun Zhai, Tongbi T. Jiang
  • Patent number: 9661411
    Abstract: MEMS microphone and vibration sensor dies and packages are described. In an embodiment, a MEMS microphone and vibration sensor die includes a die substrate, a MEMS microphone on the die substrate and a MEMS vibration sensor on the die substrate. The MEMS vibration sensor may include a plurality of beams with different proof masses corresponding to different resonant frequencies, wherein the different proof masses comprise a same material as the die substrate.
    Type: Grant
    Filed: January 25, 2016
    Date of Patent: May 23, 2017
    Assignee: Apple Inc.
    Inventors: Caleb C. Han, Jun Zhai, Tongbi T. Jiang
  • Publication number: 20170025815
    Abstract: An optoelectronic device includes a semiconductor substrate, having front and back sides and having at least one cavity extending from the back side through the semiconductor substrate into proximity with the front side. At least one optoelectronic emitter is formed on the front side of the semiconductor substrate in proximity with the at least one cavity. A heat-conducting material at least partially fills the at least one cavity and is configured to serve as a heat sink for the at least one optoelectronic emitter.
    Type: Application
    Filed: January 31, 2016
    Publication date: January 26, 2017
    Inventors: Tongbi T. Jiang, Weiping Li, Xiaofeng Fan
  • Patent number: 9503622
    Abstract: A CMOS imager assembly may include an integrated circuit (IC) having an active-pixel image sensor that is mounted on a printed circuit board (PCB) substrate using flip chip packaging technology. The IC and the PCB may be physically and electrically connected to each other through multiple electrically conductive connectors. An underfill material (which may include an anti-reflective material) may, during assembly, be introduced around the connectors in the space between the IC and the PCB. A chemical or physical discontinuity on the integrated circuit may, during assembly, prevent the underfill material from entering an area framed by the discontinuity, which may include the pixel array of the image sensor. The discontinuity may include a dam-like structure built up on the IC, a trench-like structure created on the IC, or a low surface tension material that has been applied to the surface of the IC.
    Type: Grant
    Filed: March 10, 2014
    Date of Patent: November 22, 2016
    Assignee: Apple Inc.
    Inventors: Tongbi T. Jiang, Xiaofeng Fan
  • Publication number: 20160050379
    Abstract: An optical system can include a curved light sensor and an optical system positioned in front of the curved light sensor. The curved light sensor includes a substrate and a patterned stress film formed over at least surface of the substrate.
    Type: Application
    Filed: August 18, 2014
    Publication date: February 18, 2016
    Inventors: Tongbi T. Jiang, Xiaofeng Fan
  • Publication number: 20150296622
    Abstract: A semiconductor strain gauge may be incorporated into a flexible printed circuit. The semiconductor strain gauge may be mounted in an opening in the flexible printed circuit. Electrical connections such as wire bonds may couple the semiconductor strain gauge to metal traces on a flexible printed circuit substrate in the flexible printed circuit. A flexible printed circuit opening may be filled with an encapsulant that encapsulates a semiconductor strain gauge. Vias may be formed through the encapsulant to contact the semiconductor strain gauge. Metal traces that run across the surface of the substrate and the encapsulant may contact the vias to form paths to the semiconductor strain gauge. A semiconductor strain gauge may be mounted on a substrate and covered with dielectric. Metal traces in a redistribution layer in the dielectric may overlap the semiconductor strain gauge and make contact to the semiconductor strain gauge.
    Type: Application
    Filed: April 11, 2014
    Publication date: October 15, 2015
    Applicant: Apple Inc.
    Inventors: Tongbi T. Jiang, Matthew E. Last, Henry H. Yang
  • Publication number: 20150296607
    Abstract: An electronic device may be provided with a flexible printed circuit. The flexible printed circuit may have layers of metal and dielectric. Strain gauge resistors may be formed from a strain gauge metal such as constantan. The strain gauge metal may be formed within the flexible printed circuit layers. A strain gauge may include strain gauge circuitry coupled to a strain gauge bridge circuit. Strain gauge resistors for the bridge circuit may be formed from traces that follow parallel meandering paths in the flexible printed circuit layers. A component such as a fingerprint sensor may overlap the strain gauge resistors. Strain gauge resistors may be formed in different overlapping metal layers in the flexible printed circuit layers or may be formed from the same metal layer. Electroplating techniques may be used to form metal traces to which solder balls or wire bonds are coupled.
    Type: Application
    Filed: April 11, 2014
    Publication date: October 15, 2015
    Applicant: APPLE INC.
    Inventors: Henry H. Yang, Matthew E. Last, Tongbi T. Jiang
  • Publication number: 20150256725
    Abstract: A CMOS imager assembly may include an integrated circuit (IC) having an active-pixel image sensor that is mounted on a printed circuit board (PCB) substrate using flip chip packaging technology. The IC and the PCB may be physically and electrically connected to each other through multiple electrically conductive connectors. An underfill material (which may include an anti-reflective material) may, during assembly, be introduced around the connectors in the space between the IC and the PCB. A chemical or physical discontinuity on the integrated circuit may, during assembly, prevent the underfill material from entering an area framed by the discontinuity, which may include the pixel array of the image sensor. The discontinuity may include a dam-like structure built up on the IC, a trench-like structure created on the IC, or a low surface tension material that has been applied to the surface of the IC.
    Type: Application
    Filed: March 10, 2014
    Publication date: September 10, 2015
    Applicant: APPLE INC.
    Inventors: Tongbi T. Jiang, Xiaofeng Fan