Abstract: Disclosed are monoclonal antibodies, antigen binding fragments, and bi-specific antibodies that specifically bind a coronavirus spike protein, such as SARS-CoV-2. Also disclosed is the use of these antibodies for inhibiting a coronavirus infection, such as a SARS-CoV-2 infection. In addition, disclosed are methods for detecting a coronavirus, such as SARS-CoV-2, in a biological sample, using the disclosed antibodies.

Abstract: Disclosed are antigen binding polypeptides and antigen binding polypeptide complexes (e.g., antibodies and antigen binding fragments thereof) having certain structural and/or functional features. Also disclosed are polynucleotides and vectors encoding such polypeptides and polypeptide complexes; host cells, pharmaceutical compositions and kits containing such polypeptides and polypeptide complexes; and methods of using such polypeptides and polypeptide complexes.

Abstract: An integrated receiver chip comprising: a first end and a second end; at least one optical input port disposed at the first end; a polarization manipulation device optically connected to one of the at least one optical input port, the polarization manipulation device being adapted to split an optical signal into a first and a second optical signals; a first and a second dispersion compensators each optically connected to the polarization manipulation device, the first and the second dispersion compensators each being adapted to selectively induce a dispersion on an optical signal propagating through the dispersion compensator; and a first and a second photodetectors optically connected to the first and the second dispersion compensators, respectively.

Abstract: Embodiment of present invention provide an optical subassembly that includes a first, a second, and a third band filter (BF) each having a common port (CP), a port-A (PA), and a port-B (PB). The PA of the second BF is connected to the PA of the third BF and the PB of the first BF is connected to the PB of the third BF. The optical subassembly is adapted to route a first optical signal of a blue band from the PA to the CP of the first BF; to route the first optical signal from the CP of the second BF to the CP of the third BF; to route a second optical signal of a red band from the CP of the third BF to the CP of the first BF; and to route the second optical signal from the CP to the PB of the second BF.

Abstract: An integrated transmitter chip having a transmitter block, the transmitter block having: a first power divider optically connected to a first input port; a second power divider optically connected to a second input port; a first plurality of optical channels optically branched from the first power divider; a second plurality of optical channels optically branched from the second power divider; a first multiplexer optically connected to a first optical channel of the first plurality of optical channels and a first optical channel of the second plurality of optical channels, and a second multiplexer optically connected to a second optical channel of the first plurality of optical channels and a second optical channel of the second plurality of optical channels. The integrated transmitter chip may be configured to utilize polarization division multiplexing or wavelength division multiplexing to combine optical signals depending on the application of the corresponding integrated transmitter chip.

Abstract: An integrated transmitter chip comprising: at least one input port disposed at a first end of the integrated transmitter chip; a first variable power divider optically connected to each input port of the at least one input port; a second and a third variable power dividers optically branched from each first variable power divider; a first and a second optical channel optically branched from the second variable power divider, a third and a fourth optical channel optically branched from the third variable power divider; and at least one WDM optically attached to corresponding optical channels and configured to selectively modify the polarization of and multiplex corresponding optical signals into a output optical signal, wherein a laser beam is launched into an input port, split by corresponding variable power dividers based upon each dividers corresponding splitting ratio, then multiplexed and combined into an output optical signal having dual polarization modes.

Abstract: An integrated Mach-Zehnder Interferometer comprising: an upper arm and a lower arm; and a differential thermo-optic phase shifter comprising a first heating element and a second heating element collocated with the upper arm and the lower arm, respectively, the first heating element having a first resistance and the second heating element having a second resistance, an upper pad electrically connected to the first heating element, the upper pad being adapted to receive a first voltage, a lower pad electrically connected to the second heating element, the lower pad being adapted to receive a second voltage, and a common pad electrically connected to the first heating element and the second heating element, the common pad being adapted to receive a third voltage; wherein, when the first, the second, and the third voltages are applied to the upper, the lower, and the common pads, respectively, a phase shift difference is thermally produced.

Abstract: Embodiment of present invention provide an optical subassembly that includes a first, a second, and a third band filter (BF) each having a common port (CP), a port-A (PA), and a port-B (PB). The PA of the second BF is connected to the PA of the third BF and the PB of the first BF is connected to the PB of the third BF. The optical subassembly is adapted to route a first optical signal of a blue band from the PA to the CP of the first BF; to route the first optical signal from the CP of the second BF to the CP of the third BF; to route a second optical signal of a red band from the CP of the third BF to the CP of the first BF; and to route the second optical signal from the CP to the PB of the second BF.

Abstract: A silicon photonics based single wavelength 100 Gbit/s PAM4 DWDM transceiver in a pluggable form factor having a transmitter, said transmitter having: a DWDM laser source; a fiber array pigtail having a polarization maintaining fiber and an output single mode fiber; a silicon photonics modulator chip configured to optically connect to the DWDM laser source through the usage of the polarization maintaining fiber, a modulator driver chip connected to the silicon photonics modulator chip and an LC receptacle configured to optically connect to the silicon photonics modulator chip through the usage of the output single mode fiber. The disclosed transmitter may be further comprised of a reference loop within the silicon photonics modulator chip to allow for the utilization of a passive alignment approach for optically connected elements. The disclosed transceiver may be configured for use with C-band DWDM applications for utilization in applicable technologies, including 5G telecommunications.

Abstract: An integrated waveguide polarizer comprising: a plurality of silicon layers and a plurality of silicon-nitride layers; each of the plurality of silicon layers and each of the plurality of silicon-nitride layers having a first end and an opposite second end, the first end having a wide width and the second end having a narrow width, such that each silicon layer and each silicon-nitride layer have tapered shapes; wherein the pluralities of silicon and silicon-nitride layers are overlapped, such that at least a portion of each silicon-nitride layer overlaps at least a portion of each silicon layer; and a plurality of oxide layers disposed between the pluralities of silicon-nitride and silicon layers, each oxide layer creating a separation spacing between each silicon-nitride and each silicon layers; wherein, when an optical signal is launched through the integrated waveguide polarizer, the optical signal is transitioned between each silicon-nitride layer and each silicon layer.

Abstract: A system for optically aligning a photonics die to a fiber array, the fiber array comprising a first and a second fiber channels, the system comprising: the photonics die having: a first and a second optical channels; a first and a second wavelength division multiplexing (WDM) couplers each comprising a bar port, a cross port, and a common port, the first and the second WDM couplers being optically connected to the first and the second optical channels, respectively, via the bar ports and the common ports; and a waveguide crossing optically connecting the cross ports of the first and the second WDM couplers; the system being adapted to couple an optical signal received from the first fiber channel into the cross port of the first WDM coupler and into the waveguide crossing, the optical signal being propagated from the waveguide crossing into the cross port of the second WDM coupler.

Abstract: An integrated transceiver chip comprising: a plurality of bidirectional ports; a plurality of grating couplers; a receiver having a first and a second input ports, the first input port being optically connected to a first grating coupler of the plurality of grating couplers, and the second input port being optically connected to a first bidirectional port of the plurality of bidirectional ports; and a transmitter having a first and a second input and a first and a second output ports, the first input port being optically connected to a second bidirectional port of the plurality of bidirectional ports and the second input port being optically connected to a second grating coupler, and the first output port being optically connected to a third bidirectional port of the plurality of bidirectional ports and the second output port being optically connected to a third grating coupler of the plurality of grating couplers.

Abstract: An optical apparatus comprising an integrated germanium photodetector associated with a silicon nitride launch waveguide, the integrated germanium photodetector comprising a silicon layer, a germanium layer disposed atop the silicon layer, a plurality of conductive vias, at least one conductive via of the plurality of conductive vias being disposed atop the germanium layer, and a plurality of metal contacts each interconnected to each of the plurality of conductive vias; wherein the silicon nitride launch waveguide extends over a length of the silicon layer, and such that to create a coupling region between the silicon nitride launch waveguide and the germanium layer; and wherein, when an optical signal is launched into the silicon nitride launch waveguide, the optical signal is caused to be coupled into the integrated germanium photodetector at the coupling region, such that to be absorbed by the germanium layer.

Abstract: An integrated transmitter chip comprising: at least one input port disposed at a first end of the integrated transmitter chip; a first variable power divider optically connected to each input port of the at least one input port; a second and a third variable power dividers optically branched from each first variable power divider; a first and a second optical channel optically branched from the second variable power divider, a third and a fourth optical channel optically branched from the third variable power divider; and at least one WDM optically attached to corresponding optical channels and configured to selectively modify the polarization of and multiplex corresponding optical signals into a output optical signal, wherein a laser beam is launched into an input port, split by corresponding variable power dividers based upon each dividers corresponding splitting ratio, then multiplexed and combined into an output optical signal having dual polarization modes.

Abstract: An integrated photonics chip comprising: a plurality of optical channels extending a length of the integrated photonics chip; at least one variable optical attenuator (VOA) being optically connected to one of the plurality of optical channels, the at least one VOA comprising a silicon diode; at least one modulator being optically connected to another of the plurality of optical channels, the at least one modulator comprising a silicon diode; wherein the silicon diodes of the at least one VOA and the at least one modulator are adapted to receive biasing voltages; and wherein an application of the biasing voltages causes the silicon diodes of the at least one VOA and the at least one modulator to be reverse-biased, such that the at least one VOA and the at least one modulator are each adapted to detect a photocurrent of an optical signal being propagated along the plurality of optical channels.

Abstract: An integrated waveguide polarizer comprising: a plurality of silicon layers and a plurality of silicon-nitride layers; each of the plurality of silicon layers and each of the plurality of silicon-nitride layers having a first end and an opposite second end, the first end having a wide width and the second end having a narrow width, such that each silicon layer and each silicon-nitride layer have tapered shapes; wherein the pluralities of silicon and silicon-nitride layers are overlapped, such that at least a portion of each silicon-nitride layer overlaps at least a portion of each silicon layer; and a plurality of oxide layers disposed between the pluralities of silicon-nitride and silicon layers, each oxide layer creating a separation spacing between each silicon-nitride and each silicon layers; wherein, when an optical signal is launched through the integrated waveguide polarizer, the optical signal is transitioned between each silicon-nitride layer and each silicon layer.

Abstract: A silicon photonics based single wavelength 100 Gbit/s PAM4 DWDM transceiver in a pluggable form factor having a transmitter, said transmitter having: a DWDM laser source; a fiber array pigtail having a polarization maintaining fiber and an output single mode fiber; a silicon photonics modulator chip configured to optically connect to the DWDM laser source through the usage of the polarization maintaining fiber, a modulator driver chip connected to the silicon photonics modulator chip and an LC receptacle configured to optically connect to the silicon photonics modulator chip through the usage of the output single mode fiber. The disclosed transmitter may be further comprised of a reference loop within the silicon photonics modulator chip to allow for the utilization of a passive alignment approach for optically connected elements. The disclosed transceiver may be configured for use with C-band DWDM applications for utilization in applicable technologies, including 5G telecommunications.

Abstract: An integrated Mach-Zehnder Interferometer comprising: an upper arm and a lower arm; and a differential thermo-optic phase shifter comprising a first heating element and a second heating element collocated with the upper arm and the lower arm, respectively, the first heating element having a first resistance and the second heating element having a second resistance, an upper pad electrically connected to the first heating element, the upper pad being adapted to receive a first voltage, a lower pad electrically connected to the second heating element, the lower pad being adapted to receive a second voltage, and a common pad electrically connected to the first heating element and the second heating element, the common pad being adapted to receive a third voltage; wherein, when the first, the second, and the third voltages are applied to the upper, the lower, and the common pads, respectively, a phase shift difference is thermally produced.

Abstract: An integrated transmitter chip comprising: at least one input port disposed at a first end; a first variable power divider optically connected to a first input port of the at least one input port, the first variable power divider being tunable to a first splitting ratio; a second and a third variable power dividers each optically connected to the first variable power divider, the second and the third variable power dividers being tunable to a second and a third splitting ratios; and a first and a second optical channels being optically branched from the second variable power divider, and a third and a fourth optical channels being optically branched from the third variable power divider; wherein an optical signal being launched into the first input port and having an input power is caused to be split by the first variable power divider into a first and a second optical signals.

Abstract: A system for optically aligning a photonics die to a fiber array, the fiber array comprising a first and a second fiber channels, the system comprising: the photonics die having: a first and a second optical channels; a first and a second wavelength division multiplexing (WDM) couplers each comprising a bar port, a cross port, and a common port, the first and the second WDM couplers being optically connected to the first and the second optical channels, respectively, via the bar ports and the common ports; and a waveguide crossing optically connecting the cross ports of the first and the second WDM couplers; the system being adapted to couple an optical signal received from the first fiber channel into the cross port of the first WDM coupler and into the waveguide crossing, the optical signal being propagated from the waveguide crossing into the cross port of the second WDM coupler.