Patents by Inventor Tony K. Lim
Tony K. Lim has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11750983Abstract: A microphone assembly includes a substrate and a microelectromechanical systems (MEMS) die. The substrate comprises a top layer and a bottom layer. The top layer comprises a layer of solder mask material spanning across at least a portion of the substrate and one or more standoffs formed of the solder mask material. The one or more standoffs and the layer of solder mask material comprising a single, contiguous structure. The MEMS die is disposed on the one or more standoffs and is coupled to the substrate via a bonding material. The bonding material forms an acoustic seal between the substrate and the MEMS die.Type: GrantFiled: October 24, 2019Date of Patent: September 5, 2023Assignee: Knowles Electronics, LLCInventors: Tony K. Lim, Norman Dennis Talag
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Patent number: 11696082Abstract: A microphone assembly comprises a substrate. An acoustic transducer is disposed on the substrate and configured to generate an electrical signal responsive to an acoustic signal. An integrated circuit is disposed on the substrate and electrically coupled to the acoustic transducer. An enclosure is disposed on the substrate, and comprises a main body, and a sidewall projecting axially from outer edges of the main body towards the substrate and contacting the substrate such that an internal volume is defined between the enclosure and the substrate. An insulating layer is insert molded on an inner surface of the enclosure, or over molded on an outer surface of the enclosure such that the insulating layer is not disposed on a portion of the sidewall proximate to the substrate.Type: GrantFiled: July 25, 2020Date of Patent: July 4, 2023Assignee: Knowles Electronics, LLCInventors: Norman Dennis Talag, Lili Borna, Tony K. Lim
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Patent number: 11662236Abstract: A sensor device includes a substrate having a front surface and an opposing back surface. The back surface defines an indented region having an indented surface. The substrate defines a bottom port extending between the front surface and the indented surface. The sensor further includes a microelectromechanical systems (MEMS) transducer mounted on the front surface of the substrate over the bottom port. The sensor also includes a filtering material disposed on the indented surface and covering the bottom port. The filtering material provides resistance to ingression of solid particles or liquids into the sensor device. The filtering material is configured to provide high acoustic permittivity and have low impact on a signal-to-noise ratio of the sensor device.Type: GrantFiled: March 9, 2020Date of Patent: May 30, 2023Assignee: KNOWLES ELECTRONICS, LLC.Inventors: Tony K. Lim, Norman Dennis Talag
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Publication number: 20210392442Abstract: A microphone assembly includes a substrate and a microelectromechanical systems (MEMS) die. The substrate comprises a top layer and a bottom layer. The top layer comprises a layer of solder mask material spanning across at least a portion of the substrate and one or more standoffs formed of the solder mask material. The one or more standoffs and the layer of solder mask material comprising a single, contiguous structure. The MEMS die is disposed on the one or more standoffs and is coupled to the substrate via a bonding material. The bonding material forms an acoustic seal between the substrate and the MEMS die.Type: ApplicationFiled: October 24, 2019Publication date: December 16, 2021Inventors: Tony K. Lim, Norman Dennis Talag
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Patent number: 10924867Abstract: A microphone includes a housing including a substrate and a cover disposed over the substrate, the housing including a sound port between the interior of the housing and the exterior of the housing. The microphone also includes a microelectromechanical systems (MEMS) transducer and an integrated circuit (IC) positioned within the housing and mounted on a common surface of the housing, where the MEMS transducer is electrically connected to the IC, and the IC is electrically connected to a conductor on the substrate. The microphone further includes an encapsulating material covering the IC, and an encapsulating material confinement structure disposed between the MEMS transducer and the IC, where the encapsulating material confinement structure at least partially confines the encapsulating material around the IC.Type: GrantFiled: April 17, 2020Date of Patent: February 16, 2021Assignee: Knowles Electroics, LLCInventors: Tony K. Lim, John Szczech, Joshua Watson
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Publication number: 20210037330Abstract: A microphone assembly comprises a substrate. An acoustic transducer is disposed on the substrate and configured to generate an electrical signal responsive to an acoustic signal. An integrated circuit is disposed on the substrate and electrically coupled to the acoustic transducer. An enclosure is disposed on the substrate, and comprises a main body, and a sidewall projecting axially from outer edges of the main body towards the substrate and contacting the substrate such that an internal volume is defined between the enclosure and the substrate. An insulating layer is insert molded on an inner surface of the enclosure, or over molded on an outer surface of the enclosure such that the insulating layer is not disposed on a portion of the sidewall proximate to the substrate.Type: ApplicationFiled: July 25, 2020Publication date: February 4, 2021Inventors: Norman Dennis Talag, Lili Borna, Tony K. Lim
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Publication number: 20200245078Abstract: A microphone includes a housing including a substrate and a cover disposed over the substrate, the housing including a sound port between the interior of the housing and the exterior of the housing. The microphone also includes a microelectromechanical systems (MEMS) transducer and an integrated circuit (IC) positioned within the housing and mounted on a common surface of the housing, where the MEMS transducer is electrically connected to the IC, and the IC is electrically connected to a conductor on the substrate. The microphone further includes an encapsulating material covering the IC, and an encapsulating material confinement structure disposed between the MEMS transducer and the IC, where the encapsulating material confinement structure at least partially confines the encapsulating material around the IC.Type: ApplicationFiled: April 17, 2020Publication date: July 30, 2020Applicant: Knowles Electronics, LLCInventors: Tony K. Lim, John Szczech, Joshua Watson
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Publication number: 20200209024Abstract: A sensor device includes a substrate having a front surface and an opposing back surface. The back surface defines an indented region having an indented surface. The substrate defines a bottom port extending between the front surface and the indented surface. The sensor further includes a microelectromechanical systems (MEMS) transducer mounted on the front surface of the substrate over the bottom port. The sensor also includes a filtering material disposed on the indented surface and covering the bottom port. The filtering material provides resistance to ingression of solid particles or liquids into the sensor device. The filtering material is configured to provide high acoustic permittivity and have low impact on a signal-to-noise ratio of the sensor device.Type: ApplicationFiled: March 9, 2020Publication date: July 2, 2020Applicant: Knowles Electronics, LLCInventors: Tony K. LIM, Norman Dennis TALAG
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Patent number: 10640371Abstract: Systems, apparatuses, and methods for manufacturing a microelectromechanical system (MEMS) device. The MEMS device includes a substrate, a cap, a microelectromechanical component, and a tag. The cap is coupled to the substrate such that the substrate and the cap cooperatively define an interior cavity. One of the substrate or the cap defines a port. The microelectromechanical component is disposed within the interior cavity. The tag is coupled to the substrate and an exterior surface of the cap to secure the cap to the substrate.Type: GrantFiled: February 8, 2019Date of Patent: May 5, 2020Assignee: Knowles Electronics, LLCInventors: Tony K. Lim, Norman Dennis Talag
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Patent number: 10631099Abstract: A microphone includes a substrate defining an embedded cavity between a first surface of the substrate and an opposing second surface of the substrate, the first surface defining a first opening into the embedded cavity, a distance between the first surface and the second surface defining a substrate thickness. A cover is disposed over the first surface of the substrate and forms a housing, the cover including a port, the substrate thickness being greater than a height of the cover from the first surface of the substrate. A microelectromechanical systems (MEMS) transducer is disposed in the housing and mounted on the first surface of the substrate over the first opening, and an integrated circuit (IC) is disposed in the housing and electrically coupled to the MEMS transducer. The MEMS transducer and the IC are disposed in a front volume of the housing defined by the cover and the substrate.Type: GrantFiled: September 11, 2018Date of Patent: April 21, 2020Assignee: Knowles Electronics, LLCInventors: Tony K. Lim, John Szczech, Joshua Watson
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Patent number: 10591326Abstract: A sensor device includes a substrate having a front surface and an opposing back surface. The back surface defines an indented region having an indented surface. The substrate defines a bottom port extending between the front surface and the indented surface. The sensor further includes a microelectromechanical systems (MEMS) transducer mounted on the front surface of the substrate over the bottom port. The sensor also includes a filtering material disposed on the indented surface and covering the bottom port. The filtering material provides resistance to ingression of solid particles or liquids into the sensor device. The filtering material is configured to provide high acoustic permittivity and have low impact on a signal-to-noise ratio of the sensor device.Type: GrantFiled: November 13, 2018Date of Patent: March 17, 2020Assignee: Knowles Electronics, LLCInventors: Tony K. Lim, Norman Dennis Talag
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Patent number: 10547955Abstract: A microphone device includes a housing including a substrate having a first surface and a cover disposed over the substrate, the housing including a sound port between the interior of the housing and the exterior of the housing. The device also includes a microelectromechanical systems (MEMS) transducer mounted on the substrate and an integrated circuit (IC) mounted on the substrate. The MEMS transducer of the device is electrically connected to the IC, and the IC of the device is electrically connected to a conductor on the substrate. An encapsulating material covers the IC. And an encapsulating material confinement structure is disposed between the MEMS transducer and the IC, wherein the encapsulating material confinement structure at least partially confines the encapsulating material around the IC.Type: GrantFiled: May 24, 2018Date of Patent: January 28, 2020Assignee: Knowles Electronics, LLCInventors: Tony K. Lim, John Szczech, Joshua Watson
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Publication number: 20190169022Abstract: Systems, apparatuses, and methods for manufacturing a microelectromechanical system (MEMS) device. The MEMS device includes a substrate, a cap, a microelectromechanical component, and a tag. The cap is coupled to the substrate such that the substrate and the cap cooperatively define an interior cavity. One of the substrate or the cap defines a port. The microelectromechanical component is disposed within the interior cavity. The tag is coupled to the substrate and an exterior surface of the cap to secure the cap to the substrate.Type: ApplicationFiled: February 8, 2019Publication date: June 6, 2019Applicant: Knowles Electronics, LLCInventors: Tony K. Lim, Norman Dennis Talag
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Publication number: 20190145806Abstract: A sensor device includes a substrate having a front surface and an opposing back surface. The back surface defines an indented region having an indented surface. The substrate defines a bottom port extending between the front surface and the indented surface. The sensor further includes a microelectromechanical systems (MEMS) transducer mounted on the front surface of the substrate over the bottom port. The sensor also includes a filtering material disposed on the indented surface and covering the bottom port. The filtering material provides resistance to ingression of solid particles or liquids into the sensor device. The filtering material is configured to provide high acoustic permittivity and have low impact on a signal-to-noise ratio of the sensor device.Type: ApplicationFiled: November 13, 2018Publication date: May 16, 2019Applicant: Knowles Electronics, LLCInventors: Tony K. Lim, Norman Dennis Talag
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Patent number: 10291973Abstract: A microphone includes a base and a microelectromechanical system (MEMS) die and an integrated circuit (IC) disposed on the base. The microphone also includes a cover mounted on the base and covering the MEMS die and the IC. The cover includes an indented region or an inwardly drawn region that define a top port through which acoustic energy can enter the microphone and be incident on the MEMS die. The microphone also includes a filtering material disposed on the top port on an outside surface of the cover and within the indented region or the inwardly drawn region. The filtering material provides resistance to ingression of solid particles or liquids into the microphone.Type: GrantFiled: November 14, 2017Date of Patent: May 14, 2019Assignee: Knowles Electronics, LLCInventors: Tony K. Lim, Norman Dennis Talag
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Patent number: 10227232Abstract: Systems, apparatuses, and methods for manufacturing a microelectromechanical system (MEMS) device. The MEMS device includes a substrate, a cap, a microelectromechanical component, and a tag. The substrate defines a port. The cap is coupled to the substrate. The substrate and the cap cooperatively define an interior cavity. The microelectromechanical component is disposed within the interior cavity and coupled to the substrate such that the microelectromechanical component is positioned over the port to at least partially isolate the port from the interior cavity. The tag is coupled to the substrate and the cap. The tag is positioned to secure the cap to the substrate.Type: GrantFiled: July 26, 2017Date of Patent: March 12, 2019Assignee: Knowles Electronics, LLCInventors: Tony K. Lim, Norman D. Talag
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Publication number: 20190014421Abstract: A microphone includes a substrate defining an embedded cavity between a first surface of the substrate and an opposing second surface of the substrate, the first surface defining a first opening into the embedded cavity, a distance between the first surface and the second surface defining a substrate thickness. A cover is disposed over the first surface of the substrate and forms a housing, the cover including a port, the substrate thickness being greater than a height of the cover from the first surface of the substrate. A microelectromechanical systems (MEMS) transducer is disposed in the housing and mounted on the first surface of the substrate over the first opening, and an integrated circuit (IC) is disposed in the housing and electrically coupled to the MEMS transducer. The MEMS transducer and the IC are disposed in a front volume of the housing defined by the cover and the substrate.Type: ApplicationFiled: September 11, 2018Publication date: January 10, 2019Applicant: Knowles Electronics, LLCInventors: Tony K. Lim, John Szczech, Joshua Watson
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Publication number: 20180343524Abstract: A microphone device includes a substrate having a cavity. The device also includes a microelectromechanical systems (MEMS) transducer mounted on the substrate outside of the cavity and an application specific integrated circuit mounted in the cavity. A first set of bonding wires connect the MEMS transducer to the ASIC and a second set of bonding wires connect the ASIC to a conductor within the cavity. An encapsulating material completely covers the ASIC and at least a portion of the second set of wires and is substantially confined within the cavity. A cover is installed over the substrate to cover the MEMS transducer, the encapsulating material, the ASIC, the first set of bonding wires, and the second set of bonding wires.Type: ApplicationFiled: May 24, 2018Publication date: November 29, 2018Applicant: Knowles Electronics, LLCInventors: Tony K. Lim, John Szczech, Joshua Watson
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Publication number: 20180070162Abstract: A microphone includes a base and a microelectromechanical system (MEMS) die and an integrated circuit (IC) disposed on the base. The microphone also includes a cover mounted on the base and covering the MEMS die and the IC. The cover includes an indented region or an inwardly drawn region that define a top port through which acoustic energy can enter the microphone and be incident on the MEMS die. The microphone also includes a filtering material disposed on the top port on an outside surface of the cover and within the indented region or the inwardly drawn region. The filtering material provides resistance to ingression of solid particles or liquids into the microphone.Type: ApplicationFiled: November 14, 2017Publication date: March 8, 2018Applicant: Knowles Electronics, LLCInventors: Tony K. Lim, Norman Dannis Talag
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Publication number: 20180029880Abstract: Systems, apparatuses, and methods for manufacturing a microelectromechanical system (MEMS) device. The MEMS device includes a substrate, a cap, a microelectromechanical component, and a tag. The substrate defines a port. The cap is coupled to the substrate. The substrate and the cap cooperatively define an interior cavity. The microelectromechanical component is disposed within the interior cavity and coupled to the substrate such that the microelectromechanical component is positioned over the port to at least partially isolate the port from the interior cavity. The tag is coupled to the substrate and the cap. The tag is positioned to secure the cap to the substrate.Type: ApplicationFiled: July 26, 2017Publication date: February 1, 2018Applicant: Knowles Electronics, LLCInventors: Tony K. Lim, Norman D. Talag