Patents by Inventor Tony K. Lim

Tony K. Lim has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Microphone with coined area
    Patent number: 9883270
    Abstract: A microphone includes a base and a microelectromechanical system (MEMS) die mounted to the base. The microphone also includes an integrated circuit fixed to the base. The microphone further includes a lid mounted to the base that encloses the MEMS die and the integrated circuit within a cavity formed by the base and the lid. The lid has an indented portion extending into but not fully through the lid.
    Type: Grant
    Filed: May 13, 2016
    Date of Patent: January 30, 2018
    Assignee: Knowles Electronics, LLC
    Inventor: Tony K. Lim
  • MICROPHONE WITH COINED AREA
    Publication number: 20160337735
    Abstract: A microphone includes a base and a microelectromechanical system (MEMS) die mounted to the base. The microphone also includes an integrated circuit fixed to the base. The microphone further includes a lid mounted to the base that encloses the MEMS die and the integrated circuit within a cavity formed by the base and the lid. The lid has an indented portion extending into but not fully through the lid.
    Type: Application
    Filed: May 13, 2016
    Publication date: November 17, 2016
    Applicant: Knowles Electronics, LLC
    Inventor: Tony K. Lim
  • Housing and method to control solder creep on housing
    Patent number: 9402118
    Abstract: An acoustic device includes a substrate, a substrate cover, and a plurality of electrical and acoustic components. The substrate cover is disposed on the substrate and the plurality of electrical and acoustic components are disposed on the substrate and under the substrate cover. The substrate cover is constructed of a base metal and the substrate cover comprises a partially plating. The partial plating is arranged so as to prevent solder creep along a surface of the substrate cover.
    Type: Grant
    Filed: July 24, 2013
    Date of Patent: July 26, 2016
    Assignee: Knowles Electronics, LLC
    Inventors: Tony K. Lim, Kurt B. Friel
  • Method and Apparatus for an Acoustic Device Having a Coating
    Publication number: 20150172825
    Abstract: An acoustic device comprises a substrate and a housing that affixes to the substrate via an affixment material to thereby encapsulate at least one acoustic transducer such as a microphone. By one approach the housing comprises brass but is nevertheless unplated. A coating is disposed on the exterior surface of the housing and of the affixment material. These teachings will also accommodate covering some or all of the exterior, exposed surface of substrate.
    Type: Application
    Filed: December 2, 2014
    Publication date: June 18, 2015
    Inventors: Tony K. Lim, Norman Dennis Talag, Kurt B. Friel
  • Microphone Assembly
    Publication number: 20140037120
    Abstract: A Microelectromechanical system (MEMS) assembly includes a cover, a substrate, at least one wall disposed and between and attached to the cover and the substrate, a MEMS device disposed at the cover and an integrated circuit disposed at the substrate. The integrated circuit and the MEMS device are disposed one over the other and electrically connected together at least in part by conduits that extend through the walls. Alternatively, the MEMS device may be disposed on the substrate and the integrated circuit disposed on the base.
    Type: Application
    Filed: July 29, 2013
    Publication date: February 6, 2014
    Applicant: Knowles Electronics, LLC
    Inventors: Tony K. Lim, Qing Wang, Sandra F. Vos
  • Housing And Method To Control Solder Creep On Housing
    Publication number: 20140037124
    Abstract: An acoustic device includes a substrate, a substrate cover, and a plurality of electrical and acoustic components. The substrate cover is disposed on the substrate and the plurality of electrical and acoustic components are disposed on the substrate and under the substrate cover. The substrate cover is constructed of a base metal and the substrate cover comprises a partially plating. The partial plating is arranged so as to prevent solder creep along a surface of the substrate cover.
    Type: Application
    Filed: July 24, 2013
    Publication date: February 6, 2014
    Applicant: Knowles Electronics, LLC
    Inventors: Tony K. Lim, Kurt B. Friel