Abstract: A method for manufacturing a heat pipe having an enlarged portion includes the steps of: preparing a hollow tubular material having a uniform outer diameter; forming the tubular material with an enlarged portion having a different or larger outer diameter by narrowing or enlarging the tubular material; arranging a capillary structure into the tubular material; filling a working fluid into the tubular material after sealing one end of the tubular material; sealing the end to form a heat pipe after performing a degassing operation; and pressing the enlarged portion obtained in the previous step to form a flattened enlarged portion on the heat pipe.

Abstract: A capillary structure of a heat pipe includes a hollow pipe body and a capillary structure adhered to the inner wall of the pipe body. The main part of the pipe body is provided with at least one heated section. The capillary structure within the heated section is constituted by sintered powder, and the capillary structure within the remaining portion of the main part of the pipe body is constituted by woven web or groove. By using two different kinds of capillary structures to form the capillary structure of the inner wall of the heat pipe, the heat pipe can withstand a heat source of higher temperature, and can also be suitable for a curved pipe.

Abstract: A dual mode electrochemical system comprises a first electrode capable of storing hydrogen, a second electrode, a substantially electrically insulating and substantially ionically conducting membrane interposed therebetween and an electrolyte. In a first mode, upon introduction of water and electricity the dual mode electrochemical system electrolyzes the water in the presence of the electrolyte and produces hydrogen and oxygen across the membrane. The hydrogen is stored in the first electrode. In a second mode, upon introduction of an oxidant to the second electrode the dual mode electrochemical system produces water and electricity by reacting the stored hydrogen and the oxidant across the membrane.

Abstract: A method for manufacturing a heat pipe having an enlarged portion includes the steps of: preparing a hollow tubular material having a uniform outer diameter; forming the tubular material with an enlarged portion having a different or larger outer diameter by narrowing or enlarging the tubular material; arranging a capillary structure into the tubular material; filling a working fluid into the tubular material after sealing one end of the tubular material; sealing the end to form a heat pipe after performing a degassing operation; and pressing the enlarged portion obtained in the previous step to form a flattened enlarged portion on the heat pipe.

Abstract: A lens is provided for use in a vehicle interior ambient light device. The lens provides a beam of light that is narrower and is directed to a desirable position on different vehicle models and versions of those models. The lens includes an upper section having a shape that is a section of a frustum of a cone. The lens also includes a lower section having a shape of a frustum of an oblique cone with an oval base. Textured surfaces of the sides of the frustum of the lower section prevent the emission of stray light beams.

Abstract: A sintering apparatus for heat pipe includes a pipe body with a shrunk end and a second positioning point, a shaft with a tapered head and a filling tool with a first positioning point. The method for manufacturing the sintering apparatus includes the steps of inserting a shaft inside the pipe body such that a tapered head is assembled to the shrunk end to achieve a second positioning point, wherein another end of the shaft extending to the filling tool forms a first positioning point corresponding to the clamping section. The filling tool fills a wick structure into a uniform gap defined by the shaft and the pipe body and clamped by the first positioning point and the second positioning point. The wick structure is sintered and cooled to complete a heat pipe having wick structure of uniform thickness.

Abstract: An image sensor structure includes a substrate, four posts, a photosensitive chip, a plurality of wires, a glue layer, and a transparent layer. The substrate has an upper surface on which first electrodes are formed, and a lower surface on which second electrodes are formed. The four posts are arranged on the four angle of the upper surface of the substrate individually. The photosensitive chip is mounted on the upper surface of the substrate. The plurality of wires are electrically connected the photosensitive chip to the first electrodes of the substrate. The glue layer is surrounded to the periphery of the upper surface of the substrate for surrounding the photosensitive chip, and covered the part of the wires. The transparent layer is arranged onto the four posts and the glue layer to cover the photosensitive chip.

Abstract: An image sensor module structure includes a substrate, a photosensitive chip, a lens holder, and a lens barrel. The substrate has an upper surface on which first electrodes are formed, and a lower surface on which second electrodes are formed. The photosensitive chip is mounted on the upper surface of the substrate, and is electrically connected to the first electrodes of the substrate. The lens holder has an upper end face, a lower upper face, and an opening penetrating through the lens holder. The upper end of the opening is formed with an internal thread, and the lower end of the opening is formed with a breach. The lens holder is adhered on the upper surface of the substrate by glue, therefore, the photosensitive chip is located within the opening of the lens holder. The lens barrel has an upper end face, a lower end face, and an external thread screwed to the internal thread of the lens holder.

Abstract: An image sensor package structure with plastic substrate includes a substrate, a frame layer, a photosensitive chip, wires and transparent layer. The substrate is formed with a plurality of via hole, and the each via hole is arranged at the periphery of the substrate, then an interval is formed between the periphery of the substrate and the via holes, a conductive material being filled into the each via hole. The frame layer is arranged on the upper surface of the substrate to form a cavity together with the substrate. The photosensitive chip arranged within the cavity and is mounted on the substrate. Each wire is electrically connected the photosensitive chip to the substrate. The transparent layer covered over the frame layer to cover the photosensitive chip.

Abstract: An image sensor package includes a substrate, a frame layer, a photosensitive chip, wires, and transparent layer. The substrate has an upper surface on which first electrodes are formed, and a lower surface on which second electrodes are formed, wherein the each first electrode is curved. The frame layer is arranged on the upper surface of the substrate to form a cavity together with the substrate. The photosensitive chip is arranged within the cavity and is mounted on the upper surface of the substrate. The plurality of wires are electrically connected the photosensitive chip to the first electrode of the substrate. The transparent layer is covered over the frame layer to cover the photosensitive chip.

Abstract: A dual mode electrochemical system comprises a first electrode capable of storing hydrogen, a second electrode, a substantially electrically insulating and substantially ionically conducting membrane interposed therebetween and an electrolyte. In a first mode, upon introduction of water and electricity the dual mode electrochemical system electrolyzes the water in the presence of the electrolyte and produces hydrogen and oxygen across the membrane. The hydrogen is stored in the first electrode. In a second mode, upon introduction of an oxidant to the second electrode the dual mode electrochemical system produces water and electricity by reacting the stored hydrogen and the oxidant across the membrane.

Abstract: A method for processing integrated circuit devices. The method includes providing a monitor wafer, which comprising a silicon material. The method introduces a plurality of particles within a depth of the silicon material. The plurality of particles have a reduced activation energy within the silicon material. The method subjects the monitor wafer including the plurality of particles into a rapid thermal anneal process. The method includes applying the rapid thermal anneal process at a first state including a first temperature. The first temperature is within a range defined as a low temperature range, which is less than 650 Degrees Celsius. The method includes removing the monitor wafer and measuring a sheet resistivity of the monitor wafer. The method also determines the first temperature within a tolerance of less than 2 percent across the monitor wafer.

Abstract: This invention provides a configuring apparatus and a processing method for a thermal conductive plate, which uses high-temperature fusion to seal a top plate and a bottom plate of the thermal conductive plate together. Thereby, the sealing condition is improved to enhance yield. Further, the processing method speeds up fabrication of the thermal conductive plate to aid in execution of automatic process.

Abstract: A structure for expanding thermal conducting performance of a heat sink includes a bottom plate, a top plate, a hollow filling tube, a wick structure and a hollow thermal expansion conductor. The top and bottom plates are covered with each other to form a planar shell, in which an upper receiving chamber and a lower receiving chamber are formed. The wick structure is attached to the planar shell in upper and lower receiving chambers. The filling tube is filled with a working fluid. The thermal conductor has good conducting performance and is embedded in the planar shell. Further, the thermal conductor is in fluid communication with the upper and the lower chamber, such that the thermal conductor can serve as an extension of the planar shell for heat dissipation.

Abstract: The present invention relates to a battery charger with multiple functions comprises a charging unit and at least two adaptive connectors. The charging unit controls output voltages via software and has a display screen showing set voltages. A voltage select button provides convenience of voltage setting by touch button (or keys), the adaptive connector between the main charger and a charged device sets limited output voltages range, providing end user to select required voltages for various products. End users can power/charge many electrical products with one charger only.

Abstract: A method for processing integrated circuit devices. The method includes providing a monitor wafer, which comprising a silicon material. The method introduces a plurality of particles within a depth of the silicon material. The plurality of particles have a reduced activation energy within the silicon material. The method subjects the monitor wafer including the plurality of particles into a rapid thermal anneal process. The method includes applying the rapid thermal anneal process at a first state including a first temperature. The first temperature is within a range defined as a low temperature range, which is less than 650 Degrees Celsius. The method includes removing the monitor wafer and measuring a sheet resistivity of the monitor wafer. The method also determines the first temperature within a tolerance of less than 2 percent across the monitor wafer.

Abstract: Display observation angle of which is multidirectionally adjustable, including a panel control system, a panel, a transmission mechanism and a housing receiving the above components. The panel control system includes a program processing unit for turning on/off the transmission mechanism, a command input unit for giving control signal to the program processing unit and a mechanical position detection unit for always sensing the operation state of the transmission mechanism. The transmission mechanism includes a motor drive circuit and a mechanical unit composed of several gear sets mounted on the housing. The program processing unit activates the gear sets of the mechanical unit, whereby the panel is driven by the transmission mechanism. After the panel is extended out of the housing, the panel can be swung forward downward, backward upward, leftward or rightward.

Abstract: A process of fabricating a deep trench capacitor includes the steps of: depositing a nitride masking layer over a substrate; removing portions of the nitride masking layer and substrate to form an exposed deep trench having sidewalls and a bottom surface; forming an oxide fill plug to fill a bottom portion of the trench; removing the oxide fill plug from the trench; doping a region of the substrate enveloping the bottom portion of the trench; depositing a spacer insulating layer over the sidewalls and bottom surface of the trench; removing a portion of the spacer insulating layer to expose a central portion of the bottom surface of the trench; depositing a conducting layer over the spacer insulating layer, and the exposed central portion of the bottom surface, the conducting layer and the doped region of the substrate being in electrical contact and forming a first plate of the capacitor; removing a portion of the conducting layer; removing the spacer insulating layer to expose outer walls of the conducting l

Abstract: Display observation angle of which is multidirectionally adjustable, including a panel control system, a panel, a transmission mechanism and a housing receiving the above components. The panel control system includes a program processing unit for turning on/off the transmission mechanism, a command input unit for giving control signal to the program processing unit and a mechanical position detection unit for always sensing the operation state of the transmission mechanism. The transmission mechanism includes a motor drive circuit and a mechanical unit composed of several gear sets mounted on the housing. The program processing unit activates the gear sets of the mechanical unit, whereby the panel is driven by the transmission mechanism. After the panel is extended out of the housing, the panel can be swung forward downward, backward upward, leftward or rightward.

Abstract: Display panel transmission structure capable of multidirectionally adjusting observation angle of the display panel, including a housing, a display panel and a transmission mechanism. The housing defines a layout space in which the display panel and the transmission mechanism are movably received. The display panel is drivingly pivotally connected with the transmission mechanism. The transmission mechanism is composed of several gear sets mounted on a base seat and driven by motors. A first gear set serves to drive the display panel to swing forward downward or backward upward. A second and a third gear sets are respectively engaged with racks and slide channels disposed in the housing for extending the display panel out of the housing or retracting the display panel into the layout space of the housing. After the display panel is extended out of the housing, by means of the two gear sets, the display panel is swung leftward or rightward.