Patents by Inventor Toru Endo
Toru Endo has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20190308224Abstract: A first SPM, prepared by mixing sulfuric acid and hydrogen peroxide water at a first mixing ratio, is supplied to a substrate. A second SPM, prepared by mixing the sulfuric acid and the hydrogen peroxide water at a second mixing ratio greater than the first mixing ratio, is supplied to the substrate after the supply of the first SPM is stopped. The first SPM expelled from the substrate flows into a drain piping. The second SPM expelled from the substrate flows into a recovery piping. SPM is prepared by mixing the hydrogen peroxide water with sulfuric acid contained in the second SPM guided by the recovery piping.Type: ApplicationFiled: March 22, 2019Publication date: October 10, 2019Inventors: Masayuki HAYASHI, Nobuyuki SHIBAYAMA, Toru ENDO
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Publication number: 20190311919Abstract: A substrate processing method includes a substrate holding step of holding a substrate in a horizontal attitude, a chemical liquid supply step of supplying a chemical liquid to a main surface of the substrate while rotating the substrate around a vertical rotational axis that passes through a central portion of the substrate, a processing-height maintaining step of maintaining a cylindrical first guard that captures a chemical liquid expelled from the substrate at a processing height position in parallel with the chemical liquid supply step, and a cleaning-height maintaining step of maintaining the first guard at a cleaning height position set below the processing height position in parallel with the chemical liquid supply step after the processing-height maintaining step.Type: ApplicationFiled: March 22, 2019Publication date: October 10, 2019Inventors: Toru ENDO, Masayuki HAYASHI, Nobuyuki SHIBAYAMA
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Publication number: 20190295862Abstract: A substrate processing method includes a substrate holding step of holding a substrate by a substrate holding unit, a chemical liquid supplying step of supplying a chemical liquid to a main surface of the substrate while rotating the substrate around a rotational axis passing through a central portion of the substrate, a foreign matter detecting step of detecting foreign matter, contained in the chemical liquid expelled from the substrate, in parallel with the chemical liquid supplying step, and a flow destination switching step of switching, based on the detection of the foreign matter by the foreign matter detecting step, a flow destination of the chemical liquid expelled from the substrate from a drain piping to a recovery piping during the chemical liquid supplying step.Type: ApplicationFiled: March 18, 2019Publication date: September 26, 2019Inventors: Toru ENDO, Masayuki HAYASHI, Nobuyuki SHIBAYAMA
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Publication number: 20190295839Abstract: A substrate processing method includes a substrate holding step of holding a substrate by a substrate holding unit, a chemical liquid supply step of supplying a chemical liquid to a main surface of the substrate while rotating the substrate around a rotational axis passing through a central portion of the substrate, and a flow destination switching step of switching a flow destination of a chemical liquid expelled from the substrate from a first flow space in a processing cup surrounding a periphery of the substrate holding unit to a second flow space separated from the first flow space in the processing cup in parallel with the chemical liquid supply step.Type: ApplicationFiled: March 18, 2019Publication date: September 26, 2019Inventors: Toru ENDO, Masayuki HAYASHI, Nobuyuki SHIBAYAMA
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Publication number: 20190172737Abstract: In equipment that supplies a processing liquid on a top surface of a substrate while holding the substrate horizontally in a chamber a generation status of fumes is determined. Specifically, an image of a predetermined imaging area in the chamber is captured. Then, the generation status of fumes in the chamber is determined based on luminance values of the captured image acquired by the capturing of an image. Accordingly, it is possible to quantitatively determine whether a generation status of fumes in a chamber is normal.Type: ApplicationFiled: November 29, 2018Publication date: June 6, 2019Applicant: SCREEN Holdings Co., Ltd.Inventors: Toru ENDO, Masayuki HAYASHI, Nobuyuki SHIBAYAMA, Hideji NAOHARA, Hiroaki KAKUMA, Yuji OKITA, Tatsuya MASUI
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Patent number: 9997378Abstract: In a substrate processing apparatus, with an internal space of a chamber brought into a pressurized atmosphere, an etching process is performed by continuously supplying a first processing liquid onto an upper surface of a substrate while rotating the substrate. It is thereby possible to suppress vaporization of the first processing liquid on the substrate and further suppress a decrease in the temperature of the substrate due to the heat of vaporization as it goes from a center portion of the substrate toward a peripheral portion thereof as compared with under normal pressure. As a result, it is possible to improve the uniformity in the temperature of the upper surface of the substrate during the etching process using the first processing liquid and improve the uniformity of etching over the entire upper surface of the substrate.Type: GrantFiled: January 5, 2017Date of Patent: June 12, 2018Assignee: SCREEN HOLDINGS CO., LTD.Inventors: Hirofumi Masuhara, Kenichiro Arai, Masahiro Miyagi, Toru Endo
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Patent number: 9713822Abstract: A substrate processing apparatus comprising a substrate holding rotating mechanism, a process liquid supply mechanism having a nozzle for dispensing a process liquid toward a principal face of the substrate, a processing liquid reservoir for holding sufficient process liquid to form a liquid film covering the whole principal face of the substrate, a liquid film forming unit for forming the liquid film by supplying the process liquid onto the principal face of the substrate in a single burst, and a control unit for controlling the liquid film forming unit and the process liquid supply mechanism such that the process liquid is dispensed from the process liquid nozzle toward the principal face of the substrate after formation of the liquid film covering the whole area of the principal face of the substrate by the liquid film forming unit.Type: GrantFiled: November 7, 2014Date of Patent: July 25, 2017Assignee: SCREEN Holdings Co., Ltd.Inventors: Masahiro Miyagi, Koji Hashimoto, Toru Endo
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Patent number: 9640382Abstract: In a substrate processing apparatus, with an internal space of a chamber brought into a reduced pressure atmosphere, a first processing liquid is supplied onto an upper surface of a substrate while the substrate is rotated, and the first processing liquid is thereby quickly spread from a center portion toward a peripheral portion on the upper surface of the substrate. It is thereby possible to coat the upper surface of the substrate with the first processing liquid in a shorter time as compared with under normal pressure. Further, by sucking the first processing liquid from the vicinity of an edge of the substrate, it is possible to coat the upper surface of the substrate with the first processing liquid in a still shorter time. As a result, it is possible to shorten the time required for the processing of the substrate.Type: GrantFiled: September 15, 2015Date of Patent: May 2, 2017Assignee: SCREEN HOLDINGS CO., LTD.Inventors: Hirofumi Masuhara, Kenichiro Arai, Masahiro Miyagi, Toru Endo
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Publication number: 20170117163Abstract: In a substrate processing apparatus, with an internal space of a chamber brought into a pressurized atmosphere, an etching process is performed by continuously supplying a first processing liquid onto an upper surface of a substrate while rotating the substrate. It is thereby possible to suppress vaporization of the first processing liquid on the substrate and further suppress a decrease in the temperature of the substrate due to the heat of vaporization as it goes from a center portion of the substrate toward a peripheral portion thereof as compared with under normal pressure. As a result, it is possible to improve the uniformity in the temperature of the upper surface of the substrate during the etching process using the first processing liquid and improve the uniformity of etching over the entire upper surface of the substrate.Type: ApplicationFiled: January 5, 2017Publication date: April 27, 2017Inventors: Hirofumi MASUHARA, Kenichiro ARAI, Masahiro MIYAGI, Toru ENDO
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Patent number: 9576808Abstract: In a substrate processing apparatus, with an internal space of a chamber brought into a pressurized atmosphere, an etching process is performed by continuously supplying a first processing liquid onto an upper surface of a substrate while rotating the substrate. It is thereby possible to suppress vaporization of the first processing liquid on the substrate and further suppress a decrease in the temperature of the substrate due to the heat of vaporization as it goes from a center portion of the substrate toward a peripheral portion thereof as compared with under normal pressure. As a result, it is possible to improve the uniformity in the temperature of the upper surface of the substrate during the etching process using the first processing liquid and improve the uniformity of etching over the entire upper surface of the substrate.Type: GrantFiled: March 28, 2013Date of Patent: February 21, 2017Assignee: SCREEN HOLDINGS CO., LTD.Inventors: Hirofumi Masuhara, Kenichiro Arai, Masahiro Miyagi, Toru Endo
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Patent number: 9396974Abstract: A substrate processing apparatus includes a substrate holding unit that horizontally holds a substrate in non-contact with a major surface of the substrate, a processing liquid supply unit that supplies a processing liquid to the major surface of the substrate held by the substrate holding unit, and a hydrophilic surface placing unit that places an annular hydrophilic surface along a peripheral portion of the major surface of the substrate held by the substrate holding unit such that the hydrophilic surface comes into contact with a liquid film of the processing liquid held on the major surface of the substrate.Type: GrantFiled: September 26, 2011Date of Patent: July 19, 2016Assignee: SCREEN Holdings Co., Ltd.Inventors: Hiroaki Takahashi, Toru Endo, Masahiro Miyagi, Koji Hashimoto
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Patent number: 9385012Abstract: Scan step (S3) for moving a nozzle with etching liquid discharged therefrom is carried out such that etching liquid application position toward the rotating substrate moves from the edge portion toward the center portion of the principal face of the substrate. Thereafter, center discharging step (S4) for continuing the supply of the etching liquid toward the principal face of the substrate under the condition that the application position is positioned at the center portion of the principal face of the substrate W is conducted. Moving velocity of the liquid application position in the scan step (S3) is determined in accordance with supply condition of the etching liquid toward the substrate under the condition that the liquid application position is positioned at the center portion of the principal face of the substrate.Type: GrantFiled: January 2, 2014Date of Patent: July 5, 2016Assignee: SCREEN Holdings Co., Ltd.Inventors: Tatsuya Fujii, Toru Endo
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Publication number: 20160005592Abstract: In a substrate processing apparatus, with an internal space of a chamber brought into a reduced pressure atmosphere, a first processing liquid is supplied onto an upper surface of a substrate while the substrate is rotated, and the first processing liquid is thereby quickly spread from a center portion toward a peripheral portion on the upper surface of the substrate. It is thereby possible to coat the upper surface of the substrate with the first processing liquid in a shorter time as compared with under normal pressure. Further, by sucking the first processing liquid from the vicinity of an edge of the substrate, it is possible to coat the upper surface of the substrate with the first processing liquid in a still shorter time. As a result, it is possible to shorten the time required for the processing of the substrate.Type: ApplicationFiled: September 15, 2015Publication date: January 7, 2016Inventors: Hirofumi MASUHARA, Kenichiro ARAI, Masahiro MIYAGI, Toru ENDO
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Publication number: 20150059645Abstract: A substrate processing apparatus comprising a substrate holding rotating mechanism, a process liquid supply mechanism having a nozzle for dispensing a process liquid toward a principal face of the substrate, a processing liquid reservoir for holding sufficient process liquid to form a liquid film covering the whole principal face of the substrate, a liquid film forming unit for forming the liquid film by supplying the process liquid onto the principal face of the substrate in a single burst, and a control unit for controlling the liquid film forming unit and the process liquid supply mechanism such that the process liquid is dispensed from the process liquid nozzle toward the principal face of the substrate after formation of the liquid film covering the whole area of the principal face of the substrate by the liquid film forming unit.Type: ApplicationFiled: November 7, 2014Publication date: March 5, 2015Inventors: Masahiro MIYAGI, Koji HASHIMOTO, Toru ENDO
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Patent number: 8883030Abstract: A substrate processing apparatus comprising a substrate holding rotating mechanism, a process liquid supply mechanism having a nozzle for dispensing a process liquid toward a principal face of the substrate, a processing liquid reservoir for holding sufficient process liquid to form a liquid film covering the whole principal face of the substrate, a liquid film forming unit for forming the liquid film by supplying the process liquid onto the principal face of the substrate in a single burst, and a control unit for controlling the liquid film forming unit and the process liquid supply mechanism such that the process liquid is dispensed from the process liquid nozzle toward the principal face of the substrate after formation of the liquid film covering the whole area of the principal face of the substrate by the liquid film forming unit.Type: GrantFiled: August 28, 2012Date of Patent: November 11, 2014Assignee: SCREEN Holdings Co., Ltd.Inventors: Masahiro Miyagi, Koji Hashimoto, Toru Endo
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Publication number: 20140197129Abstract: Scan step (S3) for moving a nozzle with etching liquid discharged therefrom is carried out such that etching liquid application position toward the rotating substrate moves from the edge portion toward the center portion of the principal face of the substrate. Thereafter, center discharging step (S4) for continuing the supply of the etching liquid toward the principal face of the substrate under the condition that the application position is positioned at the center portion of the principal face of the substrate W is conducted. Moving velocity of the liquid application position in the scan step (S3) is determined in accordance with supply condition of the etching liquid toward the substrate under the condition that the liquid application position is positioned at the center portion of the principal face of the substrate.Type: ApplicationFiled: January 2, 2014Publication date: July 17, 2014Applicant: DAINIPPON SCREEN MFG. CO., LTD.Inventors: Tatsuya FUJII, Toru ENDO
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Publication number: 20130260570Abstract: In a substrate processing apparatus, with an internal space of a chamber brought into a pressurized atmosphere, an etching process is performed by continuously supplying a first processing liquid onto an upper surface of a substrate while rotating the substrate. It is thereby possible to suppress vaporization of the first processing liquid on the substrate and further suppress a decrease in the temperature of the substrate due to the heat of vaporization as it goes from a center portion of the substrate toward a peripheral portion thereof as compared with under normal pressure. As a result, it is possible to improve the uniformity in the temperature of the upper surface of the substrate during the etching process using the first processing liquid and improve the uniformity of etching over the entire upper surface of the substrate.Type: ApplicationFiled: March 28, 2013Publication date: October 3, 2013Applicant: DAINIPPON SCREEN MFG. CO., LTDInventors: Hirofumi MASUHARA, Kenichiro ARAI, Masahiro MIYAGI, Toru ENDO
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Publication number: 20130260574Abstract: In a substrate processing apparatus, with an internal space of a chamber brought into a reduced pressure atmosphere, a first processing liquid is supplied onto an upper surface of a substrate while the substrate is rotated, and the first processing liquid is thereby quickly spread from a center portion toward a peripheral portion on the upper surface of the substrate. It is thereby possible to coat the upper surface of the substrate with the first processing liquid in a shorter time as compared with under normal pressure. Further, by sucking the first processing liquid from the vicinity of an edge of the substrate, it is possible to coat the upper surface of the substrate with the first processing liquid in a still shorter time. As a result, it is possible to shorten the time required for the processing of the substrate.Type: ApplicationFiled: March 28, 2013Publication date: October 3, 2013Applicant: DAINIPPON SCREEN MFG. CO., LTDInventors: Hirofumi MASUHARA, Kenichiro ARAI, Masahiro MIYAGI, Toru ENDO
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Publication number: 20130078381Abstract: A substrate processing apparatus comprising a substrate holding rotating mechanism, a process liquid supply mechanism having a nozzle for dispensing a process liquid toward a principal face of the substrate, a processing liquid reservoir for holding sufficient process liquid to form a liquid film covering the whole principal face of the substrate, a liquid film forming unit for forming the liquid film by supplying the process liquid onto the principal face of the substrate in a single burst, and a control unit for controlling the liquid film forming unit and the process liquid supply mechanism such that the process liquid is dispensed from the process liquid nozzle toward the principal face of the substrate after formation of the liquid film covering the whole area of the principal face of the substrate by the liquid film forming unit.Type: ApplicationFiled: August 28, 2012Publication date: March 28, 2013Inventors: Masahiro MIYAGI, Koji HASHIMOTO, Toru ENDO
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Patent number: 8395504Abstract: An IC label for prevention of forgery includes: a label substrate which has an adhesive agent for affixing the same to an object; a non-contact IC medium which is provided on the label substrate and has an IC chip for storing predetermined identification information and an antenna for wireless transmission of the identification information; and a security function portion which is provided on the label substrate and prevents replication.Type: GrantFiled: May 16, 2007Date of Patent: March 12, 2013Assignees: Toppan Printing Co., Ltd., Hitachi, Ltd.Inventors: Kozue Furuichi, Toru Endo, Manabu Suzuki, Hidehiko Kando