Abstract: A method of manufacturing a liquid discharge head substrate is provided. The method includes forming a first substrate that includes a semiconductor element and a first wiring structure; forming a second substrate that includes a liquid discharge element and a second wiring structure; and bonding the first wiring structure and the second wiring structure such that the semiconductor element and the liquid discharge element are electrically connected to each other after the forming the first substrate and the second substrate.

Abstract: A color filter array is provided. The array comprises a first color filter, a second color filter, and a third color filter that are arranged on a base member and respectively have different colors. The first color filter and the third color filter are arranged adjacent to each other, the second color filter includes a portion placed between an end portion of the third color filter and the base member, and the end portion of the third color filter and the portion of the second color filter are in contact with the first color filter.

Abstract: A method of manufacturing a liquid discharge head substrate is provided. The method includes forming a first substrate that includes a semiconductor element and a first wiring structure; forming a second substrate that includes a liquid discharge element and a second wiring structure; and bonding the first wiring structure and the second wiring structure such that the semiconductor element and the liquid discharge element are electrically connected to each other after the forming the first substrate and the second substrate.

Abstract: A method of manufacturing a liquid discharge head substrate is provided. The method includes forming a first substrate that includes a semiconductor element and a first wiring structure; forming a second substrate that includes a liquid discharge element and a second wiring structure; and bonding the first wiring structure and the second wiring structure such that the semiconductor element and the liquid discharge element are electrically connected to each other after the forming the first substrate and the second substrate.

Abstract: An element substrate of a liquid ejection head includes: a base material; an insulating film positioned on the base material; a heating resistance element for generating heat energy for ejecting a liquid; a protective film for covering the heating resistance element; a first electrical wiring layer arranged in the insulating film, for supplying a current to the heating resistance element; a second electrical wiring layer arranged on a layer different from the first electrical wiring layer in the insulating film, for supplying a current to the heating resistance element; and at least one connecting member extending into the insulating film to connect the first electrical wiring layer and the heating resistance element, for causing the current to flow in a first direction, the heating resistance element including a connecting region, extending in a second direction intersecting the first direction, to which the at least one connecting member is connected.

Abstract: A semiconductor device used for a liquid discharge head is provided. The device includes a wiring layer, an insulating member formed above the wiring layer, a heat generation element arranged above and in contact with the insulating member, and electrically connected to the wiring layer, a metal member arranged above and in contact with the insulating member, and electrically connected to the wiring layer, and an electrically conductive member covering an upper surface of the metal member and electrically connected to the wiring layer through the metal member. A resistivity of the electrically conductive member is less than a resistivity of the metal member and a resistivity of the heat generation element. The heat generation element and the metal member are separated from each other.

Abstract: A method of manufacturing a liquid discharge head substrate is provided. The method includes forming a first substrate that includes a semiconductor element and a first wiring structure; forming a second substrate that includes a liquid discharge element and a second wiring structure; and bonding the first wiring structure and the second wiring structure such that the semiconductor element and the liquid discharge element are electrically connected to each other after the forming the first substrate and the second substrate.

Abstract: A semiconductor device used for a liquid discharge head is provided. The device includes a wiring layer, an insulating member formed above the wiring layer, a heat generation element arranged above and in contact with the insulating member, and electrically connected to the wiring layer, a metal member arranged above and in contact with the insulating member, and electrically connected to the wiring layer, and an electrically conductive member covering an upper surface of the metal member and electrically connected to the wiring layer through the metal member. A resistivity of the electrically conductive member is less than a resistivity of the metal member and a resistivity of the heat generation element. The heat generation element and the metal member are separated from each other.

Abstract: An element substrate of a liquid ejection head includes: a base material; an insulating film positioned on the base material; a heating resistance element for generating heat energy for ejecting a liquid; a protective film for covering the heating resistance element; a first electrical wiring layer arranged in the insulating film, for supplying a current to the heating resistance element; a second electrical wiring layer arranged on a layer different from the first electrical wiring layer in the insulating film, for supplying a current to the heating resistance element; and at least one connecting member extending into the insulating film to connect the first electrical wiring layer and the heating resistance element, for causing the current to flow in a first direction, the heating resistance element including a connecting region, extending in a second direction intersecting the first direction, to which the at least one connecting member is connected.

Abstract: A method of manufacturing a liquid discharge head substrate is provided. The method includes forming a liquid discharge element and a protective film that covers the liquid discharge element; and forming a wiring structure that includes a conductive member. Annealing is performed on one of the liquid discharge element and the protective film such that a highest temperature in a thermal history received by one of the liquid discharge element and the protective film during manufacture of the liquid discharge head substrate becomes higher than a highest temperature in a thermal history received by the conductive member during the manufacture of the liquid discharge head substrate.

Abstract: An element substrate of a liquid ejection head includes: a base material; an insulating film positioned on the base material; a heating resistance element for generating heat energy for ejecting a liquid; a protective film for covering the heating resistance element; a first electrical wiring layer arranged in the insulating film, for supplying a current to the heating resistance element; a second electrical wiring layer arranged on a layer different from the first electrical wiring layer in the insulating film, for supplying a current to the heating resistance element; and at least one connecting member extending into the insulating film to connect the first electrical wiring layer and the heating resistance element, for causing the current to flow in a first direction, the heating resistance element including a connecting region, extending in a second direction intersecting the first direction, to which the at least one connecting member is connected.

Abstract: An element substrate of a liquid ejection head includes: a base material; an insulating film positioned on the base material; a heating resistance element for generating heat energy for ejecting a liquid; a protective film for covering the heating resistance element; a first electrical wiring layer arranged in the insulating film, for supplying a current to the heating resistance element; a second electrical wiring layer arranged on a layer different from the first electrical wiring layer in the insulating film, for supplying a current to the heating resistance element; and at least one connecting member extending into the insulating film to connect the first electrical wiring layer and the heating resistance element, for causing the current to flow in a first direction, the heating resistance element including a connecting region, extending in a second direction intersecting the first direction, to which the at least one connecting member is connected.

Abstract: A method for manufacturing a solid-state image pickup device that includes a substrate including a photoelectric conversion unit and a waveguide arranged on the substrate, the waveguide corresponding to the photoelectric conversion unit and including a core and a cladding, includes a first step and a second step, in which in the first step and the second step, a member to be formed into the core is formed in an opening in the cladding by high-density plasma-enhanced chemical vapor deposition, and in which after the first step, in the second step, the member to be formed into the core is formed by the high-density plasma-enhanced chemical vapor deposition under conditions in which the ratio of a radio-frequency power on the back face side of the substrate to a radio-frequency power on the front face side of the substrate is higher than that in the first step.

Abstract: In a method for manufacturing a photoelectric conversion device which includes: a substrate including a photoelectric conversion element; and a light guide which includes an insulator having an opening corresponding to the photoelectric conversion element and containing silicon oxide and a member located in the opening and containing silicon nitride, the method includes: forming a first silicon nitride film which forms the member in the opening by a parallel plate type plasma CVD apparatus; and forming a second silicon nitride film which forms the member in the opening and on the first silicon nitride film by a high density plasma CVD apparatus. In the photoelectric conversion device, the first silicon nitride film has a thickness of 55 nm or more.

Abstract: A method for manufacturing a solid-state image pickup device that includes a substrate including a photoelectric conversion unit and a waveguide arranged on the substrate, the waveguide corresponding to the photoelectric conversion unit and including a core and a cladding, includes a first step and a second step, in which in the first step and the second step, a member to be formed into the core is formed in an opening in the cladding by high-density plasma-enhanced chemical vapor deposition, and in which after the first step, in the second step, the member to be formed into the core is formed by the high-density plasma-enhanced chemical vapor deposition under conditions in which the ratio of a radio-frequency power on the back face side of the substrate to a radio-frequency power on the front face side of the substrate is higher than that in the first step.

Abstract: A data recording and/or reproducing apparatus having actuating buttons or adjustment volumes which enable a wide variety of processing operations despite a limited operating space, and which is able to display levels of plural audio data or to display various other data on a limited display area without detracting from viewability. To this end, the apparatus recording and/or reproducing includes a unit for recording and/or reproducing data for a non-linear accessible recording medium, at least one input port and at least one output port. The input port and the output port time-divisionally access the recording and/or reproducing unit to process the data inputted to the input port to output the processed data to the recording and/or reproducing a unit. The data reproduced from the recording and/or reproducing unit is processed by and outputted from the output port.

Abstract: A data recording and/or reproducing apparatus having actuating buttons or adjustment volumes which enable a wide variety of processing operations despite a limited operating space, and which is able to display levels of plural audio data or to display various other data on a limited display area without detracting from viewability. To this end, the apparatus recording and/or reproducing includes a unit for recording and/or reproducing data for a non-linear accessible recording medium, at least one input port and at least one output port. The input port and the output port time-divisionally access the recording and/or reproducing unit to process the data inputted to the input port to output the processed data to the recording and/or reproducing a unit. The data reproduced from the recording and/or reproducing unit is processed by and outputted from the output port.

Abstract: A data recording and/or reproducing apparatus includes a unit for recording and/or reproducing data for a non-linear accessible recording medium, at least one input port and at least one output port. The input port and the output port time-divisionally access the recording and/or reproducing unit to process the data inputted to the input port to output the processed data to the recording and/or reproducing a unit. The data reproduced from the recording and/or reproducing unit is processed by and outputted from the output port. The apparatus also includes a port actuation button for selecting the input and output ports, an actuation selection button for selecting recording or playback for the input port or the output port as selected by the port actuation button, and a controller for performing control so that the recording operation or the playback operation as selected by the actuation selection button will be executed by the input port or the output port as selected by the port actuation button.

Abstract: In an image encoder and an image decoder of an image transmission system, enabling the deterioration of decoded images in image quality to be avoided, the color frame information DCF in separating a predetermined video signal into a luminance component and a color component (chroma component) is extracted prior to the compressive encoding processing of a video signal SSDI1, added after the compressive encoding processing and delivered to transmission means 18A, and moreover the color frame information is extracted prior to the decoding processing of the compressed video signal SSDDI1 obtained from the transmission means 18A and is added after the decoding processing, thereby enabling data on color frame information DCF to be added to the decoded video signal SSDI1 after the decoding processing as they remain invariant free from deformation (loss) and delivered to the transmission means.

Abstract: Reproduction instruction and inherent address information from a control unit 3 are sent to drive units 1, 2. Thus, compressed video signals every groups of pictures to which inherent address information are respectively added are outputted from the drive units 1, 2. They are edited after undergone switching at a switch circuit 4. The edited compressed video signals are transmitted to a decoding unit 5. This decoding unit 5 detects, by using inherent address information, the editing point of the video signals which have been edited after undergone switching to carry out decoding processing thereof to output a video signal, thereby making it possible to obtain a video signal of satisfactory picture quality without outputting noise at the editing point.