Patents by Inventor Toru Hirano
Toru Hirano has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 12165842Abstract: A control method of a plasma processing apparatus including a first electrode that places a workpiece thereon includes supplying a bias power to the first electrode, and supplying a source power having a frequency higher than that of the bias power into a plasma processing space. The source power has a first state and a second state. The control method further includes a first control process of alternately applying the first state and the second state of the source power in synchronization with a signal synchronized with a cycle of a radio frequency of the bias power, or a phase within one cycle of a reference electrical state that represents any one of a voltage, current, and electromagnetic field measured in a power feeding system of the bias power.Type: GrantFiled: July 31, 2023Date of Patent: December 10, 2024Assignee: TOKYO ELECTRON LIMITEDInventors: Chishio Koshimizu, Taichi Hirano, Toru Hayasaka, Shinji Kubota, Koji Maruyama, Takashi Dokan
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Patent number: 11985452Abstract: A color conversion element includes: a substrate; a phosphor portion that is disposed above the substrate, receives laser light transmitted from an outside, and emits light in a color different from a color of the laser light; a reflective layer that includes a dielectric multilayer film and is disposed on a principal surface of the phosphor portion facing the substrate; and a joining portion interposed between the reflective layer and the substrate to join the reflective layer and the substrate. The joining portion includes an air layer that exposes the reflective layer in a position where the air layer at least partially overlaps an irradiation region in a plan view, the irradiation region being a region irradiated with the laser light on the phosphor portion.Type: GrantFiled: July 23, 2019Date of Patent: May 14, 2024Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.Inventors: Takanori Aketa, Yosuke Honda, Takashi Kishida, Toru Hirano
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Publication number: 20240128413Abstract: Provided is a wavelength converter including a phosphor ceramic containing a first phosphor that emits fluorescence due to a parity-forbidden transition, and a phosphor part containing a second phosphor that emits fluorescence due to a parity-allowed transition. A main surface of the phosphor ceramic has a concave and convex structure including a plurality of convex parts and a plurality of concave parts. The phosphor part is arranged inside the plurality of concave parts in the phosphor ceramic. Also provided is a light emitting device including the wavelength converter, and a solid-state light source that emits light with which the wavelength converter is irradiated and which has a light emission peak within a wavelength range of 400 nm or more and less than 500 nm.Type: ApplicationFiled: February 1, 2022Publication date: April 18, 2024Applicant: Panasonic Intellectual Property Management Co., Ltd.Inventors: Mitsuru NITTA, Ryosuke SHIGITANI, Emi MIYAZAKI, Toru HIRANO
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Publication number: 20220099863Abstract: A color conversion element includes: a substrate; a fluorescent part which is arranged above the substrate, receives laser light from an outside, and emits light of a color different from a color of the laser light; a first flattening layer which is superposed on a first main surface of the fluorescent part opposite to the substrate; a second flattening layer which is superposed on a second main surface of the fluorescent part facing the substrate; a reflective layer which is superposed on a main surface of the second flattening layer facing the substrate and formed of a dielectric multilayer film; and a joint part which lies between the reflective layer and the substrate and joins together the reflective layer and the substrate.Type: ApplicationFiled: January 10, 2020Publication date: March 31, 2022Applicant: Panasonic Intellectual Property Management Co., Ltd.Inventors: Toru HIRANO, Tsuyoshi MORIZUMI, Yosuke MIZOKAMI, Toshihiko SATO
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Publication number: 20210344883Abstract: A color conversion element includes: a substrate; a phosphor portion that is disposed above the substrate, receives laser light transmitted from an outside, and emits light in a color different from a color of the laser light; a reflective layer that includes a dielectric multilayer film and is disposed on a principal surface of the phosphor portion facing the substrate; and a joining portion interposed between the reflective layer and the substrate to join the reflective layer and the substrate. The joining portion includes an air layer that exposes the reflective layer in a position where the air layer at least partially overlaps an irradiation region in a plan view, the irradiation region being a region irradiated with the laser light on the phosphor portion.Type: ApplicationFiled: July 23, 2019Publication date: November 4, 2021Applicant: Panasonic Intellectual Property Management Co., Ltd.Inventors: Takanori AKETA, Yosuke HONDA, Takashi KISHIDA, Toru HIRANO
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Patent number: 10535807Abstract: Light emitting device includes structure protruding from a side of a surface of second conductive semiconductor layer of LED chip toward a side of a surface of second conductor portion of mounting substrate to contact the surface of second conductor portion, and is positioned to extend around an outer periphery of second electrode. First electrode and a first conductor portion are joined to each other by first joint portion, and second joint portion joining second electrode and second conductor portion to each other fills a space surrounded by second electrode, protruding structure, and second conductor portion. Protruding structure is disposed to extend around the outer periphery of second electrode to surround second joint portion in planar view. A part of mounting substrate overlapping protruding structure in planar view is either identical in height to or lower than a part of second conductor portion joined to second joint portion.Type: GrantFiled: May 8, 2018Date of Patent: January 14, 2020Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.Inventors: Takanori Aketa, Mitsuhiko Ueda, Toru Hirano
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Publication number: 20190294032Abstract: A color conversion element includes: a substrate, a phosphor layer disposed above one principal surface of the substrate, and a joining portion interposed between the substrate and the phosphor layer for joining the substrate and the phosphor layer using metal. The phosphor layer includes individual pieces that are sheet-shaped and planarly arranged. The individual pieces each include at least one type of phosphor. Also, the joining portion has a porous structure obtained by sintering metal nanoparticles.Type: ApplicationFiled: June 16, 2017Publication date: September 26, 2019Inventors: Toru HIRANO, Takanori AKETA, Koki OISHI
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Patent number: 10226229Abstract: To provide an ultrasound diagnosis apparatus capable of appropriately assigning a transmission delay time of a group to a transducer without complicated wires. The ultrasound diagnosis apparatus of the embodiment comprises a plurality of transducers, a timing pulse generator, a switch part, and a switch controller. Ultrasound waves are transmitted to the transducers. The timing pulse generator has output terminals for outputting timing pulses based on a delay time to a channel corresponding to each of the transducers, in which a plurality of output terminals are divided into groups and each group has the output terminals of a specific number greater than two. The timing pulse generator then generates the transmission delay time within a predetermined time range for the each group. The switch part selectively connects the channels with the output terminals.Type: GrantFiled: August 10, 2012Date of Patent: March 12, 2019Assignee: Toshiba Medical Systems CorporationInventors: Hironobu Hongou, Yasuo Miyajima, Nobuyuki Iwama, Isao Uchiumi, Masaaki Ishitsuka, Toru Hirano
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Publication number: 20190069880Abstract: An ultrasound probe includes: a plurality of transducer elements each configured to perform at least one selected from between transmission of an ultrasound wave and reception of an ultrasound wave; first circuitry that is arranged on a rear face side of the transducer elements, is provided with electronic circuitry corresponding to two or more of the transducer elements organized in a first group, and is provided with a through silicon via corresponding to two or more of the transducer elements organized in a second group; and second circuitry that is arranged on a rear face side of the first circuitry, is provided with a through silicon via corresponding to the two or more of the transducer elements organized in the first group, and is provided with electronic circuitry corresponding to the two or more of the transducer elements organized in the second group.Type: ApplicationFiled: August 31, 2018Publication date: March 7, 2019Applicant: Canon Medical Systems CorporationInventors: Toshiyuki NAGASE, Masaaki ISHITSUKA, Toru HIRANO
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Patent number: 10130336Abstract: An ultrasound probe and ultrasonic diagnosis apparatus that can maintain surface temperature of an ultrasound probe within a safe range, without reduction in performance. The ultrasound probe includes a casing, a transducer, an electronic circuit, and a heat-transfer construction. Elements of the transducer are aligned at one end of the casing and send out ultrasound waves in accordance with their respective delay times. The electronic circuit, disposed in the casing, includes a delay circuit setting delay times and pulsers for generating pulses in accordance with the delay times, the pulses being sent to the transducer. While the electronic circuit is being energized, the heat-transfer construction disposes a member having a low heat conductivity at least either between the electronic circuit and the casing or between the electronic circuit and the transducer. Thereby, heat from the electronic circuit is conducted to the other end of the casing.Type: GrantFiled: August 21, 2012Date of Patent: November 20, 2018Assignee: Toshiba Medical Systems CorporationInventors: Yasuo Miyajima, Hironobu Hongou, Toru Hirano, Isao Uchiumi, Nobuyuki Iwama, Masaaki Ishitsuka
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Patent number: 10123765Abstract: The present embodiment relates to an ultrasound probe having a first ultrasound vibrator group and a second ultrasound vibrator group, comprising a plurality of matrix switches and an adder. The ultrasound probe has a mode to send ultrasound to a predetermined observation point within a subject by the first ultrasound vibrator group, and to receive ultrasound echoes reflected within the subject by the second ultrasound vibrator group. The plurality of matrix switches extract, based on the distance between the second ultrasound vibrator group and the observation point, a plurality of ultrasound echoes having substantially the same phase from a plurality of ultrasound echoes output by the second ultrasound vibrator group. The adder adds the plurality of ultrasound echoes extracted by the plurality of matrix switches for each of the matrix switches and outputs them.Type: GrantFiled: December 23, 2010Date of Patent: November 13, 2018Assignee: TOSHIBA MEDICAL SYSTEMS CORPORATIONInventors: Hironobu Hongou, Toru Hirano, Isao Uchiumi, Masaaki Ishitsuka, Takayuki Shiina
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Publication number: 20180254398Abstract: Light emitting device includes structure protruding from a side of a surface of second conductive semiconductor layer of LED chip toward a side of a surface of second conductor portion of mounting substrate to contact the surface of second conductor portion, and is positioned to extend around an outer periphery of second electrode. First electrode and a first conductor portion are joined to each other by first joint portion, and second joint portion joining second electrode and second conductor portion to each other fills a space surrounded by second electrode, protruding structure, and second conductor portion. Protruding structure is disposed to extend around the outer periphery of second electrode to surround second joint portion in planar view. A part of mounting substrate overlapping protruding structure in planar view is either identical in height to or lower than a part of second conductor portion joined to second joint portion.Type: ApplicationFiled: May 8, 2018Publication date: September 6, 2018Applicant: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.Inventors: Takanori AKETA, Mitsuhiko UEDA, Toru HIRANO
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Patent number: 10062820Abstract: An interposer includes element mounting sections and terminal sections directly and partly formed on a surface of an aluminum film having the predetermined pattern. Each of the element mounting sections and the terminal sections has a laminated structure of an Ni film, an Pd film and an Au film. The interposer is formed with an AuSn layer on a predetermined region of a surface of each Au film in the element mounting sections. The interposer includes a protective film having optical permeability that directly covers a region of the surface of the aluminum film, which is out of contact with the element mounting sections and the terminal sections.Type: GrantFiled: April 26, 2016Date of Patent: August 28, 2018Assignee: Panasonic Intellectual Property Management Co., Ltd.Inventors: Mituhiko Ueda, Makoto Saito, Takanori Aketa, Toru Hirano
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Publication number: 20180166617Abstract: An interposer includes element mounting sections and terminal sections directly and partly formed on a surface of an aluminum film having the predetermined pattern. Each of the element mounting sections and the terminal sections has a laminated structure of an Ni film, an Pd film and an Au film. The interposer is formed with an AuSn layer on a predetermined region of a surface of each Au film in the element mounting sections. The interposer includes a protective film having optical permeability that directly covers a region of the surface of the aluminum film, which is out of contact with the element mounting sections and the terminal sections.Type: ApplicationFiled: April 26, 2016Publication date: June 14, 2018Inventors: Mituhiko UEDA, Makoto SAITO, Takanori AKETA, Toru HIRANO
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Patent number: 9997685Abstract: Light emitting device includes structure protruding from a side of a surface of second conductive semiconductor layer of LED chip toward a side of a surface of second conductor portion of mounting substrate to contact the surface of second conductor portion, and is positioned to extend around an outer periphery of second electrode. First electrode and a first conductor portion are joined to each other by first joint portion, and second joint portion joining second electrode and second conductor portion to each other fills a space surrounded by second electrode, protruding structure, and second conductor portion. Protruding structure is disposed to extend around the outer periphery of second electrode to surround second joint portion in planar view. A part of mounting substrate overlapping protruding structure in planar view is either identical in height to or lower than a part of second conductor portion joined to second joint portion.Type: GrantFiled: September 3, 2014Date of Patent: June 12, 2018Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.Inventors: Takanori Aketa, Mitsuhiko Ueda, Toru Hirano
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Patent number: 9685594Abstract: An LED module includes a submount having a face in a thickness direction thereof, an LED chip bonded to the face of the submount with a first bond, and a patterned wiring circuit electrically connected to the LED chip. The first bond transmits light emitted from the LED chip. The submount is a light-transmissive member having light diffusing properties, and a planar size larger than a planar size of the LED chip. The patterned wiring circuit is provided on the face of the submount so as not to overlap the LED chip. The submount is constituted by a plurality of light-transmissive layers which are stacked in the thickness direction and have different optical properties so that a light-transmissive layer of the plurality of light-transmissive layers which is farther from the LED chip is higher in reflectance in a wavelength range of the light emitted from the LED chip.Type: GrantFiled: May 24, 2013Date of Patent: June 20, 2017Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.Inventors: Yoji Urano, Kenichiro Tanaka, Akifumi Nakamura, Toru Hirano, Hideaki Hyuga, Masanori Suzuki, Teruhisa Yokota
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Patent number: 9680075Abstract: A light-emitting device in accordance with the present invention includes a mounting substrate; an LED chip bonded to a surface of the mounting substrate with a bond; and an encapsulating portion covering the LED chip. The bond transmits light from the LED chip. The mounting substrate includes: a light-transmissive member having a planar size larger than that of the LED chip; and first and second penetrating wirings which penetrate the light-transmissive member in the thickness direction thereof and are electrically connected to first and second electrodes of the LED chip via first and second wires, respectively. The light-transmissive member includes at least two light-transmissive layers with different optical properties which are stacked in the thickness direction. A light-transmissive layer of the light-transmissive layers which is farther from the LED chip is higher in reflectance to the light.Type: GrantFiled: August 30, 2013Date of Patent: June 13, 2017Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.Inventors: Yoji Urano, Akifumi Nakamura, Hayato Ioka, Toru Hirano, Masanori Suzuki, Hideaki Hyuga, Ryoji Imai, Jun Goda
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Patent number: 9598659Abstract: The present invention provides a hydraulic oil composition comprising: a lubricating base oil having a kinematic viscosity at 40° C. of 15 to 50 mm2/s; and 1 to 40% by mass, based on a total amount of the hydraulic oil composition, of a polymethacrylate having a number-average molecular weight of 48000 or lower, the hydraulic oil composition having a viscosity index of 150 or higher, and a ratio (A/B) at 60 to 80° C. of (A) a kinematic viscosity (unit: mm2/s) to (B) a shear viscosity (unit: mPa·s, shear condition: 106/s) of 1.3 or lower.Type: GrantFiled: March 25, 2014Date of Patent: March 21, 2017Assignee: JX NIPPON OIL & ENERGY CORPORATIONInventors: Kazuhiro Yagishita, Toru Hirano, Tadashi Oshio
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Patent number: 9437581Abstract: The LED module includes: a light diffusing substrate having light transmissive properties; an LED chip bonded to a first surface of the light diffusing substrate with a transparent first bond in between; a color converter facing the first surface to cover the LED chip; and a mounting substrate. The color converter is made of transparent material containing phosphor which, when excited by light emitted from the LED chip, emits light having a different color from the LED chip. The mounting substrate includes a diffuse reflection layer diffusely reflecting light emitted from the LED chip and light emitted from the phosphor. The diffuse reflection layer is placed facing a second surface of the light diffusing substrate.Type: GrantFiled: May 24, 2013Date of Patent: September 6, 2016Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.Inventors: Yoji Urano, Akifumi Nakamura, Hayato Ioka, Ryoji Imai, Jun Goda, Toru Hirano, Masanori Suzuki, Hideaki Hyuga
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Publication number: 20160218262Abstract: Light emitting device includes structure protruding from a side of a surface of second conductive semiconductor layer of LED chip toward a side of a surface of second conductor portion of mounting substrate to contact the surface of second conductor portion, and is positioned to extend around an outer periphery of second electrode. First electrode and a first conductor portion are joined to each other by first joint portion, and second joint portion joining second electrode and second conductor portion to each other fills a space surrounded by second electrode, protruding structure, and second conductor portion. Protruding structure is disposed to extend around the outer periphery of second electrode to surround second joint portion in planar view. A part of mounting substrate overlapping protruding structure in planar view is either identical in height to or lower than a part of second conductor portion joined to second joint portion.Type: ApplicationFiled: September 3, 2014Publication date: July 28, 2016Applicant: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LT D.Inventors: Takanori AKETA, Mitsuhiko UEDA, Toru HIRANO