Abstract: A method for manufacturing a semiconductor device in which probes and the layout of the electrode pads of a test element group (TEG) are associated is provided. As a semiconductor device is miniaturized, a scribe area on a wafer also tends to decrease. Accordingly, it is necessary to reduce the size of a TEG arranged in the scribe area, and efficiently arrange an electrode pad for probe contact. Thus, it is necessary to associate the probes and the layout of the electrode pad. According to the method, a layout of a TEG electrode pad corresponding to a plurality of probes arranged in a fan shape or probes manufactured by Micro Electro Mechanical Systems (MEMS) technology is provided.

Abstract: Provided is a wavelength converter including a phosphor ceramic containing a first phosphor that emits fluorescence due to a parity-forbidden transition, and a phosphor part containing a second phosphor that emits fluorescence due to a parity-allowed transition. A main surface of the phosphor ceramic has a concave and convex structure including a plurality of convex parts and a plurality of concave parts. The phosphor part is arranged inside the plurality of concave parts in the phosphor ceramic. Also provided is a light emitting device including the wavelength converter, and a solid-state light source that emits light with which the wavelength converter is irradiated and which has a light emission peak within a wavelength range of 400 nm or more and less than 500 nm.

Abstract: A motion state monitoring system, a training support system, a motion state monitoring method, and a program capable of suitably managing measurement results according to an attaching direction of a sensor are provided. A motion state monitoring system according to the present disclosure monitors a motion state of a target part of a subject's body. The motion state monitoring system includes an acquisition unit, an attaching direction detection unit, and a control processing unit. The acquisition unit acquires sensing information of a sensor attached to the target part. The attaching direction detection unit detects an attaching direction of the sensor. The control processing unit outputs information related to the sensing information in association with the attaching direction.

Abstract: A remote control manipulator system includes: a manipulator being controlled by an operator remotely to handle an object; a stereoscopic display device that displays a right-eye image and a left-eye image so as to be stereoscopically viewed; a model image generator that generates a model image being an image of an integrated three-dimensional model viewed from a viewpoint designated by the operator, the integrated three-dimensional model being a three-dimensional model obtained by integrating the manipulator model and a surrounding environment model being generated by performing image processing on the right-eye image and the left-eye image and being a three-dimensional model of the object and a surrounding environment thereof; and a model image display device that displays the model image and is configured to be able to be viewed by the operator switching between the stereoscopic display device and the model image display device through moving the head of the operator.

Abstract: A color conversion element includes: a substrate; a fluorescent part which is arranged above the substrate, receives laser light from an outside, and emits light of a color different from a color of the laser light; a first flattening layer which is superposed on a first main surface of the fluorescent part opposite to the substrate; a second flattening layer which is superposed on a second main surface of the fluorescent part facing the substrate; a reflective layer which is superposed on a main surface of the second flattening layer facing the substrate and formed of a dielectric multilayer film; and a joint part which lies between the reflective layer and the substrate and joins together the reflective layer and the substrate.

Abstract: A color conversion element includes: a substrate; a phosphor portion that is disposed above the substrate, receives laser light transmitted from an outside, and emits light in a color different from a color of the laser light; a reflective layer that includes a dielectric multilayer film and is disposed on a principal surface of the phosphor portion facing the substrate; and a joining portion interposed between the reflective layer and the substrate to join the reflective layer and the substrate. The joining portion includes an air layer that exposes the reflective layer in a position where the air layer at least partially overlaps an irradiation region in a plan view, the irradiation region being a region irradiated with the laser light on the phosphor portion.

Abstract: Light emitting device includes structure protruding from a side of a surface of second conductive semiconductor layer of LED chip toward a side of a surface of second conductor portion of mounting substrate to contact the surface of second conductor portion, and is positioned to extend around an outer periphery of second electrode. First electrode and a first conductor portion are joined to each other by first joint portion, and second joint portion joining second electrode and second conductor portion to each other fills a space surrounded by second electrode, protruding structure, and second conductor portion. Protruding structure is disposed to extend around the outer periphery of second electrode to surround second joint portion in planar view. A part of mounting substrate overlapping protruding structure in planar view is either identical in height to or lower than a part of second conductor portion joined to second joint portion.

Abstract: A color conversion element includes: a substrate, a phosphor layer disposed above one principal surface of the substrate, and a joining portion interposed between the substrate and the phosphor layer for joining the substrate and the phosphor layer using metal. The phosphor layer includes individual pieces that are sheet-shaped and planarly arranged. The individual pieces each include at least one type of phosphor. Also, the joining portion has a porous structure obtained by sintering metal nanoparticles.

Abstract: To provide an ultrasound diagnosis apparatus capable of appropriately assigning a transmission delay time of a group to a transducer without complicated wires. The ultrasound diagnosis apparatus of the embodiment comprises a plurality of transducers, a timing pulse generator, a switch part, and a switch controller. Ultrasound waves are transmitted to the transducers. The timing pulse generator has output terminals for outputting timing pulses based on a delay time to a channel corresponding to each of the transducers, in which a plurality of output terminals are divided into groups and each group has the output terminals of a specific number greater than two. The timing pulse generator then generates the transmission delay time within a predetermined time range for the each group. The switch part selectively connects the channels with the output terminals.

Abstract: An ultrasound probe includes: a plurality of transducer elements each configured to perform at least one selected from between transmission of an ultrasound wave and reception of an ultrasound wave; first circuitry that is arranged on a rear face side of the transducer elements, is provided with electronic circuitry corresponding to two or more of the transducer elements organized in a first group, and is provided with a through silicon via corresponding to two or more of the transducer elements organized in a second group; and second circuitry that is arranged on a rear face side of the first circuitry, is provided with a through silicon via corresponding to the two or more of the transducer elements organized in the first group, and is provided with electronic circuitry corresponding to the two or more of the transducer elements organized in the second group.

Abstract: An ultrasound probe and ultrasonic diagnosis apparatus that can maintain surface temperature of an ultrasound probe within a safe range, without reduction in performance. The ultrasound probe includes a casing, a transducer, an electronic circuit, and a heat-transfer construction. Elements of the transducer are aligned at one end of the casing and send out ultrasound waves in accordance with their respective delay times. The electronic circuit, disposed in the casing, includes a delay circuit setting delay times and pulsers for generating pulses in accordance with the delay times, the pulses being sent to the transducer. While the electronic circuit is being energized, the heat-transfer construction disposes a member having a low heat conductivity at least either between the electronic circuit and the casing or between the electronic circuit and the transducer. Thereby, heat from the electronic circuit is conducted to the other end of the casing.

Abstract: The present embodiment relates to an ultrasound probe having a first ultrasound vibrator group and a second ultrasound vibrator group, comprising a plurality of matrix switches and an adder. The ultrasound probe has a mode to send ultrasound to a predetermined observation point within a subject by the first ultrasound vibrator group, and to receive ultrasound echoes reflected within the subject by the second ultrasound vibrator group. The plurality of matrix switches extract, based on the distance between the second ultrasound vibrator group and the observation point, a plurality of ultrasound echoes having substantially the same phase from a plurality of ultrasound echoes output by the second ultrasound vibrator group. The adder adds the plurality of ultrasound echoes extracted by the plurality of matrix switches for each of the matrix switches and outputs them.

Abstract: Light emitting device includes structure protruding from a side of a surface of second conductive semiconductor layer of LED chip toward a side of a surface of second conductor portion of mounting substrate to contact the surface of second conductor portion, and is positioned to extend around an outer periphery of second electrode. First electrode and a first conductor portion are joined to each other by first joint portion, and second joint portion joining second electrode and second conductor portion to each other fills a space surrounded by second electrode, protruding structure, and second conductor portion. Protruding structure is disposed to extend around the outer periphery of second electrode to surround second joint portion in planar view. A part of mounting substrate overlapping protruding structure in planar view is either identical in height to or lower than a part of second conductor portion joined to second joint portion.

Abstract: An interposer includes element mounting sections and terminal sections directly and partly formed on a surface of an aluminum film having the predetermined pattern. Each of the element mounting sections and the terminal sections has a laminated structure of an Ni film, an Pd film and an Au film. The interposer is formed with an AuSn layer on a predetermined region of a surface of each Au film in the element mounting sections. The interposer includes a protective film having optical permeability that directly covers a region of the surface of the aluminum film, which is out of contact with the element mounting sections and the terminal sections.

Abstract: An interposer includes element mounting sections and terminal sections directly and partly formed on a surface of an aluminum film having the predetermined pattern. Each of the element mounting sections and the terminal sections has a laminated structure of an Ni film, an Pd film and an Au film. The interposer is formed with an AuSn layer on a predetermined region of a surface of each Au film in the element mounting sections. The interposer includes a protective film having optical permeability that directly covers a region of the surface of the aluminum film, which is out of contact with the element mounting sections and the terminal sections.

Abstract: Light emitting device includes structure protruding from a side of a surface of second conductive semiconductor layer of LED chip toward a side of a surface of second conductor portion of mounting substrate to contact the surface of second conductor portion, and is positioned to extend around an outer periphery of second electrode. First electrode and a first conductor portion are joined to each other by first joint portion, and second joint portion joining second electrode and second conductor portion to each other fills a space surrounded by second electrode, protruding structure, and second conductor portion. Protruding structure is disposed to extend around the outer periphery of second electrode to surround second joint portion in planar view. A part of mounting substrate overlapping protruding structure in planar view is either identical in height to or lower than a part of second conductor portion joined to second joint portion.

Abstract: An LED module includes a submount having a face in a thickness direction thereof, an LED chip bonded to the face of the submount with a first bond, and a patterned wiring circuit electrically connected to the LED chip. The first bond transmits light emitted from the LED chip. The submount is a light-transmissive member having light diffusing properties, and a planar size larger than a planar size of the LED chip. The patterned wiring circuit is provided on the face of the submount so as not to overlap the LED chip. The submount is constituted by a plurality of light-transmissive layers which are stacked in the thickness direction and have different optical properties so that a light-transmissive layer of the plurality of light-transmissive layers which is farther from the LED chip is higher in reflectance in a wavelength range of the light emitted from the LED chip.

Abstract: A light-emitting device in accordance with the present invention includes a mounting substrate; an LED chip bonded to a surface of the mounting substrate with a bond; and an encapsulating portion covering the LED chip. The bond transmits light from the LED chip. The mounting substrate includes: a light-transmissive member having a planar size larger than that of the LED chip; and first and second penetrating wirings which penetrate the light-transmissive member in the thickness direction thereof and are electrically connected to first and second electrodes of the LED chip via first and second wires, respectively. The light-transmissive member includes at least two light-transmissive layers with different optical properties which are stacked in the thickness direction. A light-transmissive layer of the light-transmissive layers which is farther from the LED chip is higher in reflectance to the light.

Abstract: The present invention provides a hydraulic oil composition comprising: a lubricating base oil having a kinematic viscosity at 40° C. of 15 to 50 mm2/s; and 1 to 40% by mass, based on a total amount of the hydraulic oil composition, of a polymethacrylate having a number-average molecular weight of 48000 or lower, the hydraulic oil composition having a viscosity index of 150 or higher, and a ratio (A/B) at 60 to 80° C. of (A) a kinematic viscosity (unit: mm2/s) to (B) a shear viscosity (unit: mPa·s, shear condition: 106/s) of 1.3 or lower.

Abstract: The LED module includes: a light diffusing substrate having light transmissive properties; an LED chip bonded to a first surface of the light diffusing substrate with a transparent first bond in between; a color converter facing the first surface to cover the LED chip; and a mounting substrate. The color converter is made of transparent material containing phosphor which, when excited by light emitted from the LED chip, emits light having a different color from the LED chip. The mounting substrate includes a diffuse reflection layer diffusely reflecting light emitted from the LED chip and light emitted from the phosphor. The diffuse reflection layer is placed facing a second surface of the light diffusing substrate.