Abstract: The object of the present invention is to provide a pretreating agent for electroless plating that is stable and soluble in organic solvents, a method of electroless plating with excellent adhesiveness using it and an electroless plated product. An object to be plated is pre-treated using a pretreating agent for electroless plating comprising a noble metal soap of a fatty acid having 5 to 25 carbon atoms or preferably using a pretreating agent for electroless plating additionally comprising an imidazole silane coupling agent or other silane coupling agent having metal capturing ability, and then electroless plated. The noble metal soap is preferably a palladium soap.

Abstract: A method of processing a substrate is described. A coupling agent and a metal ion solution are applied to the substrate. An activating solution is applied to activate metal ions of the metal ion solution to create a metal film out of the ions. Atoms of the metal film are used to catalyze a metal of a base metal solution to form a metal layer. The metal layer can be used as a seed layer for electroplating purposes.

Abstract: Provided is iron-based metal powder for powder metallurgy including a metallic soap containing at least one or more types selected from a group of Ag, Au, Bi, Co, Cu, Mo, Ni, Pd, Pt, Sn, Te and W having a higher standard oxidization potential than iron, and an iron sintered body having a rust prevention function, wherein at least one or more types of metallic soap selected from a group of Ag, Au, Bi, Co, Cu, Mo, Ni, Pd, Pt, Sn, Te and W having a higher standard oxidization potential than iron is added to iron-based metal powder for powder metallurgy, and sintering is performed thereto. As a result, obtained is mixed powder for powder metallurgy capable of improving the rust prevention effect easily without having to hardly change the conventional processes.

Abstract: Provided are an electroless plating pretreatment liquid used in a copper-clad laminate for a flexible substrate whose initial adhesive force between the substrate material and copper plating layer in an ordinary state as well as the adhesive force in a peel test after aging (in the atmosphere at 150° C. for 168 hours) are at least 0.4 kgf/cm, and a copper-clad laminate for a flexible substrate produced using same. The electroless plating pretreatment agent used in a substrate material of a copper-clad laminate for a flexible substrate comprising a thermoset resin and a silane coupling agent having a metal capturing capability. The copper-clad laminate for a flexible substrate wherein a substrate material is treated with the electroless plating pretreatment agent, a copper plating layer is then formed by electroless plating, and a copper plating layer is formed thereon by electroplating.

Abstract: Provided is iron-based metal powder for powder metallurgy including a metallic soap containing at least one or more types of metal selected from a group of Ag, Au, Bi, Co, Cu, Mo, Ni, Pd, Pt, Sn and Te having a higher standard oxidization potential than iron, and an additional metal which forms a liquid phase at a temperature of 1200° C. or less in the combination with the metal, wherein the soap contains metal for forming an alloy phase between the two. As a result, obtained is mixed powder for powder metallurgy capable of improving the rust prevention effect easily without having to hardly change the conventional processes.

Abstract: An object is to provide an inkjet ink composition to uniformly form a wiring pattern having excellent adhesion on a substrate, and to provide a method to form a wiring pattern by using this ink composition. This ink composition is an inkjet ink composition for drawing a wiring pattern on a substrate, the ink composition comprising an azole-based silane coupling agent as coupling agent for an activator.

Abstract: Provided is metallic powder for powder metallurgy having iron as its principal component and containing indium soap, or metallic powder for powder metallurgy further comprising at least one type selected among bismuth soap, nickel soap, cobalt soap, copper soap, manganese soap and aluminum soap in such indium soap. Thereby obtained is metallic powder for powder metallurgy capable of easily improving the rustproof effect without having to hardly change the conventional process.

Abstract: An object is to provide an electroless copper plating solution that realizes uniform plating at lower temperatures, when the electroless copper plating is performed on a semiconductor wafer or other such mirror surface on which a plating reaction hardly occurs. An electroless copper plating solution, wherein, along with a first reducing agent, hypophosphorous acid or a hypophosphite is used as a second reducing agent, and a stabilizer to inhibit copper deposition is further used at the same time. Examples of the first reducing agent include formalin and glyoxylic acid, while examples of the hypophosphite include sodium hypophosphite, potassium hypophosphite, and ammonium hypophosphite. Examples of the stabilizer to inhibit copper deposition include 2,2?-bipyridyl, imidazole, nicotinic acid, thiourea, 2-mercaptobenzothiazole, sodium cyanide, and thioglycolic acid.

Abstract: To provide an electroless copper plating solution that is favorable to improve the adhesion of a plating film, and an electroless copper plating solution which realizes uniform plating at a low temperature. This electroless copper plating solution is characterized by containing a water-soluble nitrogen-containing polymer in an electroless copper plating solution, and preferably the above-mentioned electroless copper plating solution contains glyoxylic acid and phosphinic acid as reducing agents. The water-soluble nitrogen-containing polymer is preferably a polyacrylamide or a polyethyleneimine, and preferably its weight average molecular weight (Mw) is at least 100,000, and Mw/Mn is 10.0 or less.

Abstract: It is an object of the present invention to provide a semiconductor wafer on which a thin, smooth, uniform and good adhesive electroless plating layer that can be suitable for a seed layer is formed, and to provide an electroless plating method which is suitable for use in the manufacture of such a semiconductor wafer. A semiconductor wafer is coated with a silane coupling agent which has a functional group that is able to capture a metal, and is further coated with an organic-solvent solution of a palladium compound such as palladium chloride or the like. Afterward, the wafer is electroless plated. As a result of such an electroless plating method, a semiconductor wafer having a thickness of 70 to 5000 angstroms and a mean surface roughness Ra of 10 to 100 angstroms can be obtained.

Abstract: It is an object to provide a method for metal plating with good adhesion to materials that are difficult to plate. The present invention is a metal plating method wherein a material to be plated is surface treated with a silane coupling agent having in a molecule thereof a functional group with a metal-capturing capability, is heat treated at a high temperature of at least 150° C., a surface treatment is performed with a solution containing a noble metal compound, and electroless plating is performed. Alternatively, the present invention is a metal plating method wherein a material to be plated is surface treated with a liquid in which a noble metal compound and a silane coupling agent having in a molecule thereof a functional group with a metal-capturing capability have already been mixed or reacted, is heat treated at a high temperature of at least 150° C., and electroless plating is performed.

Abstract: It is an object of the present invention to provide a novel imidazole alcohol compound that adheres strongly to metal surfaces in metal products, especially copper, aluminum and steel products, and that has a superior rust-preventive effect even in a thin film, and a surface-treating agent using the same. The novel imidazole alcohol compound is expressed by the following general formula (1) show a rust-preventive effect. (In general formula (1), R1, R2 and R3 are each hydrogen, a vinyl group or an alkyl group with 1 to 20 carbon atoms, an aromatic ring may be formed by R2 and R3, X indicates hydrogen, an alkyl group with 1 to 6 carbon atoms, or a substituent group which may contain N or O, m indicates an integer from 0 to 20, and n and 1 indicate integers from 1 to 3.) The above-mentioned imidazole alcohol compound can be produced by reacting an imidazole compound and an epoxy alcohol compound.

Abstract: Resin cloths, powders, specular bodies and other objects resistant to conventional plating can be plated with metals by a simple method. According to the metal plating method of the present invention, electroless plating is performed after the surface of a object to be plated is treated with a pretreatment agent obtained by reacting or mixing in advance a noble metal compound (catalyst) with a silane-coupling agent having functional groups capable of capturing metals. According to this method, metal plating can be securely applied to powders, resin cloths, semiconductor wafers, and other specular bodies. Moreover, the problem of the insufficient coverage of the seed layer on the inside walls of vias and trenches during the formation of fine wiring can be addressed by applying this method to semiconductor wafers. The silane-coupling agent may be a compound containing azole groups, preferably an imidazole.

Abstract: Provided is an iron-based sintered body with a rustproof function comprising a layer containing 0.01 to 5 at % of indium on the surface of the iron-based sintered body, or an iron-based sintered body with a rustproof function containing 0.01 to 5 at % of indium throughout the sintered body, and the iron-based sintered body having iron as its principal component is manufactured by performing sintering in a gas atmosphere containing indium vapor or indium. Thereby obtained is an iron-based sintered body, as well as the manufacturing method thereof, capable of easily improving the rustproof effect without having to hardly change the conventional process.

Abstract: Provided is metallic powder for powder metallurgy having iron as its principal component and containing indium soap, or metallic powder for powder metallurgy further comprising at least one type selected among bismuth soap, nickel soap, cobalt soap, copper soap, manganese soap and aluminum soap in such indium soap. Thereby obtained is metallic powder for powder metallurgy capable of easily improving the rustproof effect without having to hardly change the conventional process.

Abstract: The object of the present invention to provide a metal plating method by a simple process, for example, on resins on which plating has been heretofore impossible. The metal plating method comprising surface treating an article to be plated with a liquid prepared by mixing or reacting in advance an organic acid salt of a silane coupling agent containing an azole in a molecule, for example, a coupling agent which is an equimolar reaction product of imidazole and ?-glycidoxypropyltrimethoxysilane, and a noble metal compound, and then conducting electroless plating thereon.

Abstract: It is an object of the present invention to provide a semiconductor wafer on which a thin, smooth, uniform and good adhesive electroless plating layer that can be suitable for a seed layer is formed, and to provide an electroless plating method which is suitable for use in the manufacture of such a semiconductor wafer.

Abstract: An adhesion accelerator for bonding rubber to metal contains a metal organic compound containing nickel and another metal organic compound containing zinc. Further, there is provided a rubber composition containing the above adhesion accelerator in an amount of 0.

Abstract: Resin cloths, powders, specular bodies and other objects resistant to conventional plating can be plated with metals by a simple method.

Abstract: The present invention provides a method for metal plating which makes it possible to perform electroless plating in a favorable manner even on materials difficult to apply electroless plating, and a pretreatment agent for this method. An article to be plated is treated with a pretreatment agent which has been prepared by mixing a solution of a silane coupling agent having a metal-capturing functional group in its molecule and a solution containing a metal that shows catalytic activity in the deposition of a plating metal such as copper, nickel or the like from an electroless plating solution onto the surface of an article to be plated so that the above-mentioned metal is captured by the above-mentioned silane coupling agent, and then adding a reducing agent. Afterward, electroless plating is performed so that a metal thin film is formed on the surface of the article pretreated above. Then, desired metal plating can be performed.