Patents by Inventor Toru Maeda

Toru Maeda has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7791454
    Abstract: A switch for urging a driver to perform an operation that is required when the smart ignition function is invalid. The switch is used by a driver to start the engine of a vehicle when the vehicle communicates with a portable device to verify the portable device. The portable device has an end portion. The switch includes a push button pushed by the driver. The push button includes a guide portion engaged with the end portion of the portable device.
    Type: Grant
    Filed: June 1, 2004
    Date of Patent: September 7, 2010
    Assignee: Kabushiki Kaisha Tokai Rika Denki Seisakusho
    Inventors: Tetsuya Egawa, Toru Maeda, Masaki Kawashima, Tomoyuki Funayama, Koji Iwamoto
  • Publication number: 20100193726
    Abstract: A soft magnetic material includes a plurality of composite magnetic particles (30) each including an iron-based particle (10) containing iron and an insulating coating film (20) surrounding a surface of the iron-based particle (10). The insulating coating film contains an organic group derived from an organic acid having at least one substance selected from the group consisting of titanium, aluminum, silicon, calcium, magnesium, vanadium, chromium, strontium, and zirconium. The at least one substance in the insulating coating film (20) is bonded to iron in the iron-based particles (10) through the organic group derived from the organic acid in the insulating coating film (20). Furthermore, a method for producing a soft magnetic material includes the steps of preparing the iron-based particles (10) containing iron and forming the insulating coating film (20) surrounding a surface of each of the iron-based particles (10).
    Type: Application
    Filed: August 26, 2008
    Publication date: August 5, 2010
    Applicant: SUMITOMO ELECTRIC INDUSTRIES, LTD.
    Inventors: Toru Maeda, Kazushi Kusawake
  • Publication number: 20100194516
    Abstract: To provide a core for reactor capable of reducing the eddy current loss and improving the direct current superposition characteristics, a manufacturing method thereof, and a reactor. A core for reactor M is obtained by press molding metallic magnetic particles coated with an insulating coated film, and the metallic magnetic particles have the following compositions: (1) the mean particle size is 1 ?m or more and 70 ?m or less; (2) the variation coefficient Cv which is a ratio (?/?) of the standard deviation (?) of the particle size and the mean particle size (?) is 0.40 or less; and (3) the degree of circularity is 0.8 or more and 1.0 or less. On the outside of the insulating coated film, at least one of a heat-resistance imparting protective film and a flexible protective film is further provided as a outer coated film.
    Type: Application
    Filed: September 10, 2008
    Publication date: August 5, 2010
    Inventors: Atsushi Sato, Toru Maeda
  • Patent number: 7767034
    Abstract: A soft magnetic material is a soft magnetic material including a composite magnetic particle (30) having a metal magnetic particle (10) mainly composed of Fe and an insulating coating (20) covering metal magnetic particle (10), and insulating coating (20) contains an iron phosphate compound and an aluminum phosphate compound. The atomic ratio of Fe contained in a contact surface of insulating coating (20) in contact with metal magnetic particle (10) is larger than the atomic ratio of Fe contained in the surface of insulating coating (20). The atomic ratio of Al contained in the contact surface of insulating coating (20) in contact with metal magnetic particle (10) is smaller than the atomic ratio of Al contained in the surface of insulating coating (20). Thus, iron loss can be reduced.
    Type: Grant
    Filed: September 29, 2005
    Date of Patent: August 3, 2010
    Assignees: Sumitomo Electric Industries, Ltd., Toda Kogyo Corp.
    Inventors: Toru Maeda, Naoto Igarashi, Haruhisa Toyoda, Hirokazu Kugai, Kazuyuki Hayashi, Hiroko Morii, Seiji Ishitani
  • Patent number: 7743964
    Abstract: A bonding apparatus (10) that bonds an electrode of a semiconductor die (12) and an electrode of a circuit board (19) using a metal nano paste includes a bump formation mechanism (20) that forms bump by injecting microdroplets of a metal nano paste on each electrode, a primary bonding mechanism (50) that carries out primary bonding to the electrodes in a non-conductive state by pressing the bump of the semiconductor die (12) against the bump of the circuit board (19), and a secondary bonding mechanism (80) that carries out secondary bonding so that the electrodes become conductive by pressurizing the primary bonded bump in bonding direction and by heating the bump to pressurize and sinter the metal nanoparticles in the bump. With this, it is possible to efficiently bond the electrodes with a simple and easy way while reducing a bonding load.
    Type: Grant
    Filed: February 26, 2008
    Date of Patent: June 29, 2010
    Assignee: Shinkawa Ltd.
    Inventor: Toru Maeda
  • Patent number: 7742794
    Abstract: A probe adapted to be used with a pulse oximeter is disclosed. A flexible first housing is adapted to be brought into contact with at least a nail of a finger or a toe of a subject. A flexible second housing is adapted to be brought into contact with at least a top of the finger or the toe. A flexible connecting part connects the first housing and the second housing, and is adapted to cover a tip end of the nail. A light emitting element is provided on one of the first housing and the second housing. A light receiving element is provided on the other one of the first housing and the second housing.
    Type: Grant
    Filed: July 28, 2006
    Date of Patent: June 22, 2010
    Assignee: Nihon Kohden Corporation
    Inventors: Noriaki Todokoro, Keiichi Sugiura, Toru Maeda, Hideki Fujisaki
  • Patent number: 7738130
    Abstract: Disclosed is an Internet FAX apparatus which, after receiving an Internet address from a certain destination, can communicate with the same destination in later transmission or during communication by connecting to a LAN and switching to an Internet FAX mode requiring no communication charge. An Internet facsimile apparatus on the receiving side transmits its Internet facsimile function and Internet address on an NSF signal in a standard protocol of G3 facsimile transmission and/or transmits its telephone number, Internet facsimile function, and Internet address on TSI and NSS signals in the standard protocol of G3 facsimile communication. The Internet facsimile apparatus registers an Internet facsimile function and Internet address of a partner apparatus as destination data.
    Type: Grant
    Filed: January 19, 2007
    Date of Patent: June 15, 2010
    Assignee: Canon Kabushiki Kaisha
    Inventor: Toru Maeda
  • Patent number: 7731676
    Abstract: A ureter stent designed for assisting the draining of urine with calculus fragments. The ureter stent includes a first holding portion, a second holding portion and a junction portion. The first holding portion has a pigtail shape for holding itself in a kidney. The second holding portion has a pigtail shape for holding itself in a bladder. The junction portion joins the first holding portion and the second holding portion and placed in a ureter. The junction portion is made of a metal round wire having no internal flow path. Urine flows outside the ureter stent.
    Type: Grant
    Filed: August 2, 2006
    Date of Patent: June 8, 2010
    Inventor: Toru Maeda
  • Patent number: 7726546
    Abstract: A bonding apparatus (10) that bonds an electrode of a semiconductor die (12) and an electrode of a circuit board (19) using a metal nano paste includes a bump formation mechanism (20) that forms bump by injecting microdroplets of a metal nano paste on each electrode, a primary bonding mechanism (50) that carries out primary bonding to the electrodes in a non-conductive state by pressing the bump of the semiconductor die (12) against the bump of the circuit board (19), and a secondary bonding mechanism (80) that includes a pressurizing unit that pressurizes the primary bonded bump in bonding direction, and that carries out secondary bonding so that the electrodes become conductive by heating the bump up to a temperature higher than a binder removal temperature of the metal nano paste and a dispersant removal temperature of the metal nano paste, removing the binder and the dispersant, and pressurizing and sintering the metal nanoparticles in the bump.
    Type: Grant
    Filed: February 26, 2008
    Date of Patent: June 1, 2010
    Assignee: Shinkawa Ltd.
    Inventor: Toru Maeda
  • Publication number: 20100093131
    Abstract: A bonding apparatus (10) that bonds an electrode of a semiconductor die (12) and an electrode of a circuit board (19) using a metal nano paste includes a bump formation mechanism (20) that forms bump by injecting microdroplets of a metal nano paste on each electrode, a primary bonding mechanism (50) that carries out primary bonding to the electrodes in a non-conductive state by pressing the bump of the semiconductor die (12) against the bump of the circuit board (19), and a secondary bonding mechanism (80) that carries out secondary bonding so that the electrodes become conductive by pressurizing the primary bonded bump in bonding direction and by heating the bump to pressurize and sinter the metal nanoparticles in the bump. With this, it is possible to efficiently bond the electrodes with a simple and easy way while reducing a bonding load.
    Type: Application
    Filed: February 26, 2008
    Publication date: April 15, 2010
    Applicant: SHINKAWA LTD.
    Inventor: Toru Maeda
  • Publication number: 20100089980
    Abstract: A bonding apparatus (10) that bonds an electrode of a semiconductor die (12) and an electrode of a circuit board (19) using a metal nano paste includes a bump formation mechanism (20) that forms bump by injecting microdroplets of a metal nano paste on each electrode, a primary bonding mechanism (50) that carries out primary bonding to the electrodes in a non-conductive state by pressing the bump of the semiconductor die (12) against the bump of the circuit board (19), and a secondary bonding mechanism (80) that includes a pressurizing unit that pressurizes the primary bonded bump in bonding direction, and that carries out secondary bonding so that the electrodes become conductive by heating the bump up to a temperature higher than a binder removal temperature of the metal nano paste and a dispersant removal temperature of the metal nano paste, removing the binder and the dispersant, and pressurizing and sintering the metal nanoparticles in the bump.
    Type: Application
    Filed: February 26, 2008
    Publication date: April 15, 2010
    Applicant: SHINKAWA LTD.
    Inventor: Toru Maeda
  • Patent number: 7682695
    Abstract: The object of the present invention is to provide a powder core and method for making the same that is equipped with insulative coating having superior heat resistance, with the coating making it possible to adequately restrict the flow of eddy currents between particles. The powder core is equipped with a plurality of compound magnetic particles bonded to each other. Each of said plurality of composite magnetic particles includes: a metal magnetic particle 10; an insulative lower layer coating 20 surrounding a surface 10a of said metal magnetic particle 10; an upper layer coating 30 surrounding said lower layer coating 20 and containing silicon; and dispersed particles 50 containing a metal oxide compound and disposed in said lower layer coating 20 and/or said upper layer coating 30. A mean particle diameter R of the dispersed particles 50 meets the condition 10 nm<R?2 T, where the average thickness of the coating combining the lower layer coating 20 and the upper layer coating 30 is T.
    Type: Grant
    Filed: January 28, 2005
    Date of Patent: March 23, 2010
    Assignee: Sumitomo Electric Industries, Ltd.
    Inventors: Hirokazu Kugai, Naoto Igarashi, Toru Maeda, Kazuhiro Hirose, Haruhisa Toyoda, Koji Mimura, Takao Nishioka
  • Patent number: 7674342
    Abstract: A method of producing a soft magnetic material includes the steps of preparing soft magnetic powder containing a plurality of soft magnetic particles etching the soft magnetic powder to remove surfaces of the soft magnetic particles and, after the etching step, heat-treating the soft magnetic powder in a finely divided state at a temperature of not less than 400° C. and not more than 900° C. By this method configured as above, desired magnetic characteristics can be obtained.
    Type: Grant
    Filed: March 29, 2005
    Date of Patent: March 9, 2010
    Assignee: Sumitomo Electric Industries, Ltd.
    Inventors: Toru Maeda, Naoto Igarashi, Kazuhiro Hirose, Haruhisa Toyoda
  • Publication number: 20100044618
    Abstract: A soft magnetic material, a dust core, a method for manufacturing the soft magnetic material, and a method for manufacturing the dust core that can improve DC bias characteristics are provided. A soft magnetic material includes a plurality of metal magnetic particles 10 whose coefficient of variation Cv (?/?), which is a ratio of a standard deviation (?) of a particle size of the metal magnetic particles 10 to an average particle size (?) thereof, is 0.40 or less and whose circularity Sf is 0.80 or more and 1 or less. The metal magnetic particles 10 preferably have an average particle size of 1 ?m or more and 70 ?m or less. The soft magnetic material preferably further includes an insulating coated film that surrounds a surface of each of the metal magnetic particles 10.
    Type: Application
    Filed: September 3, 2008
    Publication date: February 25, 2010
    Applicant: SUMITOMO ELECTRIC INDUSTRIES, LTD.
    Inventors: Tomoyuki Ishimine, Toshihiro Sakamoto, Toru Maeda, Naoto Igarashi
  • Publication number: 20100028195
    Abstract: A soft magnetic material includes a plurality of composite magnetic particles (40) each including a metal magnetic particle (10) and an insulation coating (20) covering the surface of the metal magnetic particle (10), wherein the insulation coating (20) contains Si (silicon), and 80% or more of Si contained in the insulation coating constitutes a silsesquioxane skeleton. Therefore, it is possible to effectively decrease a hysteresis loss while suppressing an increase in eddy-current loss.
    Type: Application
    Filed: October 9, 2009
    Publication date: February 4, 2010
    Applicant: SUMITOMO ELECTRIC INDUSTRIES, LTD.
    Inventors: Toru Maeda, Kazuyuki Maeda, Yasushi Mochida, Koji Mimura
  • Patent number: 7622202
    Abstract: A soft magnetic material includes a plurality of composite magnetic particles (40) each including a metal magnetic particle (10) and an insulation coating (20) covering the surface of the metal magnetic particle (10), wherein the insulation coating (20) contains Si (silicon), and 80% or more of Si contained in the insulation coating constitutes a silsesquioxane skeleton. Therefore, it is possible to effectively decrease a hysteresis loss while suppressing an increase in eddy-current loss.
    Type: Grant
    Filed: July 19, 2006
    Date of Patent: November 24, 2009
    Assignee: Sumitomo Electric Industries, Ltd.
    Inventors: Toru Maeda, Kazuyuki Maeda, Yasushi Mochida, Koji Mimura
  • Patent number: 7589433
    Abstract: An electric steering lock capable of outputting a signal correctly indicating an operation state of a steering lock mechanism even when the operation voltage of a lock detector decreases. The electric steering lock includes a CPU, a signal hold circuit, and an OR circuit. When the steering lock mechanism unlocks a steering wheel, an unlock sensor provides an H level detection signal to the CPU and the signal hold circuit. In response to the detection signal, the CPU issues a state hold command to the signal hold circuit. In response to the state hold command, the signal hold circuit generates an H level hold signal in correspondence with the detection signal. The OR circuit provides an H level signal to an immobilizer ECU when at least one of the detection signal from the unlock sensor or the hold signal has an H level.
    Type: Grant
    Filed: September 27, 2005
    Date of Patent: September 15, 2009
    Assignees: Kabushiki Kaisha Tokai Rika Denki Seisakusho, Toyota Jidosha Kabushiki Kaisha
    Inventors: Kazuya Otani, Toru Maeda, Toshihiro Nagae, Tomoo Kakegawa
  • Patent number: 7576297
    Abstract: A bonding apparatus including a capillary 40 having a high-frequency coil 50 on its tip end portion and allowing a bonding wire 2 to pass therethrough, a position changing unit for changing the position of the tip of the bonding wire, a gas supply unit for supplying gas into the capillary, and a high-frequency power supply unit for supplying high-frequency power to the high-frequency coil. When the bonding wire is outside a plasma region 52 in the capillary, a microplasma generated in the plasma region is ejected out of the capillary and removes foreign matter or contaminants on the surface of a bonding subject. When the bonding wire is inside the plasma region, the material of the bonding wire is turned into fine particles, and a microplasma 303 containing sputtered fine particles is ejected from the capillary, allowing the material the same as the bonding wire to be deposited on the bonding subject.
    Type: Grant
    Filed: June 30, 2006
    Date of Patent: August 18, 2009
    Assignee: Kabushiki Kaisha Shinkawa
    Inventors: Kazuo Fujita, Toru Maeda
  • Patent number: 7556838
    Abstract: A soft magnetic material includes a plurality of composite magnetic particles (30) having metallic magnetic particles (10) that are composed of pure iron, and an insulation film (20) that surrounds the surface of the metallic magnetic particles (10), wherein the manganese content of the metallic magnetic particles (10) is 0.013 mass % or less, and is more preferably 0.008 mass % or less. Hysteresis loss can thereby be effectively reduced.
    Type: Grant
    Filed: July 19, 2006
    Date of Patent: July 7, 2009
    Assignee: Sumitomo Electric Industries, Ltd.
    Inventors: Toru Maeda, Haruhisa Toyoda, Koji Mimura, Yasushi Mochida
  • Patent number: 7544417
    Abstract: A soft magnetic material includes a plurality of composite magnetic particles (30), wherein each of the plurality of composite magnetic particles (30) includes a metal magnetic particle (10), an insulating coating (20) covering the surface of the metal magnetic particle (10), and a composite coating (22) covering the outside of the insulating coating (20). The composite coating (22) includes a heat-resistance-imparting protective coating (24) covering the surface of the insulating coating (20), and a flexible protective coating (26) covering the surface of the heat-resistance-imparting protective coating (24). Accordingly, a soft magnetic material and a dust core which have a satisfactory compactibility and in which the insulating coating satisfactorily functions, thereby sufficiently reducing core loss, can be obtained.
    Type: Grant
    Filed: January 20, 2006
    Date of Patent: June 9, 2009
    Assignee: Sumitomo Electric Industries, Ltd.
    Inventors: Toru Maeda, Kazuhiro Hirose, Haruhisa Toyoda