Patents by Inventor Toru Maruyama
Toru Maruyama has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11958161Abstract: The present invention relates to a polishing apparatus having a surface-property measuring device for measuring surface properties of a polishing pad which is used to polish a substrate, such as semiconductor wafer, and a polishing system including such a polishing apparatus. The polishing apparatus includes a surface-property measuring device (30) for measuring surface properties of a polishing pad (2), a support arm (50) for supporting the surface-property measuring device (30), and a moving unit (53) coupled to the support arm (50) and configured to move the surface-property measuring device (30) from a retreat position to a measure position.Type: GrantFiled: April 25, 2019Date of Patent: April 16, 2024Assignee: EBARA CORPORATIONInventors: Keisuke Kamiki, Toru Maruyama, Yasuyuki Motoshima
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Patent number: 11919048Abstract: The present invention relates to a method of cleaning an optical film-thickness measuring system used for measuring a film thickness of a substrate, such as a wafer, while polishing the substrate. The method includes: cleaning an optical sensor head (7) by supplying a rinsing liquid into a through-hole (51) formed in a polishing pad (2) on a polishing table (3) before or after polishing of a substrate (W) with use of slurry, the optical sensor head (7) being located below the through-hole (51); and discharging the rinsing liquid from the through-hole (51) through a drain line (54).Type: GrantFiled: December 16, 2019Date of Patent: March 5, 2024Assignee: EBARA CORPORATIONInventors: Nobuyuki Takahashi, Toru Maruyama, Taichi Yokoyama, Zhongxin Wen
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Patent number: 11919124Abstract: The present application relates to a pad-temperature regulating apparatus for regulating a temperature of a surface of a polishing pad. The pad-temperature regulating apparatus includes a pad-contact member, a supply system for supplying a heating liquid and a cooling liquid into the pad contact member, a pad-temperature measuring device for measuring the temperature of the surface of the polishing pad, and a controller for performing a PID control of manipulated variables of a first flow control valve and a second flow control valve. The controller includes a memory in which a learned model constructed to maintain a temperature behavior curve, created based on measured values of the pad-temperature measuring device, within a predetermined allowable range, is stored; and a processing device which inputs at least one temperature behavior parameter to the learned model, and performs a calculation to output a change value of PID parameter for the PID control.Type: GrantFiled: December 19, 2019Date of Patent: March 5, 2024Assignee: EBARA CORPORATIONInventor: Toru Maruyama
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Patent number: 11898940Abstract: A method of inspecting a leak detection system in a short time is disclosed. The leak detection system includes a leak detection line, an on-off valve, a flow mater, an operation controller configured to detect a fluid leak from a fluid line based on a first flow rate measured by the flow mater, a drain line, and a drain valve attached to the drain line. The inspection method includes: opening the on-off valve and the drain valve, with a supply valve and a return valve closed; measuring a second flow rate of fluid in the leak detection line by the flow mater; and determining that the leak detection system has a defect when the second flow rate is lower than a predetermined reference value.Type: GrantFiled: July 23, 2021Date of Patent: February 13, 2024Assignee: EBARA CORPORATIONInventors: Toru Maruyama, Mitsunori Komatsu, Keisuke Kamiki
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Patent number: 11839947Abstract: A pad-temperature regulating apparatus is disclosed, which includes a heat exchanger capable of being cleaned in a limited space. A pad-temperature regulating apparatus includes a heat exchanger configured to contact a polishing pad to exchange heat with the polishing pad, a moving mechanism configured to move the heat exchanger between a temperature regulating position where the heat exchanger can exchange heat with the polishing pad, and a retreat position located on a side of the polishing pad, and a cleaning mechanism configured to clean the heat exchanger moved to the retreat position. The heat exchanger has an approximate triangular shape in a horizontal cross-section, and a longest side of the heat exchanger faces the polishing pad when the heat exchanger is moved to the retreat position.Type: GrantFiled: March 10, 2022Date of Patent: December 12, 2023Assignee: EBARA CORPORATIONInventors: Keisuke Kamiki, Toru Maruyama, Yasuyuki Motoshima
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Patent number: 11826871Abstract: A pad-temperature regulating device is disclosed, which can improve a responsiveness of a control for a surface temperature of a polishing pad and regulate the surface temperature of the polishing pad without causing defects, such as scratches, on the substrate. The pad-temperature regulating apparatus includes: a heat exchanger disposed above the polishing pad, whose temperature is maintained at a predetermined temperature; a pad-temperature measuring device configured to measure the surface temperature of the polishing pad; a distance sensor configured to measure a separation distance between the polishing pad and the heat exchanger; an elevating mechanism for moving the heat exchanger vertically with respect to the polishing pad; and a controller configured to control operation of the elevating mechanism based on measured values of the pad-temperature measuring device.Type: GrantFiled: April 28, 2021Date of Patent: November 28, 2023Assignee: EBARA CORPORATIONInventors: Shuji Uozumi, Toru Maruyama
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Publication number: 20230356267Abstract: In one embodiment of the present invention, a cleaning member 90 is attached to the surface of a cleaning member attaching part 10. The cleaning member attaching part 10 has a main body 20, a cleaning liquid introduction part 30 extending inside the main body 20, and a plurality of cleaning liquid supply holes 40 communicating with the cleaning liquid introduction part 30. The cleaning liquid introduction part 30 is configured such that cleaning liquid flows in from a first end part 11 side, and an area proportion of the cleaning liquid supply holes 40 in a second region located on a second end part 12 side opposite to the first end part 11 to a surface of the main body 20 is larger than the area proportion of the cleaning liquid supply holes 40 in a first region located on the first end part 11 side to the surface of the main body 20.Type: ApplicationFiled: July 13, 2023Publication date: November 9, 2023Applicant: Ebara CorporationInventors: Shuji UOZUMI, Toru MARUYAMA, Yasuyuki MOTOSHIMA
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Publication number: 20230190698Abstract: Since a compound represented by the general formula (I) (wherein definition of each group is as described in the specification), a salt thereof, a solvate thereof, or a prodrug thereof has strong and sustaining intraocular pressure lowering activity and, further, has no side effect on eyes such as ocular stimulating property (hyperemia, corneal clouding etc.), aqueous humor protein rise etc., it has high safety, and can be an excellent agent for preventing and/or treating glaucoma etc.Type: ApplicationFiled: February 15, 2023Publication date: June 22, 2023Applicant: ONO PHARMACEUTICAL CO., LTD.Inventors: Tohru KAMBE, Toru MARUYAMA, Shinsaku YAMANE, Satoshi NAKAYAMA, Kousuke TANI
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Patent number: 11617733Abstract: Since a compound represented by the general formula (I) (wherein definition of each group is as described in the specification), a salt thereof, a solvate thereof, or a prodrug thereof has strong and sustaining intraocular pressure lowering activity and, further, has no side effect on eyes such as ocular stimulating property (hyperemia, corneal clouding etc.), aqueous humor protein rise etc., it has high safety, and can be an excellent agent for preventing and/or treating glaucoma etc.Type: GrantFiled: January 14, 2021Date of Patent: April 4, 2023Assignee: ONO PHARMACEUTICAL CO., LTD.Inventors: Tohru Kambe, Toru Maruyama, Shinsaku Yamane, Satoshi Nakayama, Kousuke Tani
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Patent number: 11517940Abstract: A substrate cleaning device that facilitates control of the amount of liquid supplied to a substrate and reduces adverse influences of the liquid supplied to a bearing part on the substrate is provided. The substrate cleaning device includes: a holding part that has a bearing part configured to rotatably hold a cleaning member for cleaning a substrate; a first supply part that has at least a part provided inside the holding part and supplies a first liquid into the cleaning member through the inside of the holding part; and a second supply part that supplies a second liquid to the bearing part.Type: GrantFiled: December 13, 2019Date of Patent: December 6, 2022Assignee: EBARA CORPORATIONInventors: Shuji Uozumi, Yasuyuki Motoshima, Toru Maruyama
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Publication number: 20220375775Abstract: An object of the present invention is to improve a substrate processing apparatus using the CARE method. The present invention provides a substrate processing apparatus for polishing a processing target region of a substrate by bringing the substrate and a catalyst into contact with each other in the presence of processing liquid. The substrate processing apparatus includes a substrate holding unit configured to hold the substrate, a catalyst holding unit configured to hold the catalyst, and a driving unit configured to move the substrate holding unit and the catalyst holding unit relative to each other with the processing target region of the substrate and the catalyst kept in contact with each other. The catalyst is smaller than the substrate.Type: ApplicationFiled: August 4, 2022Publication date: November 24, 2022Inventors: Itsuki Kobata, Keita Yagi, Katsuhide Watanabe, Yoichi Shiokawa, Toru Maruyama, Nobuyuki Takahashi
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Publication number: 20220305617Abstract: A pad-temperature regulating apparatus is disclosed, which includes a heat exchanger capable of being cleaned in a limited space. A pad-temperature regulating apparatus includes a heat exchanger configured to contact a polishing pad to exchange heat with the polishing pad, a moving mechanism configured to move the heat exchanger between a temperature regulating position where the heat exchanger can exchange heat with the polishing pad, and a retreat position located on a side of the polishing pad, and a cleaning mechanism configured to clean the heat exchanger moved to the retreat position. The heat exchanger has an approximate triangular shape in a horizontal cross-section, and a longest side of the heat exchanger faces the polishing pad when the heat exchanger is moved to the retreat position.Type: ApplicationFiled: March 10, 2022Publication date: September 29, 2022Inventors: Keisuke KAMIKI, Toru MARUYAMA, Yasuyuki MOTOSHIMA
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Patent number: 11450544Abstract: An object of the present invention is to improve a substrate processing apparatus using the CARE method. The present invention provides a substrate processing apparatus for polishing a processing target region of a substrate by bringing the substrate and a catalyst into contact with each other in the presence of processing liquid. The substrate processing apparatus includes a substrate holding unit configured to hold the substrate, a catalyst holding unit configured to hold the catalyst, and a driving unit configured to move the substrate holding unit and the catalyst holding unit relative to each other with the processing target region of the substrate and the catalyst kept in contact with each other. The catalyst is smaller than the substrate.Type: GrantFiled: April 10, 2020Date of Patent: September 20, 2022Assignee: EBARA CORPORATIONInventors: Itsuki Kobata, Keita Yagi, Katsuhide Watanabe, Yoichi Shiokawa, Toru Maruyama, Nobuyuki Takahashi
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Patent number: 11383345Abstract: A cleaning apparatus capable of effectively removing dirt attached to a bottom surface of a heat exchanger, is disclosed. The cleaning apparatus cleans the heat exchanger for regulating a surface temperature of a polishing pad. This cleaning apparatus includes: a moving mechanism configured to move the heat exchanger between a temperature-regulating position in which the heat exchanger can exchange heat with the polishing pad, and a retreat position in which the heat exchanger is separated from a surface of the polishing pad; and a cleaning mechanism configured to clean a bottom surface of the heat exchanger moved to the retreat position The retreat position is located on a side of the polishing pad. The cleaning mechanism includes at least one cleaning nozzle for ejecting a cleaning liquid to the bottom surface of the heat exchanger, or a cleaning tank in which the bottom surface of the heat exchanger can be immersed.Type: GrantFiled: March 19, 2020Date of Patent: July 12, 2022Assignee: EBARA CORPORATIONInventors: Yasuyuki Motoshima, Toru Maruyama, Keisuke Kamiki, Shuji Uozumi
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Publication number: 20220212312Abstract: The present invention relates to a temperature regulating apparatus for regulating a temperature of a polishing surface of a polishing pad used for polishing a substrate, such as a wafer. The present invention further relates to a polishing apparatus including such a temperature regulating apparatus. The temperature regulating apparatus (5) includes: a heat exchanger (11) having a heating flow passage (61) and a cooling flow passage (62) formed therein; a holder (90) arranged over the heat exchanger (11); a coupling mechanism (80) configured to detachably fix the heat exchanger (11) to the holder (90), the coupling mechanism (80) including: a first hook (73) fixed to an upper surface of the heat exchanger (11); and a second hook (83) held by the holder (90). The second hook (83) is configured to be able to be engaged with and disengaged from the first hook (73).Type: ApplicationFiled: May 20, 2020Publication date: July 7, 2022Inventors: Keisuke Kamiki, Toru Maruyama, Yasuyuki Motoshima
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Publication number: 20220072590Abstract: The present invention relates to a method of cleaning an optical film-thickness measuring system used for measuring a film thickness of a substrate, such as a wafer, while polishing the substrate. The method includes: cleaning an optical sensor head (7) by supplying a rinsing liquid into a through-hole (51) formed in a polishing pad (2) on a polishing table (3) before or after polishing of a substrate (W) with use of slurry, the optical sensor head (7) being located below the through-hole (51); and discharging the rinsing liquid from the through-hole (51) through a drain line (54).Type: ApplicationFiled: December 16, 2019Publication date: March 10, 2022Inventors: Nobuyuki Takahashi, Toru Maruyama, Taichi Yokoyama, Zhongxin Wen
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Publication number: 20220072679Abstract: The present application relates to a pad-temperature regulating apparatus for regulating a temperature of a surface of a polishing pad. The pad-temperature regulating apparatus includes a pad-contact member, a supply system for supplying a heating liquid and a cooling liquid into the pad contact member, a pad-temperature measuring device for measuring the temperature of the surface of the polishing pad, and a controller for performing a PID control of manipulated variables of a first flow control valve and a second flow control valve. The controller includes a memory in which a learned model constructed to maintain a temperature behavior curve, created based on measured values of the pad-temperature measuring device, within a predetermined allowable range, is stored; and a processing device which inputs at least one temperature behavior parameter to the learned model, and performs a calculation to output a change value of PID parameter for the PID control.Type: ApplicationFiled: December 19, 2019Publication date: March 10, 2022Inventor: Toru MARUYAMA
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Patent number: 11262105Abstract: There is provided a cryocooler including a first compressor, a second compressor, a cold head that has a high pressure port and a low pressure port, a high pressure line that is configured such that a refrigerant gas is able to flow from the first compressor and the second compressor to the high pressure port of the cold head via a merging portion, the high pressure line including a first high pressure sub-line and a second high pressure sub-line, and a low pressure line that is configured such that the refrigerant gas is able to flow from the low pressure port of the cold head to the first compressor and the second compressor via a diverting portion, the low pressure line including a first low pressure sub-line and a second low pressure sub-line.Type: GrantFiled: August 27, 2020Date of Patent: March 1, 2022Assignee: SUMITOMO HEAVY INDUSTRIES, LTD.Inventor: Toru Maruyama
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Publication number: 20220034745Abstract: A method of inspecting a leak detection system in a short time is disclosed. The leak detection system includes a leak detection line, an on-off valve, a flow mater, an operation controller configured to detect a fluid leak from a fluid line based on a first flow rate measured by the flow mater, a drain line, and a drain valve attached to the drain line. The inspection method includes: opening the on-off valve and the drain valve, with a supply valve and a return valve closed; measuring a second flow rate of fluid in the leak detection line by the flow mater; and determining that the leak detection system has a defect when the second flow rate is lower than a predetermined reference value.Type: ApplicationFiled: July 23, 2021Publication date: February 3, 2022Inventors: Toru Maruyama, Mitsunori Komatsu, Keisuke Kamiki
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Publication number: 20210370461Abstract: The present invention relates to a polishing apparatus having a surface-property measuring device for measuring surface properties of a polishing pad which is used to polish a substrate, such as semiconductor wafer, and a polishing system including such a polishing apparatus. The polishing apparatus includes a surface-property measuring device (30) for measuring surface properties of a polishing pad (2), a support arm (50) for supporting the surface-property measuring device (30), and a moving unit (53) coupled to the support arm (50) and configured to move the surface-property measuring device (30) from a retreat position to a measure position.Type: ApplicationFiled: April 25, 2019Publication date: December 2, 2021Inventors: Keisuke KAMIKI, Toru MARUYAMA, Yasuyuki MOTOSHIMA