Patents by Inventor Toru Maruyama

Toru Maruyama has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20220305617
    Abstract: A pad-temperature regulating apparatus is disclosed, which includes a heat exchanger capable of being cleaned in a limited space. A pad-temperature regulating apparatus includes a heat exchanger configured to contact a polishing pad to exchange heat with the polishing pad, a moving mechanism configured to move the heat exchanger between a temperature regulating position where the heat exchanger can exchange heat with the polishing pad, and a retreat position located on a side of the polishing pad, and a cleaning mechanism configured to clean the heat exchanger moved to the retreat position. The heat exchanger has an approximate triangular shape in a horizontal cross-section, and a longest side of the heat exchanger faces the polishing pad when the heat exchanger is moved to the retreat position.
    Type: Application
    Filed: March 10, 2022
    Publication date: September 29, 2022
    Inventors: Keisuke KAMIKI, Toru MARUYAMA, Yasuyuki MOTOSHIMA
  • Patent number: 11450544
    Abstract: An object of the present invention is to improve a substrate processing apparatus using the CARE method. The present invention provides a substrate processing apparatus for polishing a processing target region of a substrate by bringing the substrate and a catalyst into contact with each other in the presence of processing liquid. The substrate processing apparatus includes a substrate holding unit configured to hold the substrate, a catalyst holding unit configured to hold the catalyst, and a driving unit configured to move the substrate holding unit and the catalyst holding unit relative to each other with the processing target region of the substrate and the catalyst kept in contact with each other. The catalyst is smaller than the substrate.
    Type: Grant
    Filed: April 10, 2020
    Date of Patent: September 20, 2022
    Assignee: EBARA CORPORATION
    Inventors: Itsuki Kobata, Keita Yagi, Katsuhide Watanabe, Yoichi Shiokawa, Toru Maruyama, Nobuyuki Takahashi
  • Patent number: 11448156
    Abstract: An engine control apparatus includes an ignition control section and an injection control section. When partial compression ignition combustion is carried out, the ignition control section causes an ignition plug to carry out: main ignition in which a spark is generated in a late period of a compression stroke or an initial period of a expansion stroke to initiate the SI combustion; and preceding ignition in which the spark is generated at earlier timing than the main ignition. Also, when the partial compression ignition combustion is carried out, the injection control section causes the injector to inject fuel at such timing that the fuel exists in a cylinder at an earlier time point than the preceding ignition. Energy of the preceding ignition is set to be lower when an in-cylinder temperature specified by an in-cylinder temperature specification section is high than when the in-cylinder temperature is low.
    Type: Grant
    Filed: April 23, 2019
    Date of Patent: September 20, 2022
    Assignee: Mazda Motor Corporation
    Inventors: Kota Matsumoto, Tomonori Urushihara, Keiji Maruyama, Masanari Sueoka, Ryohei Ono, Yuji Harada, Toru Miyamoto, Atsushi Inoue, Tatsuhiro Tokunaga, Takuya Ohura, Yusuke Kawai, Tomohiro Nishida, Keita Arai, Yodai Yamaguchi
  • Patent number: 11437734
    Abstract: This antenna device is provided with: a ground; strip lines that extend from positions facing each other with respect to the width direction of the ground; a plurality of slots which is provided to the ground and which intersects with straight lines along the strip lines; and branch lines which intersect with the slots that are positioned to face the branch lines in a back surface.
    Type: Grant
    Filed: September 25, 2020
    Date of Patent: September 6, 2022
    Assignee: Mitsubishi Electric Corporation
    Inventors: Jun Goto, Takashi Maruyama, Toru Fukasawa
  • Patent number: 11383345
    Abstract: A cleaning apparatus capable of effectively removing dirt attached to a bottom surface of a heat exchanger, is disclosed. The cleaning apparatus cleans the heat exchanger for regulating a surface temperature of a polishing pad. This cleaning apparatus includes: a moving mechanism configured to move the heat exchanger between a temperature-regulating position in which the heat exchanger can exchange heat with the polishing pad, and a retreat position in which the heat exchanger is separated from a surface of the polishing pad; and a cleaning mechanism configured to clean a bottom surface of the heat exchanger moved to the retreat position The retreat position is located on a side of the polishing pad. The cleaning mechanism includes at least one cleaning nozzle for ejecting a cleaning liquid to the bottom surface of the heat exchanger, or a cleaning tank in which the bottom surface of the heat exchanger can be immersed.
    Type: Grant
    Filed: March 19, 2020
    Date of Patent: July 12, 2022
    Assignee: EBARA CORPORATION
    Inventors: Yasuyuki Motoshima, Toru Maruyama, Keisuke Kamiki, Shuji Uozumi
  • Publication number: 20220212312
    Abstract: The present invention relates to a temperature regulating apparatus for regulating a temperature of a polishing surface of a polishing pad used for polishing a substrate, such as a wafer. The present invention further relates to a polishing apparatus including such a temperature regulating apparatus. The temperature regulating apparatus (5) includes: a heat exchanger (11) having a heating flow passage (61) and a cooling flow passage (62) formed therein; a holder (90) arranged over the heat exchanger (11); a coupling mechanism (80) configured to detachably fix the heat exchanger (11) to the holder (90), the coupling mechanism (80) including: a first hook (73) fixed to an upper surface of the heat exchanger (11); and a second hook (83) held by the holder (90). The second hook (83) is configured to be able to be engaged with and disengaged from the first hook (73).
    Type: Application
    Filed: May 20, 2020
    Publication date: July 7, 2022
    Inventors: Keisuke Kamiki, Toru Maruyama, Yasuyuki Motoshima
  • Publication number: 20220216036
    Abstract: A control method of a plasma processing apparatus including a first electrode that places a workpiece thereon includes supplying a bias power to the first electrode, and supplying a source power having a frequency higher than that of the bias power into a plasma processing space. The source power has a first state and a second state. The control method further includes a first control process of alternately applying the first state and the second state of the source power in synchronization with a signal synchronized with a cycle of a radio frequency of the bias power, or a phase within one cycle of a reference electrical state that represents any one of a voltage, current, and electromagnetic field measured in a power feeding system of the bias power.
    Type: Application
    Filed: March 22, 2022
    Publication date: July 7, 2022
    Applicant: Tokyo Electron Limited
    Inventors: Chishio KOSHIMIZU, Taichi HIRANO, Toru HAYASAKA, Shinji KUBOTA, Koji MARUYAMA, Takashi DOKAN
  • Patent number: 11371462
    Abstract: The control apparatus for a compression ignition type engine includes a plurality of cylinder inner pressure sensors that detect pressure in each cylinder, and a combustion control unit. The combustion control unit corrects a target fuel injection amount of each cylinder by an injector based on a deviation between a predicted combustion period that is a period from an ignition timing by an ignition plug to a predetermined mass combustion timing and that is obtained based on a preset combustion model, and an actual combustion period that is a period from the ignition timing by the ignition plug to an actual combustion timing and that is obtained based on cylinder inner pressure, such that the period from the ignition timing by the ignition plug to the predetermined mass combustion timing, which is the timing when fuel having a predetermined mass ratio combusts, is equalized in each cylinder.
    Type: Grant
    Filed: March 4, 2020
    Date of Patent: June 28, 2022
    Assignee: Mazda Motor Corporation
    Inventors: Masanari Sueoka, Junichi Taga, Hideki Omori, Keiji Maruyama, Tatsuhiro Tokunaga, Takuya Ohura, Toru Miyamoto, Tomohiro Nishida, Kenji Tanimura, Shinji Takayama
  • Publication number: 20220072590
    Abstract: The present invention relates to a method of cleaning an optical film-thickness measuring system used for measuring a film thickness of a substrate, such as a wafer, while polishing the substrate. The method includes: cleaning an optical sensor head (7) by supplying a rinsing liquid into a through-hole (51) formed in a polishing pad (2) on a polishing table (3) before or after polishing of a substrate (W) with use of slurry, the optical sensor head (7) being located below the through-hole (51); and discharging the rinsing liquid from the through-hole (51) through a drain line (54).
    Type: Application
    Filed: December 16, 2019
    Publication date: March 10, 2022
    Inventors: Nobuyuki Takahashi, Toru Maruyama, Taichi Yokoyama, Zhongxin Wen
  • Publication number: 20220072679
    Abstract: The present application relates to a pad-temperature regulating apparatus for regulating a temperature of a surface of a polishing pad. The pad-temperature regulating apparatus includes a pad-contact member, a supply system for supplying a heating liquid and a cooling liquid into the pad contact member, a pad-temperature measuring device for measuring the temperature of the surface of the polishing pad, and a controller for performing a PID control of manipulated variables of a first flow control valve and a second flow control valve. The controller includes a memory in which a learned model constructed to maintain a temperature behavior curve, created based on measured values of the pad-temperature measuring device, within a predetermined allowable range, is stored; and a processing device which inputs at least one temperature behavior parameter to the learned model, and performs a calculation to output a change value of PID parameter for the PID control.
    Type: Application
    Filed: December 19, 2019
    Publication date: March 10, 2022
    Inventor: Toru MARUYAMA
  • Patent number: 11262105
    Abstract: There is provided a cryocooler including a first compressor, a second compressor, a cold head that has a high pressure port and a low pressure port, a high pressure line that is configured such that a refrigerant gas is able to flow from the first compressor and the second compressor to the high pressure port of the cold head via a merging portion, the high pressure line including a first high pressure sub-line and a second high pressure sub-line, and a low pressure line that is configured such that the refrigerant gas is able to flow from the low pressure port of the cold head to the first compressor and the second compressor via a diverting portion, the low pressure line including a first low pressure sub-line and a second low pressure sub-line.
    Type: Grant
    Filed: August 27, 2020
    Date of Patent: March 1, 2022
    Assignee: SUMITOMO HEAVY INDUSTRIES, LTD.
    Inventor: Toru Maruyama
  • Publication number: 20220034745
    Abstract: A method of inspecting a leak detection system in a short time is disclosed. The leak detection system includes a leak detection line, an on-off valve, a flow mater, an operation controller configured to detect a fluid leak from a fluid line based on a first flow rate measured by the flow mater, a drain line, and a drain valve attached to the drain line. The inspection method includes: opening the on-off valve and the drain valve, with a supply valve and a return valve closed; measuring a second flow rate of fluid in the leak detection line by the flow mater; and determining that the leak detection system has a defect when the second flow rate is lower than a predetermined reference value.
    Type: Application
    Filed: July 23, 2021
    Publication date: February 3, 2022
    Inventors: Toru Maruyama, Mitsunori Komatsu, Keisuke Kamiki
  • Publication number: 20210370461
    Abstract: The present invention relates to a polishing apparatus having a surface-property measuring device for measuring surface properties of a polishing pad which is used to polish a substrate, such as semiconductor wafer, and a polishing system including such a polishing apparatus. The polishing apparatus includes a surface-property measuring device (30) for measuring surface properties of a polishing pad (2), a support arm (50) for supporting the surface-property measuring device (30), and a moving unit (53) coupled to the support arm (50) and configured to move the surface-property measuring device (30) from a retreat position to a measure position.
    Type: Application
    Filed: April 25, 2019
    Publication date: December 2, 2021
    Inventors: Keisuke KAMIKI, Toru MARUYAMA, Yasuyuki MOTOSHIMA
  • Publication number: 20210347004
    Abstract: A pad-temperature regulating device is disclosed, which can improve a responsiveness of a control for a surface temperature of a polishing pad and regulate the surface temperature of the polishing pad without causing defects, such as scratches, on the substrate. The pad-temperature regulating apparatus includes: a heat exchanger disposed above the polishing pad, whose temperature is maintained at a predetermined temperature; a pad-temperature measuring device configured to measure the surface temperature of the polishing pad; a distance sensor configured to measure a separation distance between the polishing pad and the heat exchanger; an elevating mechanism for moving the heat exchanger vertically with respect to the polishing pad; and a controller configured to control operation of the elevating mechanism based on measured values of the pad-temperature measuring device.
    Type: Application
    Filed: April 28, 2021
    Publication date: November 11, 2021
    Inventors: Shuji UOZUMI, Toru MARUYAMA
  • Publication number: 20210229235
    Abstract: An apparatus for polishing a substrate includes a rotatable polishing table supporting a polishing pad, a substrate holder configured to hold the substrate and press the substrate against a polishing surface of the polishing pad on the rotating polishing table so as to polish the substrate, and a pad-temperature detector configured to measure a temperature of the polishing surface of the polishing pad. The apparatus also includes a pad-temperature regulator configured to contact the polishing surface to regulate the temperature of the polishing surface, and a temperature controller configured to control the temperature of the polishing surface by controlling the pad-temperature regulator based on information on the temperature of the polishing surface detected by the pad-temperature detector.
    Type: Application
    Filed: April 13, 2021
    Publication date: July 29, 2021
    Inventors: Tadakazu SONE, Yasuyuki MOTOSHIMA, Toru MARUYAMA, Katsutoshi ONO, Yoichi SHIOKAWA
  • Publication number: 20210170545
    Abstract: A system (5) includes a heat exchanging member (11) and a liquid supply unit (30). The liquid supply unit (30) includes a pump device (32) that adjusts the flow amount of a liquid flowing through a heating liquid supply line (HSL), a needle valve (MNV) that is attached to a cooling liquid supply line (CSL), and a control device (40) that controls operations of the pump device (32) and the needle valve (MNV).
    Type: Application
    Filed: December 8, 2020
    Publication date: June 10, 2021
    Applicant: EBARA CORPORATION
    Inventors: SHUJI UOZUMI, TORU MARUYAMA, MITSUNORI KOMATSU
  • Publication number: 20210169842
    Abstract: Since a compound represented by the general formula (I) (wherein definition of each group is as described in the specification), a salt thereof, a solvate thereof, or a prodrug thereof has strong and sustaining intraocular pressure lowering activity and, further, has no side effect on eyes such as ocular stimulating property (hyperemia, corneal clouding etc.), aqueous humor protein rise etc., it has high safety, and can be an excellent agent for preventing and/or treating glaucoma etc.
    Type: Application
    Filed: January 14, 2021
    Publication date: June 10, 2021
    Applicant: ONO PHARMACEUTICAL CO., LTD.
    Inventors: Tohru KAMBE, Toru MARUYAMA, Shinsaku YAMANE, Satoshi NAKAYAMA, Kousuke TANI
  • Patent number: 10940134
    Abstract: Since a compound represented by the general formula (I) (wherein definition of each group is as described in the specification), a salt thereof, a solvate thereof, or a prodrug thereof has strong and sustaining intraocular pressure lowering activity and, further, has no side effect on eyes such as ocular stimulating property (hyperemia, corneal clouding etc.), aqueous humor protein rise etc., it has high safety, and can be an excellent agent for preventing and/or treating glaucoma etc.
    Type: Grant
    Filed: November 27, 2019
    Date of Patent: March 9, 2021
    Assignee: ONO PHARMACEUTICAL CO., LTD.
    Inventors: Tohru Kambe, Toru Maruyama, Shinsaku Yamane, Satoshi Nakayama, Kousuke Tani
  • Patent number: 10903101
    Abstract: A substrate processing apparatus having a detecting unit that can detect an abnormality of a substrate such as a crack of the substrate or chipping of the substrate is disclosed. The substrate processing apparatus includes a polishing unit configured to polish a substrate, a cleaning unit configured to clean the polished substrate, a substrate abnormality detection unit configured to detect an abnormality of the substrate, and a substrate transporting mechanism configured to transport the substrate in the order of the polishing unit, the substrate abnormality detection unit, and the cleaning unit. The substrate abnormality detection unit includes an imaging device configured to image the substrate, and an output monitoring unit configured to determine a status of the substrate by comparing a signal obtained from the imaging device with a predetermined threshold.
    Type: Grant
    Filed: April 19, 2016
    Date of Patent: January 26, 2021
    Assignee: EBARA CORPORATION
    Inventors: Mitsunori Komatsu, Toru Maruyama, Yoshinori Isono, Hiroaki Yanagi
  • Publication number: 20200393168
    Abstract: There is provided a cryocooler including a first compressor, a second compressor, a cold head that has a high pressure port and a low pressure port, a high pressure line that is configured such that a refrigerant gas is able to flow from the first compressor and the second compressor to the high pressure port of the cold head via a merging portion, the high pressure line including a first high pressure sub-line and a second high pressure sub-line, and a low pressure line that is configured such that the refrigerant gas is able to flow from the low pressure port of the cold head to the first compressor and the second compressor via a diverting portion, the low pressure line including a first low pressure sub-line and a second low pressure sub-line.
    Type: Application
    Filed: August 27, 2020
    Publication date: December 17, 2020
    Applicant: SUMITOMO HEAVY INDUSTRIES, LTD.
    Inventor: Toru MARUYAMA