Abstract: A polishing method and a polishing apparatus which can increase a polishing rate and can control a polishing profile of a substrate being polished by adjusting a surface temperature of a polishing pad are disclosed. The polishing method for polishing a substrate by pressing the substrate against a polishing pad on a polishing table includes a pad temperature adjustment step of adjusting a surface temperature of the polishing pad, and a polishing step of polishing the substrate by pressing the substrate against the polishing pad having the adjusted surface temperature. In the pad temperature adjustment step, the surface temperature of a part of an area of the polishing pad, the area being to be brought in contact with the substrate, is adjusted during the polishing step so that the rate of temperature change of a temperature profile in a radial direction of the surface of the polishing pad becomes constant in the radial direction of the polishing pad.

Abstract: According to one aspect, a substrate processing apparatus is provided. The substrate processing apparatus includes a table provided with a substrate holding surface for holding a substrate, a pad for processing the substrate held on the table, a head for holding the pad, an actuator for moving the head in a direction perpendicular to the substrate holding surface of the table, and a mechanical stopper device for stopping a movement of the head in the direction perpendicular to the substrate holding surface.

Abstract: A polishing method and a polishing apparatus which can increase a polishing rate and can control a polishing profile of a substrate being polished by adjusting a surface temperature of a polishing pad are disclosed. The polishing method for polishing a substrate by pressing the substrate against a polishing pad on a polishing table includes a pad temperature adjustment step of adjusting a surface temperature of the polishing pad, and a polishing step of polishing the substrate by pressing the substrate against the polishing pad having the adjusted surface temperature. In the pad temperature adjustment step, the surface temperature of a part of an area of the polishing pad, the area being to be brought in contact with the substrate, is adjusted during the polishing step so that the rate of temperature change of a temperature profile in a radial direction of the surface of the polishing pad becomes constant in the radial direction of the polishing pad.

Abstract: It is an object of the present invention to provide a high-flatness substrate holding table. According to a first aspect, a substrate processing apparatus is provided, and such a substrate processing apparatus includes a table for holding a substrate, a resin film attached to a top surface of the table and a heater provided inside the table, and the top surface of the table is formed of ceramics, the top surface of the table includes an opening connectable to a vacuum source, the resin film is formed of polyimide, and a through hole is formed at a position corresponding to the opening of the table when attached to the top surface of the table.

Abstract: A polishing method and a polishing apparatus which can increase a polishing rate and can control a polishing profile of a substrate being polished by adjusting a surface temperature of a polishing pad are disclosed. The polishing method for polishing a substrate by pressing the substrate against a polishing pad on a polishing table includes a pad temperature adjustment step of adjusting a surface temperature of the polishing pad, and a polishing step of polishing the substrate by pressing the substrate against the polishing pad having the adjusted surface temperature. In the pad temperature adjustment step, the surface temperature of a part of an area of the polishing pad, the area being to be brought in contact with the substrate, is adjusted during the polishing step so that the rate of temperature change of a temperature profile in a radial direction of the surface of the polishing pad becomes constant in the radial direction of the polishing pad.

Abstract: The purpose of the present invention is to establish a novel therapy method for hyperbilirubinemia and therefore, to provide a bilirubin excretion enhancer. The present invention provides a bilirubin excretion enhancer comprising, as an active ingredient, a serum albumin domain II-like protein comprising a serum albumin subdomain IIA. In one embodiment, the serum albumin subdomain IIA has an amino acid sequence of SEQ ID NO: 1. in one embodiment, the serum albumin domain II-like protein is a serum albumin domain II. In one embodiment, the serum albumin domain II comprises the amino acid sequence of SEQ ID NO: 4.

Abstract: There is disclosed an apparatus which can maintain a surface temperature of a polishing pad at a desired target temperature. The apparatus for regulating a surface temperature of a polishing pad, includes: a pad contact member which is contactable with a surface of the polishing pad and which has a heating flow passage and a cooling flow passage formed therein; a heating-liquid supply pipe coupled to the heating flow passage; a cooling-liquid supply pipe coupled to the cooling flow passage; a first flow control valve attached to the heating-liquid supply pipe; a second flow control valve attached to the cooling-liquid supply pipe; a pad-temperature measuring device configured to measure a surface temperature of the polishing pad; and a valve controller configured to operate the first flow control valve and the second flow control valve based on the surface temperature of the polishing pad.

Abstract: A conditioning method which can efficiently produce surface roughness of a polishing pad to obtain an optimum polishing rate by performing dressing while monitoring the surface roughness of the polishing pad and adjusting a temperature of the polishing pad is disclosed. The conditioning method includes measuring surface roughness of the polishing pad during dressing of the polishing pad, comparing the measured surface roughness with preset target surface roughness to obtain comparison result, and adjusting a surface temperature of the polishing pad by heating or cooling the polishing pad based on the comparison result. The surface roughness is represented by at least one of five indexes comprising arithmetical mean deviation of the roughness profile (Ra), root mean square deviation of the roughness profile (Rq), maximum profile valley depth of the roughness profile (Rv), maximum profile peak height of the roughness profile (Rp), and maximum height of the roughness profile (Rz).

Abstract: A compressor includes: a heat exchanger configured to discharge heat generated during compression outside the compressor; a cooling liquid inlet port through which cooling liquid flowing from outside the compressor into the compressor passes; and a cooling liquid outlet port through which the cooling liquid flowing out of the compressor from inside the compressor passes. The compressor is configured such that an operation mode is switchable between a first mode in which the cooling liquid passing through the cooling liquid inlet port flows in the heat exchanger in a predetermined first direction and passes through the cooling liquid outlet port, and a second mode in which the cooling liquid passing through the cooling liquid inlet port flows in the heat exchanger in a second direction opposite to the first direction and passes through the cooling liquid outlet port.

Abstract: A lead frame includes a terminal part having a first side surface formed in a concave curve shape on a lower side from an upper end of the terminal part, and a second side surface formed in a concave curve shape on a lower side from a lower end of the first side surface. The concave curve shape of each of the first and second side surfaces has a depth in a surface direction of the terminal part. A boundary part of the first side surface and the second side surface becomes a protrusion protruding outward. The depth of the concave curve shape of the second side surface is larger than that of the first side surface. A distance between an upper end and a lower end of the second side surface is longer than a distance between an upper end and the lower end of the first side surface.

Abstract: A polishing apparatus capable of stably controlling a pressure in a pressure chamber of a top ring is disclosed. The polishing apparatus includes: a rotatable polishing table for supporting a polishing pad; a rotatable top ring having a pressure chamber for pressing a substrate against the polishing pad; a pressure regulator configured to regulate a pressure of a gas in the pressure chamber; and a buffer tank provided between the pressure chamber and the pressure regulator. The pressure regulator includes a pressure-regulating valve, a pressure gauge configured to measure the pressure of the gas at a downstream side of the pressure-regulating valve, and a valve controller configured to control an operation of the pressure-regulating valve so as to minimize a difference between a target value of the pressure in the pressure chamber and a pressure value measured by the pressure gauge.

Abstract: The present invention relates to a substrate processing apparatus for processing a substrate, such as a wafer, while supplying a cleaning liquid (e.g. pure water and a liquid chemical) to the substrate, and also relates to a pipe cleaning method for the substrate processing apparatus. The substrate processing apparatus includes: a first cleaning lane including first cleaning units (52), (54) each for cleaning a substrate while supplying pure water to the substrate; a second cleaning lane including second cleaning units (60), (62) each for cleaning a substrate while supplying pure water to the substrate; a first pure-water supply pipe (120) for supplying the pure water to the first cleaning lane; and a second pure-water supply pipe (180) for supplying the pure water to the second cleaning lane.

Abstract: The invention simplifies airbag calibration. A pressure calibration jig calibrates pressure to be applied to a plurality of airbags disposed inside a top ring for holding and pressing a wafer against a polishing pad. The pressure calibration jig includes a plurality of first passages capable of communicating with the plurality of airbags, respectively; a second passage which combines and connects the plurality of first passages to a pressure calibration sensor; and a flow control portion configured to allow a fluid to flow through the first passage of the plurality of first passages, which first passage corresponds to an airbag selected for pressure calibration, in a direction from the selected airbag toward the second passage, and also configured to prevent the fluid from flowing through the first passages other than the first passage corresponding to the selected airbag in a direction from the second passage toward the airbags.

Abstract: A polishing apparatus polishes a surface of a substrate by pressing the substrate against a polishing pad on a polishing table. The polishing apparatus is configured to control a temperature of the polishing surface of the polishing pad by blowing a gas on the polishing pad during polishing. The polishing apparatus includes a pad temperature control mechanism having at least one gas ejection nozzle for ejecting a gas toward the polishing pad and configured to blow the gas onto the polishing pad to control a temperature of the polishing pad, and an atomizer having at least one nozzle for ejecting a liquid or a mixed fluid of a gas and a liquid and configured to blow the liquid or the mixed fluid onto the polishing pad to remove foreign matters on the polishing pad. The pad temperature control mechanism and the atomizer are formed into an integral unit.

Abstract: An object of the present invention is to improve a substrate processing apparatus using the CARE method. The present invention provides a substrate processing apparatus for polishing a processing target region of a substrate by bringing the substrate and a catalyst into contact with each other in the presence of processing liquid. The substrate processing apparatus includes a substrate holding unit configured to hold the substrate, a catalyst holding unit configured to hold the catalyst, and a driving unit configured to move the substrate holding unit and the catalyst holding unit relative to each other with the processing target region of the substrate and the catalyst kept in contact with each other. The catalyst is smaller than the substrate.

Abstract: A polishing apparatus polishes a substrate by moving the substrate and a polishing pad relative to each other. The apparatus includes: an elastic modulus measuring device configured to measure an elastic modulus of the polishing pad, and a polishing condition adjustor configured to adjust polishing conditions of the substrate based on a measured value of the elastic modulus. The polishing conditions include pressure of a retaining ring, arranged around the substrate, exerted on the polishing pad and a temperature of the polishing pad.

Abstract: A substrate processing apparatus having a detecting unit that can detect an abnormality of a substrate such as a crack of the substrate or chipping of the substrate is disclosed. The substrate processing apparatus includes a polishing unit configured to polish a substrate, a cleaning unit configured to clean the polished substrate, a substrate abnormality detection unit configured to detect an abnormality of the substrate, and a substrate transporting mechanism configured to transport the substrate in the order of the polishing unit, the substrate abnormality detection unit, and the cleaning unit. The substrate abnormality detection unit includes an imaging device configured to image the substrate, and an output monitoring unit configured to determine a status of the substrate by comparing a signal obtained from the imaging device with a predetermined threshold.

Abstract: A substrate polishing apparatus includes: a polishing table supporting a polishing pad; a top ring configured to press the substrate against the polishing pad; and a pad temperature regulator configured to regulate a surface temperature of the polishing pad. The pad temperature regulator includes a pad contact element and a liquid supply system configured to supply a temperature-controlled liquid to the pad contact element. The pad contact element has a space therein and a partition that divide the space into a first liquid passage and a second liquid passage that are connected in series. At least one baffle substantially perpendicular to a radial direction of the polishing table is provided in each of the first liquid passage and the second liquid passage.

Abstract: Since a compound represented by the general formula (I) (wherein definition of each group is as described in the specification), a salt thereof, a solvate thereof, or a prodrug thereof has strong and sustaining intraocular pressure lowering activity and, further, has no side effect on eyes such as ocular stimulating property (hyperemia, corneal clouding etc.), aqueous humor protein rise etc., it has high safety, and can be an excellent agent for preventing and/or treating glaucoma etc.

Abstract: A substrate transfer hand is configured to sandwich a substrate between a plurality of receiving members and a gripping member and to fix the substrate by moving the gripping member with an actuator. The plurality of receiving members each have a flat plate-shaped support portion mounted on the main hand body, a substrate outer periphery holding portion supported on the support portion and configured to hold an outer periphery of the substrate, and a substrate lower surface holding portion supported on the support portion and configured to hold a lower surface of the substrate. The substrate outer periphery holding portion has a portion provided vertically from the support portion and configured to hold the substrate in contact with the outer periphery of the substrate. The substrate lower surface holding portion has a portion inclined from an outer peripheral side toward an inner side of the substrate to be held.