Abstract: Provided is a method for inspecting a semiconductor device which performs an inspection of a semiconductor device as an object to be inspected, including attaching an adhesive tape to a surface to be inspected of the semiconductor device, acquiring a first pattern image based on a light detected from a region including a surface of the surface to be inspected to which the adhesive tape is attached, inputting an electrical signal to the semiconductor device to which the adhesive tape is attached, acquiring a first heat generation image by detecting light according to heat radiation from the region including the surface to which the adhesive tape is attached in a state in which the electrical signal is input, and superimposing the first pattern image and the first heat generation image.

Abstract: A loose component supply device in which components scattered on stage are imaged by camera. Because the viewing angle of the camera is ?>0, a side surface of the component is imaged. Based on the image data of the component, an index value specifying a size of the side surface of the component is calculated. Then, in a case in which the calculated index value matches a set value, it is determined that it is possible to hold the component. In other words, in a case in which there is a certain distance between multiple components, from imaging a side surface of the component, if an index value that specifies the size of the side surface of the component matches the set value, it is determined that it is possible to hold the component.

Abstract: This ultrasonic inspection device, for inspecting a packaged semiconductor device, is provided with: an ultrasonic transducer which outputs ultrasonic waves to a semiconductor device; a receiver (a reflection detection unit) which detects reflected waves of the ultrasonic waves reflected on the semiconductor device; a stage which moves the positions of the semiconductor device relative to the ultrasonic transducer; a stage control unit which controls driving of the stage; and an analysis unit which analyzes the reaction of the semiconductor device to the input of the ultrasonic waves from the ultrasonic transducer. The stage control unit controls the distance between the semiconductor device and the ultrasonic transducer on the basis of a peak occurring in time waveform of the reflected wave detected by the receiver.

Abstract: A component supply device including a component storage device that stores a plurality of components, a component support member on which the components from the component storage device are dispersed, and a component return device that returns the components on the component support member to the component storage device, is provided. In a case where the necessary number of components exceeds the number of holdable components, return work of the components to the component container and dispersal work of the components to the component support section are carried out prior to holding the components from the component support section by the component holding tool.

Abstract: A loose component supply device including: component support member 150 configured to support multiple components in a scattered state; component collection container 180 configured to collect the components supported on the component support member via an opening in the component collection container; and a container oscillating device configured to scatter the components collected inside the component collection container onto the component support surface by swinging the component collection container such that the opening of the collection container faces the component support member. By this, because components are scattered on the component support member directly form the component collection container, the cycle time is shortened, thereby improving practicality of a component supply device.

Abstract: A component supply device including: a stage configured such that components can be scattered on the stage; a slide device configured to slide the stage; a contacting section configured to contact the component scattered on the stage in accordance with sliding of the stage by the slide device; and a control device configured to control operation of the slide device, wherein the control device includes a determining section configured to determine whether the stage has been slid to a set position when the stage is slid towards the contacting section, and an operation control section configured to control operation of the slide device so as to, in a case in which it is determined by the determining section that the stage has not been slid to the set position, after sliding the stage in a direction away from the contacting section, once again slide the stage towards the contacting section.

Abstract: An image capturing apparatus includes a first mount portion and a first cylindrical member that has a color different from a color of the first mount portion and is disposed in a circumferential direction of the first mount portion, an accessory includes an exterior portion, a second mount portion, and a second cylindrical member having a color different from a color of the second mount portion and similar to a color of the first cylindrical member and disposed in a circumferential direction of the second mount portion, and in a state where the accessory is attached to the image capturing apparatus, reference surfaces of the first mount portion and the second mount portion are in contact with each other, and the first cylindrical member and the second cylindrical member are externally exposed regardless of whether the accessory is attached to or detached from the image capturing apparatus.

Abstract: If the moving direction of a suction nozzle during raising and lowering deviates from a vertical direction, appropriate work cannot be guaranteed because the holding position of a component by the suction nozzle will vary depending on the holding height of the component by the suction nozzle. Thus, a component loaded at a specified height (H) position from the upper surface of a stage is held by a suction nozzle, and that component is loaded at a specified position. Then, the component is imaged and the loading position (first height component loading position) of the component is calculated. Further, the component loaded on the stage is held by the suction nozzle and the component is loaded at the above specified position. Then, the component is imaged and the component loading position (second height component loading position) is calculated. Next, the deviation amount between the first height component loading position and the second height component loading position is calculated.

Abstract: A semiconductor device inspection apparatus is an apparatus for inspecting a semiconductor device which is an object to be inspected based on a result signal which is output in accordance with input of a test pattern signal to the semiconductor device, the apparatus including: an ultrasonic transducer, disposed to face the semiconductor device, which generates ultrasonic waves; a stage for moving a relative position of the semiconductor device and the ultrasonic transducer; a stimulation condition control unit for controlling a condition of stimulation by the ultrasonic waves applied to the semiconductor device; and an analysis unit for generating a measurement image based on the result signal which is output from the semiconductor device.

Abstract: A component supply device, including a stage on which components are scattered; an imaging device configured to image components scattered on the stage; a storage device configured to store first identification information capable of identifying a first component which is a component scheduled to be supplied from the stage and second identification information capable of identifying a second component which is a component not scheduled to be supplied from the stage; and a determination device configured to determine whether the first component is present on the stage based on the first identification information and imaging data from the imaging device, and to determine whether the second component is present on the stage based on the second identification information and imaging data from the imaging device.

Abstract: A component supply device that images stage on which multiple leaded components are supported in a scattered state, and holds a component supported on the stage using a component holding tool based on the image data, wherein multiple stages of different colors are prepared, and a stage from among the multiple stages a stage with a color different to a component that is planned to be supplied is removably attached to component support member. By this, for example, in a case in which a component planned to be supplied is white, by attaching a black stage to the component support section, due to the contrast between the background and the target object, it is possible to clearly recognize the white component supported on the black stage.

Abstract: Provided is a method for inspecting a semiconductor device which performs an inspection of a semiconductor device as an object to be inspected, including attaching an adhesive tape to a surface to be inspected of the semiconductor device, acquiring a first pattern image based on a light detected from a region including a surface of the surface to be inspected to which the adhesive tape is attached, inputting an electrical signal to the semiconductor device to which the adhesive tape is attached, acquiring a first heat generation image by detecting light according to heat radiation from the region including the surface to which the adhesive tape is attached in a state in which the electrical signal is input, and superimposing the first pattern image and the first heat generation image.

Abstract: A loose component supply device including: component support member 150 configured to support multiple components in a scattered state; component collection container 180 configured to collect the components supported on the component support member via an opening in the component collection container; and a container oscillating device configured to scatter the components collected inside the component collection container onto the component support surface by swinging the component collection container such that the opening of the collection container faces the component support member. By this, because components are scattered on the component support member directly form the component collection container, the cycle time is shortened, thereby improving practicality of a component supply device.