Abstract: A signal processing circuit includes an auto gain control circuit and amplifies a signal with an amplification ratio determined based on a synchronous signal level having a positive potential with respect to a black level included in a high definition television video signal. In consequence, during the processing of the high definition television video signal, the signal processing is performed with a desired amplification ratio.

Abstract: The present invention relates to a design support system constructed so as to comprise a manufacturing line information preparation section and an output section. On the basis of element types selected by a selection section as arbitrary element types to be used for constituting a manufacturing line, the manufacturing line information preparation section prepares information about the manufacturing line by means of acquiring information about element types stored in an element type database beforehand. The output section can output the information about the manufacturing line prepared by the manufacturing line information preparation section. A manufacturing line including a plurality of steps is efficiently examined, determined, and established, thereby shortening the time required to design and manufacture the manufacturing line and curtailing manufacturing costs.

Abstract: An apparatus combining a high-speed high-precision characteristic equivalent to that of a die bonder and a flexibility of coping quickly with a process variation and product variation along with size reduction and economics. This apparatus comprises a base unit including a body containing a device to be used in common among a plurality of processes for mounting and assembling parts, a mechanism for conveying a workpiece in a predetermined conveying direction and a mechanism for positioning the workpiece, a dedicated unit including an end effector, and a selected mechanism unit including a mechanism for moving the end effector in two axial directions perpendicular to the predetermined conveying direction to adjust a relative position between the end effector and the workpiece or a part. The moving mechanism is interchangeably attached on the base unit, and the end effector is interchangeably attached on the moving mechanism.

Abstract: There are provided a solder ball deforming step of mechanically deforming a ball to break an oxide film of a surface thereof and to expose a nonoxide surface and a solder melting step of heating and melting the deformed solder ball through energy irradiation in a state where the deformed solder ball is mounted on joint units of a loaded work. The solder ball deforming step mechanically deforms the solder ball to form at least two orthogonal contact surfaces in contact with the joint surfaces of the joint units.

Abstract: A video signal processing circuit is supplied with an analog composite video signal formed by combining at least a luminance signal with a sync signal, and processes the analog composite video signal. The video signal processing circuit has an analog filter which removes high-frequency components from the analog composite video signal, a sync separation circuit which separates a sync signal from an output signal from the analog filter, an AD converter which performs AD conversion on the analog composite video signal, and a digital video signal processing circuit which performs predetermined video signal processing on the composite video signal digitized by the AD converter, by using the sync signal obtained by the sync separation circuit.

Abstract: A deodorant which is suitable for removal of various odors in daily life, especially for removing a chemical odor remaining in the hair after a permanent wave treatment. It less irritates the hair and skin and is suitable for incorporation into a shampoo, treatment agent, etc. The deodorant contains a deodorizing ingredient selected among the following (a) to (d): (a) a hydroxy acid salt of a divalent metal (b) a fatty acid salt of a divalent metal (c) an oxide of a divalent metal and a hydroxy acid, fatty acid, or chelating agent (d) an inorganic acid salt of a divalent metal and a hydroxy acid, fatty acid, or chelating agent.

Abstract: A body has a configuration in which a first ellipse has a first and second focal points and a second ellipse having a third and fourth points are arranged such that the second and third focal points coincide. This body is equivalent to an optical system having an optical path in which light gathered to the first focal point passes through the first focal point, and is reflected by a first concave reflecting surface, being a part of the first ellipse, to go through the second focal point, and then reflected by a second concave reflecting surface, being a part of the second ellipse, to be gathered to the fourth focal point.

Abstract: In a method of producing a micro-actuator, a first adhesive is applied to a movable plate, and a movable, and a movable electrode is placed on the first adhesive. A second adhesive is applied to the movable electrode, and a piezoelectric element is placed on the second adhesive. Next, a third adhesive is applied to an actuator base, a base electrode is placed on the third adhesive, and the third adhesive is semi-cured in the same manner as above. A fourth adhesive is applied to the base electrode, the piezoelectric element is placed on the fourth adhesive, and the fourth adhesive is semi-cured in the same manner as above. Finally, the adhered laminate thus obtained is placed into a heating furnace and heated at a predetermined temperature for a predetermined period of time to thereby fully cure the adhesives.

Abstract: A treatment agent for animal fiber protection which comprises an aqueous solution containing divalent metal ions or a divalent metal salt. The treatment agent prevents hair and animal fiber damage associated with permanent wave treatments, bleaching treatments, etc.

Abstract: A head assembly is provided with a mounting surface, and an integrated circuit chip which is mounted on the mounting surface and processes signals. The integrated circuit chip is covered by a layer which prevents generation of foreign particles from the integrated circuit chip by the provision of the layer.

Abstract: A head assembly is provided with a mounting surface, and an integrated circuit chip which is mounted on the mounting surface and processes signals. The integrated circuit chip is covered by a layer which prevents generation of foreign particles from the integrated circuit chip by the provision of the layer.

Abstract: The present invention relates to a design support system constructed so as to comprise a manufacturing line information preparation section and an output section. On the basis of element types selected by a selection section as arbitrary element types to be used for constituting a manufacturing line, the manufacturing line information preparation section prepares information about the manufacturing line by means of acquiring information about element types stored in an element type database beforehand. The output section can output the information about the manufacturing line prepared by the manufacturing line information preparation section. A manufacturing line including a plurality of steps is efficiently examined, determined, and established, thereby shortening the time required to design and manufacture the manufacturing line and curtailing manufacturing costs.

Abstract: The present invention provides an apparatus combining a high-speed high-precision characteristic equivalent to that of a die bonder and a flexibility of coping quickly with a process variation and product variation along with size reduction and economics. This apparatus comprises a base unit including a body containing a device to be used in common among a plurality of processes for mounting and assembling parts, a mechanism for conveying a workpiece in a predetermined conveying direction and a mechanism for positioning the workpiece, a dedicated unit including an end effector, and a selected mechanism unit including a mechanism for moving the end effector in two axial directions perpendicular to the predetermined conveying direction to adjust a relative position between the end effector and the workpiece or a part. The moving mechanism is interchangeably attached on the base unit, and the end effector is interchangeably attached on the moving mechanism.

Abstract: In a method of producing a micro-actuator, a first adhesive is applied to a movable plate, and a movable electrode is placed on the first adhesive. A second adhesive is applied to the movable electrode, and a piezoelectric element is placed on the second adhesive. Next, a third adhesive is applied to an actuator base, a base electrode is placed on the third adhesive, and the third adhesive is semi-cured in the same manner as above. A fourth adhesive is applied to the base electrode, the piezoelectric element is placed on the fourth adhesive, and the fourth adhesive is semi-cured in the same manner as above. Finally, the adhered laminate thus obtained is placed into a heating furnace and heated at a predetermined temperature for a predetermined period of time to thereby fully cure the adhesives.

Abstract: A method of bonding a piezoelectric element and an electrode, including the steps of forming a first coating of a material selected from the group consisting of Au, Al, Zn, Cu, and Sn on a bonding surface of the piezoelectric element, and forming a second coating of a material selected from the group consisting of Au, Al, Zn, Cu, and Sn on a bonding surface of the electrode. The combination of the materials of the first and second coatings is preferably Au/Au, Au/Al, Zn/Cu, or Sn/Cu. The method further includes the step of bringing the first and second coatings into close contact with each other and heating them under pressure to form a metallic bond or intermetallic compound between the first and second coatings, thereby bonding the piezoelectric element and the electrode.

Abstract: In a method of producing a micro-actuator, a first adhesive is applied to a movable plate, and a movable electrode is placed on the first adhesive. The movable plate and the movable electrode are clamped between a first stage and a first head, followed by heating for a first predetermined period of time while exerting a first predetermined press load onto the first head to semi-cure the first adhesive. A second adhesive is applied to the movable electrode, and a piezoelectric element is placed on the second adhesive. The movable plate, the movable electrode and the piezoelectric element are clamped between the first stage and a second head, followed by heating for a second predetermined period of time while exerting a second predetermined press load onto the second head to semi-cure the second adhesive. Next, a third adhesive is applied to an actuator base, a base electrode is placed on the third adhesive, and the third adhesive is semi-cured in the same manner as above.

Abstract: In a method of producing a micro-actuator, a first adhesive is applied to a movable plate, and a movable electrode is placed on the first adhesive. The movable plate and the movable electrode are clamped between a first stage and a first head, followed by heating for a first predetermined period of time while exerting a first predetermined press load onto the first head, to semi-cure the first adhesive. A second adhesive is applied to the movable electrode, and a piezoelectric element is placed on the second adhesive. The movable plate, the movable electrode and the piezoelectric element are clamped between the first stage and a second head, followed by heating for a second predetermined period of time while exerting a second predetermined press load onto the second head to semi-cure the second adhesive. Next, a third adhesive is applied to an actuator base, a base electrode is placed on the third adhesive, and the third adhesive is semi-cured in the same manner as above.

Abstract: A first plate material is set on a work stage. The first plate material includes first components commonly connected to a first connection member. A second plate material is subsequently set on the work stage. The second plate material includes second components commonly connected to a second connection member. The second components are superposed on the corresponding first components. The first components as well as the second components can be handled as a one-piece component. It leads to an improved productivity. Heat surfaces of a heat block contact the second components. The connection members are prevented from thermal expansion. The constant intervals are reliably maintained between the adjacent first components and the adjacent second components.

Abstract: A method of bonding a piezoelectric element and an electrode, including the steps of forming a first coating of a material selected from the group consisting of Au, Al, Zn, Cu, and Sn on a bonding surface of the piezoelectric element, and forming a second coating of a material selected from the group consisting of Au, Al, Zn, Cu, and Sn on a bonding surface of the electrode. The combination of the materials of the first and second coatings is preferably Au/Au, Au/Al, Zn/Cu, or Sn/Cu. The method further includes the step of bringing the first and second coatings into close contact with each other and heating them under pressure to form a metallic bond or intermetallic compound between the first and second coatings, thereby bonding the piezoelectric element and the electrode.

Abstract: A body has a configuration in which a first ellipse has a first and second focal points and a second ellipse having a third and fourth points are arranged such that the second and third focal points coincide. This body is equivalent to an optical system having an optical path in which light gathered to the first focal point passes through the first focal point, and is reflected by a first concave reflecting surface, being a part of the first ellipse, to go through the second focal point, and then reflected by a second concave reflecting surface, being a part of the second ellipse, to be gathered to the fourth focal point.