Abstract: A method of bonding a piezoelectric element and an electrode, including the steps of forming a first coating of a material selected from the group consisting of Au, Al, Zn, Cu, and Sn on a bonding surface of the piezoelectric element, and forming a second coating of a material selected from the group consisting of Au, Al, Zn, Cu, and Sn on a bonding surface of the electrode. The combination of the materials of the first and second coatings is preferably Au/Au, Au/Al, Zn/Cu, or Sn/Cu. The method further includes the step of bringing the first and second coatings into close contact with each other and heating them under pressure to form a metallic bond or intermetallic compound between the first and second coatings, thereby bonding the piezoelectric element and the electrode.

Abstract: An apparatus and method for improving the underfill filling of a semiconductor chip element 100 which is ultrasonically bonded to and mounted on a circuit board. A semiconductor chip element 100 includes a silicon chip 101 and a group of stud bumps 117 formed on a bottom surface 101a of the chip 101. Signal stud bumps 113 are made of gold while power stud bumps 114, ground stud bumps 115 and dummy stud bumps 116 are all made of a gold-palladium alloy, which are harder than the signal stud bumps 113 and thus do not deform easily during ultrasonic treatment. Therefore, in a state in which the semiconductor chip element 100 is mounted, a gap of approximately 30 &mgr;m is maintained between the bottom surface 101a of the chip 100 and a top surface of the circuit board 120 on which the semiconductor chip element 100 is mounted.

Abstract: A suspension of a head assembly provided in a disk apparatus is prevented from being deformed due to mounting of a head IC chip onto the suspension. The head IC chip mounted on the suspension has protruding electrodes made of gold. The suspension has electrode pads connected to the respective protruding electrodes of the head IC chip. Each of the electrode pads has a surface layer made of gold. The protruding electrodes of the head IC chip are bonded to the electrode pads of the suspension by ultrasonic bonding.

Abstract: An apparatus and method for improving the underfill filling of a semiconductor chip element 100 which is ultrasonically bonded to and mounted on a circuit board. A semiconductor chip element 100 includes a silicon chip 101 and a group of stud bumps 117 formed on a bottom surface 101a of the chip 101. Signal stud bumps 113 are made of gold while power stud bumps 114, ground stud bumps 115 and dummy stud bumps 116 are all made of a gold-palladium alloy, which are harder than the signal stud bumps 113 and thus do not deform easily during ultrasonic treatment. Therefore, in a state in which the semiconductor chip element 100 is mounted, a gap of approximately 30 &mgr;m is maintained between the bottom surface 101a of the chip 100 and a top surface of the circuit board 120 on which the semiconductor chip element 100 is mounted.

Abstract: A method of assembling a micro-actuator is provided in which a base frame having a plurality of actuator bases is placed on a stage, a first adhesive is applied to each of the actuator bases, and a base electrode frame having a plurality of base electrodes is placed on the first adhesive. The first adhesive is semi-cured by heating and pressing. A second adhesive is applied to each of the base electrodes, and a plurality of piezoelectric elements are placed on the second adhesive. The second adhesive is semi-cured by heating and pressing. A third adhesive is,applied to the piezoelectric elements, and a movable electrode frame having a plurality of movable electrodes is placed on the third adhesive. The third adhesive is semi-cured by heating and pressing. Next, a fourth adhesive is applied to each of the movable electrodes, and a hinge plate frame having a plurality of hinge plates is placed on the fourth adhesive. The fourth adhesive is semi-cured by heating and pressing.

Abstract: A method of bonding a piezoelectric element and an electrode, including the steps of forming a first coating of a material selected from the group consisting of Au, Al, Zn, Cu, and Sn on a bonding surface of the piezoelectric element, and forming a second coating of a material selected from the group consisting of Au, Al, Zn, Cu, and Sn on a bonding surface of the electrode. The combination of the materials of the first and second coatings is preferably Au/Au, Au/Al, Zn/Cu, or Sn/Cu. The method further includes the step of bringing the first and second coatings into close contact with each other and heating them under pressure to form a metallic bond or intermetallic compound between the first and second coatings, thereby bonding the piezoelectric element and the electrode.

Abstract: A head assembly has a head slider including a magnetic head and a first electrode, an IC chip supporting the head slider on a principal surface of the IC chip, and a suspension supporting the IC chip, the IC chip comprising a second electrode and a third electrode on the principal surface thereof, the third electrode being connected to the suspension, the second electrode being electrically connected to the first electrode.

Abstract: A method of assembling a micro-actuator is provided in which a base frame having a plurality of actuator bases is placed on a stage, a first adhesive is applied to each of the actuator bases, and a base electrode frame having a plurality of base electrodes is placed on the first adhesive. The first adhesive is semi-cured by heating and pressing. A second adhesive is applied to each of the base electrodes, and a plurality of piezoelectric elements are placed on the second adhesive. The second adhesive is semi-cured by heating and pressing. A third adhesive is applied to the piezoelectric elements, and a movable electrode frame having a plurality of movable electrodes is placed on the third adhesive. The third adhesive is semi-cured by heating and pressing. Next, a fourth adhesive is applied to each of the movable electrodes, and a hinge plate frame having a plurality of hinge plates is placed on the fourth adhesive. The fourth adhesive is semi-cured by heating and pressing.

Abstract: In a method of producing a micro-actuator, a first adhesive is applied to a movable plate, and a movable electrode is placed on the first adhesive. The movable plate and the movable electrode are clamped between a first stage and a first head, followed by heating for a first predetermined period of time while exerting a first predetermined press load onto the first head to semi-cure the first adhesive. A second adhesive is applied to the movable electrode, and a piezoelectric element is placed on the second adhesive. The movable plate, the movable electrode and the piezoelectric element are clamped between the first stage and a second head, followed by heating for a second predetermined period of time while exerting a second predetermined press load onto the second head to semi-cure the second adhesive. Next, a third adhesive is applied to an actuator base, a base electrode is placed on the third adhesive, and the third adhesive is semi-cured in the same manner as above.

Abstract: The present invention relates to a data processing device which is also used as an interface device for connecting an external storage device to a host computer to which a card form of storage device can be connected, the external storage device differing in data format from the card form of storage device. The data processing device includes a connection unit for connecting the external storage device to the host computer, the connection unit being able to be removably fitted into a slot which is provided in the host computer and into which to removably fit the card form of storage device, and a converting circuit for converting data, which is to be outputted from the host computer in a data format conforming to the card form of storage device, into a data format conforming to the external storage device, as well as for converting data read out from the external storage device into the data format conforming to the card form of storage device.

Abstract: An external peripheral device connects through a flexible cable to an electrical connector which connects to a computer system. The flexible cable wraps around a cable wrap member that protrudes out of the peripheral device's housing, and the electrical connector snaps into a connector holder built into the peripheral device's housing. The cable wrap member and the connector holder permit the secure storage of the flexible cable and electrical connector during non-use or transportation of the device.

Abstract: The present invention relates to a data processing device which is also used as an interface device for connecting an external storage device to a host computer to which a card form of storage device can be connected, the external storage device differing in data format from the card form of storage device. The data processing device includes a connection unit for connecting the external storage device to the host computer, the connection unit being able to be removably fitted into a slot which is provided in the host computer and into which to removably fit the card form of storage device, and a converting circuit for converting data, which is to be outputted from the host computer in a data format conforming to the card form of storage device, into a data format conforming to the external storage device, as well as for converting data read out from the external storage device into the data format conforming to the card form of storage device.

Abstract: The invention provides a shelf-life extender for upholding the freshness of food, such as meat, vegetables, fruits, etc., in retail packages or in a refrigerator for an extended period of time. An isothiocyanic acid compound is supported on a matrix such as a natural mucilaginous polysaccharide or a solid organic acid and the supported compound is packaged in synthetic resin film or nonwoven fabric. The invention further provides an aqueous gel composition comprising a specified surfactant, an isothiocyanic acid compound, and a gelling agent and a hydrophobic gel composition comprising a specified hydrophobic dispersion medium, an isothiocyanic acid compound, and a gelling agent.

Abstract: The freshness of meat, vegetables and fruits in a refrigerator or food storage box can be retained for a long period of time by using (1) a freshness retaining gel composition which comprises a freshness retainer component comprising an isothiocyanic acid compound and an aliphatic carboxylic acid or (2) a freshness retaining gel composition which comprises a freshness retainer component comprising an isothiocyanic acid compound, a nonionic surfactant or a fatty acid ester, and a gelling agent.

Abstract: Disclosed is a variable gain semiconductor circuit enjoying a low insertion loss, good distortion characteristic, and large variable gain range. The variable gain semiconductor circuit comprises: a first kind of variable gain circuit that inputs an input signal and changes a gain on the basis of a first control signal; a second kind of variable gain circuit, installed in a stage succeeding the first kind of variable gain circuit, for changing a gain on the basis of a second control signal; and a control signal producing unit for producing the first and second control signals using an attenuation value control signal. When the attenuation value control signal falls within one of two variation ranges instructing a large gain, the control signal producing unit produces the first and second control signals so that the first kind of variable gain circuit decreases a gain according to the variation of the attenuation value control signal, and the second kind of variable gain circuit produces a constant gain.

Abstract: A servo pattern for controlling a head position has a first pattern in which two frequency signals having respectively different frequencies are arranged alternately in the width direction of a track in a two-track cycle, and a second pattern which is repeated in a cycle of n tracks. The first and the second patterns are arranged in the longitudinal direction of the tracks so as to create a servo pattern with a wide servo capture range and so as also to ensure accurate detection.

Abstract: A soldering apparatus wherein lead pins of a part inserted from above in through-holes of a printed circuit board are soldered to the through-holes from below. The soldering apparatus comprises a solder supplying nozzle, a preliminary heating nozzle and a flux nozzle. Each of the nozzles has an opening and a pair of slits formed to extend downwardly from the opening. The nozzles are moved upwardly and downwardly in a Z direction by respective elevators and are moved and positioned in X and Y directions by a moving table. A printed circuit board to which a lead part to be soldered is temporarily fastened is disposed on the nozzles.

Abstract: A servo pattern arrangement for controlling the position of a head has a first pattern, in which two frequency signal having different frequencies are arranged alternately in the width direction of a track in a two-track cycle. The servo pattern arrangement also has a second pattern which is repeated in a cycle of n tracks. The first and the second patterns are arranged in the longitudinal direction of the tracks so as to create a servo pattern arrangement with a wide servo capture range and so as to also ensure accurate detection.

Abstract: An electric rotary machine which prevents problems involved in leakage flux, and reduces the number of components so that it becomes thin and small in size, and inexpensive. The machine includes a first pulse generating device generating a first frequency generating signal consisting of P1 uniformly spaced pulses per one revolution of the rotor by detecting a counterelectromotive voltage induced in a rotary magnetic field generating device while a driving magnet is rotating, a magnetic body producing magnetic flux during rotation of the rotor, a second pulse generating device generating a second frequency generating signal consisting of P2 uniformly spaced pulses per one revolution of the rotor by detecting changes in the magnetic flux of the magnetic body, and an index position detecting circuit generating an index signal on the basis of a periodic phase difference between the first and second frequency generating signals.