Abstract: The present matching circuit chip has an integrated shape comprising a first transmission line, a second transmission line and a third transmission line, wherein one end of the first transmission line, one end of the second transmission line and one end of the third transmission line are connected to one another, a first filter connection terminal is connected to the other end of the first transmission line, an antenna terminal is connected to the other end of the second transmission line, and a second filter connection terminal is connected to the other end of the third transmission line, whereby the second transmission line converts the characteristic impedances of the first and third transmission lines so that the impedance matching between the antenna terminal and the first filter connection terminal can be attained, and so that the impedance matching between the antenna terminal and the second filter connection terminal can be attained.

Abstract: The present matching circuit chip has an integrated shape comprising a first transmission line, a second transmission line and a third transmission line, wherein one end of the first transmission line, one end of the second transmission line and one end of the third transmission line are connected to one another, a first filter connection terminal is connected to the other end of the first transmission line, an antenna terminal is connected to the other end of the second transmission line, and a second filter connection terminal is connected to the other end of the third transmission line, whereby the second transmission line converts the characteristic impedances of the first and third transmission lines so that the impedance matching between the antenna terminal and the first filter connection terminal can be attained, and so that the impedance matching between the antenna terminal and the second filter connection terminal can be attained.

Abstract: A multilayer ceramic device improves device functionality, reduces overall device size and profile, makes manufacturing easier, and improves reliability. A first ceramic layer has a first multilayer circuit pattern electrically connected through via holes. Also, a second ceramic layer has a second multilayer circuit pattern electrically connected through via holes. A thermosetting resin sheet is disposed between the first and second ceramic layers.

Abstract: A solid-state imaging device includes photoelectric conversion portions set in a two-dimensional array; charge readout portions each provided adjacent to each of the photoelectric conversion portions; charge transfer portions each provided adjacent to each of the photoelectric conversion portions; and, charge transfer electrodes spaced apart from each other through a separation portion separated from the opening portion, each of which is also a charge readout electrode, provided with an opening portion over the corresponding one of the photoelectric conversion portions, and formed so as to cover, through an insulation film, the corresponding one of the photoelectric conversion portions, charge readout portions, charge transfer portions, and their peripheral portions.

Abstract: A high-frequency switch has a first transmission-reception switching circuit for selectively switching between the signal transfer between an antenna terminal and a first transmitting-circuit terminal and the signal transfer between the antenna terminal and a first receiving-circuit terminal; a second transmission-reception switching circuit for selectively switching between the signal transfer between the antenna terminal and a second transmitting-circuit terminal and the signal transfer between the antenna terminal and a second receiving-circuit terminal; a first diplexer disposed between the antenna terminal and the first transmission-reception switching circuit and between the antenna terminal and the second transmission-reception switching circuit; and a second diplexer connected to the second receiving-circuit terminal to selectively switch the signal transfer between the second receiving-circuit terminal and a third receiving-circuit terminal and the signal transfer between the second receiving-cir

Abstract: A laminated filter includes: a first dielectric layer 2101a having a first shield electrode on one principal plane; a second dielectric layer 2101b having resonator electrodes on one principal plane; a third dielectric layer 2101c having a coupling electrode provided facing part of the above-described resonator electrodes; a fourth dielectric layer 2101d having a second shield electrode on one principal plane; a fifth dielectric layer 2101d whose at least one principal plane is exposed outside; and a grounding electrode 2108 provided on the other principal plane of the above-described dielectric layer and/or the above-described one principal plane of the above-described fifth dielectric layer, and the above-described first grounding electrode and the above-described first shield electrode are electrically connected through a via hole 2109 provided in the above-described first dielectric layer.

Abstract: A notch filter made up from laminated dielectric, which attenuates a specific frequency of a signal to be transmitted, comprises two terminals for input or output a signal to be transmitted, a line connected between those terminals, two resonators each having one end connected to ground and an other end, two first coupling capacitors, and a second coupling capacitor. Each end of the line is connected to the other end of the resonator through the first capacitor. The second capacitor couples said two resonators each other.

Abstract: A dielectric filter includes resonator electrodes, an inter-stage coupling capacitor electrode, and an input/output coupling capacitor electrode on dielectric substrates, respectively. The resonator electrodes are electro-magnetically coupled to each other to form a tri-plate structure, are made of a metallic foil embedded in a resonator dielectric substrate. Another dielectric filter includes an upper shield electrode dielectric substrate, an inter-stage coupling capacitor dielectric substrate, a resonator dielectric substrate, and an input/output coupling capacitor dielectric substrate which are made of a composite dielectric material including a high-dielectric-constant material and a low-dielectric-constant material. The above described arrangement provides the dielectric filter with an improved Q factor of a resonator, a low loss, and a high attenuation.

Abstract: A high frequency switch, has

Abstract: A dielectric filter, has

Abstract: A high frequency switch, has a transmitting terminal; a receiving terminal; an antenna terminal; a first diode having an anode electrically connected to the transmitting terminal and a cathode electrically connected to the antenna terminal; a second diode having an anode connected through a transmission line of ¼ wavelength to the antenna terminal which is electrically connected to the receiving terminal, and having the side of a cathode grounded; and a control terminal provided to a node between the transmitting terminal and the first anode, wherein the first and second diodes have a tradeoff relationship between ON resistance thereof and capacitance between the anode and the cathode, and the ON resistance of the first diode is lower than the ON resistance of the second diode, and the capacitance of the second diode in the OFF state is smaller than the capacitance of the first diode in the OFF state.

Abstract: By using a method for manufacturing a dielectric laminated device, an opening is formed on a first dielectric sheet, a strip line and an input and output line including an input and output electrode are formed by burying electrode materials in said opening, the first dielectric sheet is laminated with the second and third dielectric sheets disposed above and below respectively to form a laminate, a first and second shield electrodes and a ground electrode are formed, an end of the strip line is connected to the ground electrode, the first shield electrode and the second shield electrode are mutually connected through the ground electrode, and the input and output electrode is exposed along the line direction of the strip line. By this constitution of the above dielectric laminated device, the mounting reliability of the dielectric laminated device can be further increased.

Abstract: A high-frequency filter device includes at least one filter to be connected to a high-frequency stage of a wireless apparatus. The filter includes a voltage-controlled variable frequency resonance element which is made of a resonance element and a voltage-controlled variable impedance element electrically connected to the resonance element. The high-frequency filter device includes a control section for controlling a voltage applied to the variable impedance element, and a signal monitoring section for outputting a control signal, with which the voltage is controlled, to the control section based on frequency data as to an oscillating frequency of a local oscillator of the wireless apparatus. The signal monitoring section controls a band frequency of the at least one filter based on the frequency data in such a manner that the band frequency is adaptively changed.

Abstract: A multilayer ceramic device improves device functionality, reduces overall device size and profile, makes manufacturing easier, and improves reliability. A first ceramic layer has a first multilayer circuit pattern electrically connected through via holes. Also, a second ceramic layer has a second multilayer circuit pattern electrically connected through via holes. A thermosetting resin sheet is disposed between the first and second ceramic layers. The thermosetting resin sheet has through holes filled with a conductive paste for electrically connecting one of multiple circuit pattern layers in the first ceramic layer with one of multiple circuit pattern layers in the second ceramic layer.

Abstract: A diplexer capable of passing signals of a high frequency band without being attenuated over a wide frequency band, and a high-frequency switch using the diplexer are provided. The diplexer includes a low-pass filter 82 having a parallel resonant circuit formed by a first capacitor C1 and a first inductor L1 and a serial resonant circuit formed by a second capacitor C2 and a second inductor L2. With this structure, two attenuation poles are provided in the low-pass filter 82. Thus, a passband of a high-pass filter 83 can be widened.

Abstract: A high frequency switch having a plurality of signal paths for four frequency bands, the high frequency switch, has

Abstract: A layered body of mounting a SAW filter, at least has

Abstract: An RF device, has a first substrate made of a material with a lower relative dielectric constant and having a high frequency circuit formed therein or on a surface thereof; and

Abstract: A small in-band-flat-group-delay type dielectric filter having low-loss characteristics with a small amplitude deviation and uniform-group-delay frequency characteristics is obtained, which enables broad-band characteristics to be obtained easily. The in-band-flat-group-delay type dielectric filter includes a plurality of dielectric coaxial resonators, a coupling circuit comprising a combination of reactive elements, with which the dielectric coaxial resonators are coupled to one another, and input/output terminals connected to ends of the coupling circuit. The dielectric coaxial resonators coupled to the input/output terminals are allowed to have a different characteristic impedance from that of the inter-stage dielectric coaxial resonators.

Abstract: The present invention provides a small and low loss laminated bandpass filter by placing two strip lines 313 and 314 that form a resonator in a certain distance on the same layer and thereby electromagnetically coupling these strip lines.